Abstract: A suction nozzle includes a suction pad portion at a tip of an air pipe formed to be larger than the air pipe, in which a resistance cavity which causes resistance and decreases air flow speed when a positive pressure is applied is formed between a flow path and a cavity portion. In the suction nozzle, since the resistance cavity is formed, a positive pressure is applied by the air whose flow speed is suppressed and the suction release of the component is performed. The resistance cavity may be a cavity having a slit shape.

Abstract: A reading device including an identification information reading device which reads the identification information, a holding device which holds an identification information application member, a moving device which moves the holding device relative to the identification information reading device, and a control device which controls operations of the identification information reading device, the holding device, and the moving device. The control device causes the holding device to move using the moving device such that at least a portion of the holding region in which the holding device holds the identification information application member is a reading region to move the identification information application member and is configured to perform a first reading process which carries out a reading process of the identification information using the identification information in a state in which holding of the identification information application member using the holding device is released.

Abstract: A solder supply device provided with solder cup 70 housing liquid solder that is cylindrical and open at one end, and supply nozzle 74 that is inserted into the solder cup, that supplies solder from inside the solder cup by moving the solder cup by supplying air to space 86, wherein a fixed amount of air is supplied in a case in which the solder cup movement distance is less than a specified distance, and a greater amount of air than the above specified amount is supplied in a case in which the solder cup movement distance is the set movement distance or greater. That is, when supplying solder, in a case in which the volume of the space to which air is supplied is a specified volume or greater, a greater amount of air is supplied than the air supply amount for when the volume of the space is a specified volume or less.

Abstract: Solder supply device includes solder cup that is tubular and open at one end, nozzle section for ejecting solder from the solder cup, flange section that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state. The elastic force arising between the outer edge section of the flange section and the solder cup is smaller than the holding force of the nozzle section by the inner tube.

Abstract: A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

Abstract: A mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached, and a second raising and lowering drive section 34 that raises and lowers the suction nozzle only of the syringe member to which the suction nozzle is attached. The mounting device controls a raising and lowering operation of the first raising and lowering drive section based on height information that includes at least one of information of the thickness of the component and information of the height of a board. With the mounting device, it is possible to move the entire syringe member to which the suction nozzle 28 is attached to a position closer to the board in accordance with the height of the board and the thickness of the component.

Abstract: A data conversion device capable of generating data necessary for manufacturing electrical device from three-dimensional data using an additive manufacturing, and an additive manufacturing system which performs layered shaping using post-conversion data are provided. A layer information generation section detects members which are included in three-dimensional data and generates layer information for each of the detected members with respect to the three-dimensional data of an electronic device. A layer data division section generates layer data in which the members which are included in the layer information are divided into layer thicknesses which can be shaped using an additive manufacturing. A unit determination section generates unit information which relates to units to be shaped based on the layer data. A control content determination section generates control data which is control information of the units which perform the shaping based on the unit information and the layer data.

Abstract: When a board to be produced is switched, it is possible to automatically discharge an unnecessary carrier tape 100 without detaching a feeder. For this, a control device 15 of a component mounting apparatus 10 includes: a component determination section S106 which determines a component not to be used in production of the next board when boards to be produced by the component mounting apparatus 10 are switched, and a discharge instruction section 110 which sends an instruction of discharging a carrier tape 100 which accommodates a component determined not to be used in the production of the next board by the component determination section S106 to a tape insertion port 21d.

Abstract: A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

Abstract: A mounting device mounts components on a board, and performs processing of arranging discard components discarded based on a captured image on a discard loading section. A CPU of a management computer acquires an identification image in which it is possible to identify a discard component to be discarded and a captured image of the discard component, links the acquired identification image of the discard component and the captured image of the discard component, and creates a discard component arrangement image screen that includes an arrangement display area in which the identification images are arranged based on an order in which the discard components were arranged on discard loading section. The CPU of management computer then outputs the created discard component arrangement image screen.

Abstract: The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Abstract: A CPU box of each mounting machine module obtains MAC addresses of communication devices of both an internal device and a base by communicating with the communication devices of both the internal device and the base after the power is turned on, compares the obtained MAC address of the internal device side and the obtained MAC address of the base side, with storage data of the MAC addresses of both the internal device side and the base side read from a non-volatile storage medium of the CPU box, obtains management data of the mounting machine module stored in association with the MAC address of the internal device side from the non-volatile storage medium of a management computer in a case where the MAC address of the internal device side does not match the storage data, and obtains the management data of the mounting machine module stored in association with the MAC address of the base side from the non-volatile storage medium of the management computer in a case where the MAC address of the base side does n

Abstract: A component mounting device head unit includes a head main body, a nozzle being provided on the head main body, a drive source, a cover, and a heat transfer member. The nozzle is configured to pick up a component. The drive source is configured to transfer moving power to at least one of the head main body and the nozzle. The cover covers the drive source. The heat transfer member connects the cover to the drive source or a frame of the drive source, and the heat transfer member is configured to allow heat generated by the drive source to escape to the cover.

Abstract: The present invention includes a tape peeling mechanism provided with a peeling member configured to enter a leading end surface in a feeding direction of fed component supply tape made from carrier tape and cover tape so as to peel the cover tape from the carrier tape, enabling a component to be supplied from at a component supply position, wherein the peeling member is displaced upwards after entering the leading end surface of the carrier tape as the component supply tape is fed. Accordingly, cover tape is reliably peeled without damaging components, and changeover work on the leading end of the component supply tape is not required.

Abstract: A solder supply system that judges whether a solder cup is set on a solder supply device. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by a barcode reader is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside an outer tube is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside the outer tube.

Abstract: A component mounting machine includes a board conveyance device, a component supply device, a component transfer device which includes a mounting head and a head driving mechanism, and a mounting order control device. The component mounting machine partitions a long printed circuit board of a length exceeding a mounting station into a plurality of mounting areas, sequentially positions each mounting area in the mounting station, and mounts the electronic components. The mounting order control device performs control to change the mounting order of the electronic components.

Abstract: A feeder maintenance apparatus that acquires feeder information from a feeder which is mounted on a feeder mounting section, and controls a cleaning section to clean a sprocket section of the feeder, a feeding roller, a first gear mechanism, and a second gear mechanism, based on the feeder information. The feeder maintenance apparatus controls lubricant supply sections to supply a lubricant to a driving section of the feeder based on the acquired feeder information.

Abstract: When a mounting head is moved upward of a rear side conveyor across and over a front side conveyor after a component suction operation, it is determined whether or not there is a possibility that a component sucked by a suction nozzle may interfere with a component mounted on a circuit board on the front side conveyor. When so determined, a head lifting mechanism is caused to lift up the mounting head to a position where the component sucked by the suction nozzle does not interfere with the mounted component. Thereafter, the mounting head is moved upward of the rear side conveyor, and the head lifting mechanism is caused to lower down the mounting head to an initial height position. Thereafter, the component is mounted on a circuit board on the rear side conveyor.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Abstract: Provided is an electronic component supply system determining the types of electronic components installed on component pallets at a time when the electronic components are installed on the component pallets for installation, which determines the types of the electronic components installed on the component pallets based on planned multiple jobs continuously performed by multiple electronic component mounting machines to which the component pallets are attached and an execution order for the jobs such that the number of the component pallets exchanged during job switching is minimized.