Abstract: A board conveyance device provided with multiple engaging sections that engage with a circuit board. When the conveyance direction is a first direction and the board is large, a claw out of two claws is set to a stopping state. A shuttle is moved up to the movement end on the downstream side in the first direction and two arms rotate. A lever rotates accompanying rotation of a rotating body to a disengaged position by a lever rotating section of a stopping device and an arm unit is able to be disconnected from a moving body. An arm holding section engages with an engaging section to prevent movement in the x direction. The moving body is moved in a second direction with the arm unit held by the stopping device. The claw is set to be in the stopping state and is not used in conveyance of the board.

Abstract: In a mounting system including multiple mounting machines, there is provided a mounting system that is capable of reducing the number of measurement devices that measure electrical characteristics of an electronic component. A control device controls a switching device in order to connect a measurement device and a mounting machine that transmitted request information for measuring the electrical characteristics of the electronic component. When transmitting an instruction for starting measurement to the measurement device and receiving a characteristic measurement value from the measurement device, the control device transfers the received characteristic measurement value to the mounting machine that transmitted request information.

Abstract: A feeder includes a discharge guide member which is provided on a feeder main body to communicate with a tape discharging section and guides such that a carrier tape which is discharged from the tape discharging section heads downward, a peeling member which is provided on the feeder main body and peels a cover tape from the carrier tape before the carrier tape which is conveyed by a front side sprocket reaches the tape discharging section, and a contacting and positioning member which is provided on the feeder main body, causes the cover tape which covers the carrier tape which is conveyed by the front side sprocket to contact the peeling member, and positions the carrier tape from which the cover tape is peeled and which is discharged from the tape discharging section at a regular position inside the discharge guide member.

Abstract: An electronic circuit component mounting machine including a suction nozzle lowered by a first linear motor and a second linear motor by two stages A drive circuit of the second linear motor includes a reaction force detecting section and a damage detecting section that detects damage of an electronic circuit component. A controller that controls the drive circuit includes an appropriate operation parameter determining section that determines an appropriate value of an operation parameter of the second linear motor using the reaction force detecting section and the damage detecting section.

Abstract: A nozzle section is held by a nozzle holder to be vertically movable, and the nozzle section is biased downwards by springs. A height position reference section for which image recognition is possible is provided on an outer circumferential section of the nozzle section. Both a component held on the lower end of the nozzle section and the height position reference section are in the field of view of a camera that captures a side view image of an area around the lower end of the nozzle section. The side view image is processed, the height position reference section and a height position of the lower end of the component are recognized, a height difference from the height position reference section to the lower end of the component is measured, and it is determined whether the pickup orientation of the component is acceptable based on the height difference.

Abstract: An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.

Abstract: A component mounting apparatus sets a position that is offset with respect to a suction reference position of a component toward the front side in a feeding direction as a suction position based on a difference between a dimension of the recess-shaped cavity in the Y-direction and a dimension of the component accommodated in the cavity in the Y-direction and sucks the component. Therefore, even if the component in the cavity positionally deviates toward the front side in the feeding direction due to inertia when a carrier tape is stopped, a suction nozzle sucks an appropriate position of the component.

Abstract: The present invention of an electrostatic coupling type contactless electric power supply device 1 has multiple electrodes for contactless electric power supply 41 and a high-frequency power source circuit 5 provided on a fixed section 2, multiple electrodes for contactless electric power reception 61 and an electric power reception circuit 7 on a movable section 3, wherein the electrode for contactless electric power supply 41 and the electrode for contactless electric power reception 61 have base sections 441, 611 with a perpendicular cross sectional shape to the moving direction of the movable section 3 and there are multiple extending tooth sections 412, 612, and fellow tooth sections 412, 612 are mutually alternating and separated to fit together in an interdigitated array electrode, furthermore, the electrode for contactless electric power reception 61 is an interdigitated array electrode with the outer surface of the tooth section 612 covered with a conducting layer 613 and the tooth section 612 intern

Abstract: With an atmospheric pressure plasma generating device of the present invention, nozzle block 36 in which fourth gas passages 66 from which plasma gas is emitted are formed, is covered by cover 22, and through-hole 70 is formed in the cover such that the leading end of the fourth gas passage is positioned on the inside. Heated gas is supplied inside the cover. Thus, heated gas is emitted from the through-hole of the cover, and plasma gas is emitted so as to penetrate the heated gas. By the plasma gas being surrounded by the heated gas in this manner, deactivation of the plasma gas is prevented. Also, distance X between the leading end of the fourth gas passage and an opening of the through-hole at an outer wall of the cover is set from 0 to 2 mm in an emission direction of the plasma gas. By this, it is possible to appropriately cover plasma gas with heated gas without obstructing the flow of the plasma gas.

Abstract: A reel holding device is provided. The device includes: a case which accommodates the plurality of component supply reels to be aligned in a direction of a reel axial line; outer circumferential support members which are built between two sides walls of the case, and support outer circumferences of the multiple component supply reels to be rotatable; and a deviation preventing member which prevents the component supply reels from deviating from the outer circumferential support members. At least one of the outer circumferential support members and the deviation preventing member is an integrated rod-like member which is built between the two side walls.

Abstract: The assembling machine is provided with fiducial marks which are attached to a defined position on a moving head, and an image processing section which recognizes the holding state of the component by the holding member based on high resolution data which is generated by super-resolution processing which uses a plurality of items of image data. The image processing section includes a displacement amount calculation section which calculates each displacement amount of imaging positions of other items of image data in relation to the imaging position of reference data, a positioning processing section which performs the positioning of the other items of image data in relation to the reference data, and a reconstruction processing section which generates the high resolution data based on the plurality of items of image data which are positioned.

Abstract: A production management computer totals the data of the component pickup operation quantity of the suction nozzle and the pickup error quantity sent from control device of each component mounter for each type of component, and calculates the ratio of the pickup quantity or the ratio of the pickup error quantity with respect to the component pickup operation quantity of the suction nozzle for each type of component as a component pickup rate. Here, production management computer separately calculates an after-feeder-setting component pickup rate, a main component pickup rate, a near-tape-trailing-end component pickup rate, and an after-splicing component pickup rate as component pickup rates for each type of component.

Abstract: A board inspection machine includes a earner conveyance device that loads, positions and unloads a carrier member on which multiple individual boards are placed, solder paste being printed arid a component being mounted on the individual boards; a board lifting-up device that lifts up the individual board, and a flatness inspection device that inspects flatness of the lifted individual board and determines usability oi the individual board. As the multiple individual boards are sequentially lifted by the board lifting-up device and the flatness can be sequentially inspected by the flatness inspection device, efficient inspection may he performed. In addition, since full inspection is performed with respect to the flatness of the multiple individual boards, quality of the individual board may be improved.

Abstract: Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20. Jet motor 26 that drives the pump is provided outside flow tank 20, and cooling device 30 is provided between flow tank 20 and jet motor 26. Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52, flows along cooling pipe 52, and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20. The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26, thus lowering the temperature of jet motor 26. Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

Abstract: A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

Abstract: A revolving nozzle station and a revolving drive device that revolves the revolving nozzle station are housed inside a cassette case of a cassette-type nozzle exchanging unit. In an outer circumferential portion of the revolving nozzle station, multiple nozzles for exchange with a nozzle of component mounter are arranged radially along a revolution path, and the nozzles are held in a detachable manner. A nozzle exchange port is formed in a top end surface of cassette case, and nozzle exchange is performed between the revolving nozzle station and a mounting head of the component mounter through the nozzle exchange port. A shutter mechanism which opens and closes the nozzle exchange port is provided in the cassette case.

Abstract: A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism.

Abstract: A component orientation determination data creation device for creating component orientation determination data used in a component orientation determination system that determines an orientation of the component by comparing a brightness value of a determination region specified in the component orientation determination data within an image of the component captured by a camera with a determination threshold. A difference image between an image of the component in a correct orientation and an image of the component in another orientation is calculated by acquiring multiple images of the component in different orientations by changing the orientation with respect to the camera of the component that is the target for the component orientation determination data creation.

Abstract: A component attachment apparatus picks up a first component supplied to supply position of a first stick feeder with a head, assembles the first component and a second component by inserting a lead of the first component held by the head into an insertion hole of the second component supplied to supply position of a second stick feeder, and then attaches the assembly to a board. Therefore, in comparison with a case where the first component attached to the second component after the second component is attached to the board, it is possible to stably attach the components to the board with low influence of warping of the board.

Abstract: An electronic component mounting machine is provided with a film thickness gage. The film thickness gage is provided with measurement sections. The mounting head moves to a position above the storage section and lowers the film thickness gage to cause the film thickness gage to come into contact with the flux film. In the film thickness gage, the measurement sections form measurement marks corresponding to the film thickness in the flux film. The electronic component mounting machine images the measurement marks using a mark camera, and determines the film thickness of the flux film which is actually formed based on imaging data.