Patents Assigned to Fujifilm Electronic Materials U.S.A., Inc.
  • Patent number: 10889757
    Abstract: The present disclosure is directed to etching compositions that are useful, e.g., for selectively removing tantalum (Ta) and/or tantalum nitride (TaN) from a semiconductor substrate as an intermediate step in a multistep semiconductor manufacturing process.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: January 12, 2021
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventor: Atsushi Mizutani
  • Patent number: 10875965
    Abstract: This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 29, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Ognian Dimov, Raj Sakamuri
  • Patent number: 10808145
    Abstract: Polishing compositions that can selectively and preferentially polish certain dielectric films over other dielectric films are provided herein. These polishing compositions include either cationic or anionic abrasives based on the target dielectric film to be removed and preserved. The polishing compositions utilize a novel electrostatic charge based design, where based on the charge of the abrasives and their electrostatic interaction (forces of attraction or repulsion) with the charge on the dielectric film, various material removal rates and polishing selectivities can be achieved.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: October 20, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventor: Abhudaya Mishra
  • Patent number: 10793676
    Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 6, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 10787628
    Abstract: The present disclosure is directed to non-corrosive cleaning compositions that are useful, e.g., for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: September 29, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Thomas Dory, Emil A. Kneer, Tetsuya Kamimura
  • Patent number: 10781341
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted linear alkenyl group and a substituted or unsubstituted linear alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: September 22, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ognian Dimov
  • Patent number: 10773210
    Abstract: The present disclosure is directed to methods of purifying solvents. The purified solvents can be used for cleaning a semiconductor substrate in a multistep semiconductor manufacturing process.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: September 15, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Jack Helzer, Yuan Chen, Pejman Ahmadiannamini
  • Patent number: 10763119
    Abstract: This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion and a hydrophilic portion; in which the hydrophobic portion includes a C12 to C40 hydrocarbon group and is separated by zero to ten alkylene oxide groups from the hydrophilic portion. The polishing composition has a pH of about 2 to about 6.5, and can have a ratio of a removal rate for a silicon oxide to a removal rate for a silicon nitride of at least about 3:1 when polishing a patterned wafer comprising at least silicon nitride patterns overlayed with at least silicon oxide.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: September 1, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Carl Ballesteros, Abhudaya Mishra, Eric Turner
  • Patent number: 10759970
    Abstract: This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C12 to C40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of about 2 to about 6.5.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: September 1, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Eric Turner, Abhudaya Mishra, Carl Ballesteros
  • Patent number: 10752867
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH2; 3) at least one aminoalcohol; 4) at least one corrosion inhibitor; 5) at least one water soluble organic solvent; 6) water; and 7) optionally, at least one pH adjusting agent.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: August 25, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Thomas Dory, Mick Bjelopavlic, Joshua Guske, Kazutaka Takahashi
  • Publication number: 20200266080
    Abstract: A container for containing a raw material of a chemical liquid and a method of preparing a container are provided. The container at least includes an inner wall and solvent-treated surface of the inner wall. The method of preparing a container includes treating a surface of the inner wall with water and treating the surface the inner wall with an organic solvent.
    Type: Application
    Filed: January 22, 2020
    Publication date: August 20, 2020
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie
  • Patent number: 10711159
    Abstract: The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 14, 2020
    Assignee: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
    Inventor: James McDonough
  • Patent number: 10702893
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one water soluble organic solvent; 3) at least one metal-containing additive; 4) at least one cyclic amine, and 5) water.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 7, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Joseph Gregory McAlpin, Thomas Dory
  • Patent number: 10703937
    Abstract: The disclosure provides chemical mechanical polishing compositions and methods for polishing polysilicon films with high removal rates. The compositions include 1) an abrasive; 2) at least one compound of structure (I): 3) at least one compound of structure (II): and 4) water; in which the composition does not include tetramethylammonium hydroxide or a salt thereof. The variables n, R1-R7, X, Y, and Z1-Z3 in structures (I) and (II) are defined in the Specification. The synergistic effect of the compounds of structures (I) and (II) in these chemical mechanical polishing compositions leads to high polysilicon films material removal rate during polishing.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 7, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Alexei P. Leonov, Abhudaya Mishra
  • Patent number: 10696932
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 30, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Patent number: 10696933
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 5) at least one quaternary ammonium hydroxide; and 6) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: June 30, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Tomonori Takahashi, Bing Du, William A. Wojtczak, Thomas Dory, Emil A. Kneer
  • Patent number: 10676646
    Abstract: A slurry that polishes surfaces or substrates which includes cobalt. The slurry further comprises an anionic and/or cationic surfactant, each of which has a phosphate group, a long chain alkyl group, or both. The slurry also includes a corrosion inhibitor, abrasives, removal rate enhancers, solvents, pH adjustors, and chelating agents. The pH of the slurry is preferably 8 or higher.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: June 9, 2020
    Assignee: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
    Inventors: Yannan Liang, Liqing Wen, Bin Hu, Hyosang Lee, Shu-Wei Chang, Sung Tsai Lin
  • Publication number: 20200156013
    Abstract: A chemical liquid manufacturing apparatus is provided. The manufacturing apparatus at least includes an ion exchange medium and an ion adsorption medium configured downstream from the ion exchange medium. A material of the ion adsorption medium includes a resin material having an amide bond or an imide bond. A manufacturing method of a chemical liquid using the apparatus is also provided.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 21, 2020
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Yuan Chen, Jack W. Helzer, Pejman Ahmadiannamini
  • Publication number: 20200129884
    Abstract: A chemical liquid manufacturing apparatus is provided. The manufacturing apparatus includes at least one filtration medium selected from an ion exchange medium and an ion medium, and a temperature control unit configured to control the temperature of a material to be processed by the at least one filtration medium. A method of manufacturing a chemical liquid using the apparatus is also provided.
    Type: Application
    Filed: October 23, 2019
    Publication date: April 30, 2020
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Bryan Hinzie, Marcia Cole-Yocom
  • Patent number: 10626353
    Abstract: This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, water soluble sulfones, and water soluble ethers; 3) at least one boron-containing compound selected from the group consisting of boric acid, boronic acids, and salts thereof; and 4) water.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 21, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Emil A. Kneer, Yasuo Sugishima