Abstract: The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.

Abstract: In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.

Abstract: The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holder and engaging with the abrasive plate; a first O-ring being provided between the fixed engaging member and the abrasive plate; a second O-ring being provided between the plate holder and the abrasive plate; and a fluid supply-discharge mechanism for supplying a fluid to and discharging the same from a zone enclosed by the abrasive plate, the plate holder and the second O-ring. An outer circumferential face of the abrasive plate is separated from an inner circumferential face of the fixed engaging member.

Abstract: Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate and a second abrading process in which the pressure of the cylinder chamber is readjusted in order to to apply second pressure which is higher than the first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

Abstract: The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holder and engaging with the abrasive plate; a first O-ring being provided between the fixed engaging member and the abrasive plate; a second O-ring being provided between the plate holder and the abrasive plate; and a fluid supply-discharge mechanism for supplying a fluid to and discharging the same from a zone enclosed by the abrasive plate, the plate holder and the second O-ring. An outer circumferential face of the abrasive plate is separated from an inner circumferential face of the fixed engaging member.

Abstract: The work piece feeding machine is capable of correctly and efficiently setting a work piece in a through-hole of a carrier. The work piece feeding machine comprises a positioning unit detecting amount of displacement of the work piece with respect to the through-hole and correcting the position of the work piece in the through-hole. The positioning unit includes: a lighting source section provided on the work piece side or the carrier side, the lighting source section throwing polarized light on the work piece and the carrier; a camera provided on the carrier side or the work piece side, the camera receiving the polarized light from the lighting source section so as to catch images of an outer edge of the work piece and an inner edge of the through-hole in a visual field thereof; and an image processing section measuring the amount of displacement on the basis of positions of the outer edge and the inner edge.

Abstract: In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.

Abstract: The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding unit for holding a work piece. In the holding unit, an inner head has a first concave section. An outer head has a second concave section. A holding plate is provided in the first concave section. An elastic holding member forms a first chamber. An outer enclosing member is provided to the outer head. An inner enclosing member is provided between the outer enclosing member and the inner head. A pressing member presses the abrasive face of the abrasive plate and encloses the holding plate. An elastic ring member a second chamber. A pressurizing unit pressurizes the chambers so as to press the work piece and the pressing member onto the abrasive face.

Abstract: The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided to a predetermined position of the carrier plate rotating at predetermined rotational speed; positioning the carrier plate on the basis of a position of the detected mark; conveying the carrier plate to a wafer adhering section with keeping a posture of the carrier plate which has been positioned in the positioning step; and adhering the wafer at a prescribed position of the carrier plate.

Abstract: The heat exchanger of the present invention is capable of easily adjusting temperature of a machining liquid, e.g., slurry, etching liquid. The heat exchanger of the present invention, which adjusts temperature of the machining liquid, comprises a ceramic heat exchanging tube, which is made by baking silicon carbide (SiC).

Abstract: The method of the present invention is capable of abrading a work piece with fixed load. The method comprises: a first abrading process, in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted so as to apply first pressure to the work piece via the upper abrasive plate without applying full weight of the upper abrasive plate; and a second abrading process, in which the pressure of the cylinder chamber is readjusted so as to apply second pressure, which is higher than the first pressure, to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.

Abstract: The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.

Abstract: The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding unit for holding a work piece. In the holding unit, an inner head has a first concave section. An outer head has a second concave section. A holding plate is provided in the first concave section. An elastic holding member forms a first chamber. An outer enclosing member is provided to the outer head. An inner enclosing member is provided between the outer enclosing member and the inner head. A pressing member presses the abrasive face of the abrasive plate and encloses the holding plate. An elastic ring member a second chamber. A pressurizing unit pressurizes the chambers so as to press the work piece and the pressing member onto the abrasive face.

Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.

Abstract: A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

Abstract: A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

Abstract: A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.

Abstract: An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.