Patents Assigned to Fukuda Metal Foil & Powder Co., Ltd.
  • Patent number: 6440599
    Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent a rise in temperature and explosion so that it may assure the safety and reliability of the battery, when, the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like in such a completely closed battery. A closed battery of the present invention is provided with a closing member serving as a valve chip, which is composed of a metal substrate 1 in which a valve element 5 is provided and defined by a break line 3, and a metal foil 2 adhered to the inner surface of the metal substrate 1.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: August 27, 2002
    Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
  • Patent number: 6423440
    Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent itself from temperature rising and exploding so that in such a completely closed battery it may assure the safety and reliability thereof, when the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like. A valve element 5 is provided with a slit 3 between the circumference thereof and a metal substrate 1. When the internal pressure of a battery is elevated, the valve element 5 is smoothly raised up together with a metal foil 2 from a bending fulcrum portion 4 to thereby cut a lead wire 6 or permit a braze portion 8 to detach from the lead wire 6, thus disconnecting the current reliably.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: July 23, 2002
    Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
  • Patent number: 6419811
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: July 16, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Publication number: 20020085943
    Abstract: The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.
    Type: Application
    Filed: June 12, 2001
    Publication date: July 4, 2002
    Applicant: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kanichi Tanaka, Kensuke Hidaka
  • Publication number: 20020017395
    Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.
    Type: Application
    Filed: April 12, 2001
    Publication date: February 14, 2002
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Masaru Hirose, Masasto Takami
  • Publication number: 20020011418
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low rougheness and produce a high adhesive strength to such resin base materials as polymide resin which is weak in adhesive strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or a copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one of the following rust-proofing treatments—chromate treatment, organic rust-proofing treatment and silane coupling agent treatment.
    Type: Application
    Filed: April 12, 2001
    Publication date: January 31, 2002
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Patent number: 6336953
    Abstract: The present invention relates to a method for preparing metal powder by means of blowing a cooling liquid toward a flowing down melt metal flow characterized that the cooling liquid is successively discharged downwardly from an annular nozzle toward the melt metal flow for surrounding it in the form of a hyperboloid of one sheet, wherein the annular nozzle is provided with a hole through which the melt metal flow may pass, and that the hyperboloid of one sheet has a pressure reduced by 50˜750 mmHg at the neighborhood of the constricted part inside the hyperboloid of one sheet. According to the present invention, there may be prepared fine and sherical metal powder which has a narrow range of a particle size distribution.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: January 8, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Masato Kikukawa, Shigemasa Matsunaga, Tsuneta Inaba, Osamu Iwatsu, Tohru Takeda
  • Publication number: 20010004855
    Abstract: There is provided a ball mill having a milling chamber into which metal powder is fed. The ball mill is also provided with milling means for milling metal powder into fine metal powder having a particle size less than a predetermined size. When the ball mill operates, a quantity of heat (Qo) is generated in the milling chamber. The milling chamber is cooled by liquid cooling means and gas cooling means according to the present invention. The liquid cooling means causes cooling liquid to flow along the outside wall of the milling chamber to remove a quantity of heat (Q1) during the ball mill operation. The gas cooling means causes cooling gas to flow through the milling chamber to remove a quantity of heat (Q2) during the ball mill operation. The generated quantity of heat (Qo) can be counterbalanced with the sum of the removed quantities of heat (Q1) and (Q2) so as to prevent the inside of the milling chamber from overheating, so that the ball mill can operate in the condition of Qo/V≧0.
    Type: Application
    Filed: December 22, 2000
    Publication date: June 28, 2001
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD
    Inventors: Takeshi Fukuda, Kensuke Hidaka, Tamiho Mizutani, Motonori Nishida, Yoshio Kohira
  • Patent number: 6231742
    Abstract: In a process for the production of an electrolytic copper foil from a sulfurically acidic copper sulfate electrolytic solution, the sulfurically acidic copper sulfate electrolytic solution contains additives of 0.1 to 1.0 g/l of an oxyethylenic surfactant, 50 to 250 mg/l of a chloride, 1 to 10 mg/l of a glue or gelatin and 1 to 10 mg/l of a nitrogen-containing organic compound.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: May 15, 2001
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Yasushi Sano, Kazuo Miyamae, Katsunori Yamada, Hisanori Manabe
  • Patent number: 6196480
    Abstract: There is provided a ball mill having a milling chamber into which metal powder is fed. The ball mill is also provided with milling means for milling metal powder into fine metal powder having a particle size less than a predetermined size. When the ball mill operates, a quantity of heat (Q0) is generated in the milling chamber. The milling chamber is cooled by liquid cooling means and gas cooling means according to the present invention. The liquid cooling means causes cooling liquid to flow along the outside wall of the milling chamber to remove a quantity of heat (Q1) during the ball mill operation. The gas cooling means causes cooling gas to flow through the milling chamber to remove a quantity of heat (Q2) during the ball mill operation. The generated quantity of heat (Q0) can be counterbalanced with the sum of the removed quantities of heat (Q1) and (Q2) so as to prevent the inside of the milling chamber from overheating, so that the ball mill can operate in the condition of Q0/V≧0.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: March 6, 2001
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Takeshi Fukuda, Kensuke Hidaka, Tamiho Mizutani, Motonori Nishida, Yoshio Kohira
  • Patent number: 5905004
    Abstract: The primary object of the present invention is to provide an electrode for an alkali secondary battery, the electrode being capable of exhibiting high binding power and showing a high electrical conductivity without use of a binder. An electrode for an alkali secondary battery, the electrode comprising a molded product molded from a mixture containing an active material-containing powder and a flaky nickel powder which has lowered strain.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: May 18, 1999
    Assignees: Director General, Agency of Industrial Science & Technology, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Tetsuo Sakai, Itsuki Uehara, Hiroshi Yoshinaga, Masasi Wada
  • Patent number: 5843243
    Abstract: A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content "X" and an oxygen content "Y" satisfy the following relationships; namely: 0.ltoreq."X".ltoreq.0.5, 0.ltoreq."Y".ltoreq.0.05, and "Y".gtoreq.(-0.8)("X")+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.
    Type: Grant
    Filed: February 14, 1996
    Date of Patent: December 1, 1998
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Minoru Kawasaki, Noboru Takayanagi, Hiromi Nomura, Akio Sato, Isaka Kanazawa, Kensuke Hidaka, Shozo Nagai
  • Patent number: 5817194
    Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: October 6, 1998
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kensuke Hidaka, Kanichi Tanaka, Yoshinobu Yagita, Osamu Kajita
  • Patent number: 5700362
    Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).
    Type: Grant
    Filed: June 19, 1996
    Date of Patent: December 23, 1997
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Masami Yano, Masato Takami
  • Patent number: 5567534
    Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed, circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt be electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: October 22, 1996
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Masami Yano, Masato Takami
  • Patent number: 5425822
    Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel. 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: June 20, 1995
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Kensuke Hidaka, Kanichi Tanaka, Yoshio Kohira, Hideshi Yamaguchi, Yoshinao Suzuki, Masahiro Nakagawa, Yoshio Fuwa, Kazuhiko Mori, Yoshihiko Ito, Atsushi Taguchi
  • Patent number: 5356528
    Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
    Type: Grant
    Filed: April 1, 1993
    Date of Patent: October 18, 1994
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara
  • Patent number: 5338619
    Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
    Type: Grant
    Filed: August 4, 1992
    Date of Patent: August 16, 1994
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara
  • Patent number: 5314659
    Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel, 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness, wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.
    Type: Grant
    Filed: May 15, 1992
    Date of Patent: May 24, 1994
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Kensuke Hidaka, Kanichi Tanaka, Yoshio Kohira, Hideshi Yamaguchi, Yoshinao Suzuki, Masahiro Nakagawa, Yoshio Fuwa, Kazuhiko Mori, Yoshihiko Ito, Atsushi Taguchi
  • Patent number: 5304428
    Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.
    Type: Grant
    Filed: February 2, 1993
    Date of Patent: April 19, 1994
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventor: Masato Takami