Patents Assigned to Fukuda Metal Foil & Powder Co., Ltd.
  • Patent number: 6799608
    Abstract: There is an object to provide a technique of forming a proper abrasion resistance layer by a thermal spraying and fusing of a self fluxing alloy. The object may be solved by cutting the pipe body along a curved face that is perpendicular to a plane including a central axis of the pipe body and that extends not to cross the inlet hole and the outlet hole but to include a part of the central axis. Thus the pipe body is divided into a first partitioned part having at least one of the inlet hole and the outlet hole, and a second partitioned part. An abrasion resistance layer is then formed on the inner surface of at least the outer bent portion of the pipe body by a thermal spraying and fusing of a self fluxing alloy. Thereafter, the first partitioned part is fitted into the second partitioned part for welding to obtain a bent pipe according to the present invention.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: October 5, 2004
    Assignees: Fukuda Metal Foil & Powder Co., Ltd., Japan Overlay Industries Co., Ltd.
    Inventors: Hiroshi Koshika, Shinichi Nishimura
  • Patent number: 6737187
    Abstract: A closed battery which is capable of rapidly releasing the internal pressure there while simultaneously disconnecting the current to prevent the internal temperature of the battery from rising and causing the battery to explode. Thus, when the internal pressure of the closed battery is elevated due to a short circuit, overcharge, reverse charge, or the like, internal gas in the battery can be safely discharged and the battery prevented from bursting.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: May 18, 2004
    Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
  • Patent number: 6696017
    Abstract: The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: February 24, 2004
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kanichi Tanaka, Kensuke Hidaka
  • Patent number: 6616727
    Abstract: The present invention relates to a method of preparing porous metal powder, a starting metal being oxidized and then reduced followed by that the obtained block metal body is milled. According to the present invention, the starting metal is oxidized in the presence of chlorine and/or chloride. The present block metal body after reduction has prismatic particles complicatedly entangled like a root so that the pore of the metal powder is open.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: September 9, 2003
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Tadashi Koyama, Yoshiro Arami, Masato Kikukawa, Osamu Iwatsu, Yasuhiko Hashimoto
  • Patent number: 6585033
    Abstract: The invention provides a process for producing vanadium alloy foil suitable as a membrane in a hydrogen-refining unit. A vanadium alloy comprising 5 to 25% by weight of at least one selected from the group consisting of Ni, Co, Mo, Fe and Ag, 0.01 to 5% by weight of at least one selected from the group consisting of Ti, Zr and Y, and the balance being V is used. A melt of the vanadium alloy is prepared by use of a crucible 1 having slit 3 in the bottom, a roll 2 comprising a cylinder whose central axis is arranged to be parallel to the slit is rotated, the melt is jetted from the slit 3 to the roll surface 5, the melt is jetted from the slit 3 is rapidly cooled, and the vanadium alloy solidified on the roll surface 5 is continuously exfolitated from the roll surface 5 to obtain the foil.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: July 1, 2003
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Motonori Nishida, Akira Takagi, Toshiki Ohnishi, Osamu Kajita
  • Patent number: 6524723
    Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: February 25, 2003
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Masaru Hirose, Masasto Takami
  • Publication number: 20020157806
    Abstract: The invention provides a process for producing vanadium alloy foil suitable as a membrane in a hydrogen-refining unit.
    Type: Application
    Filed: February 19, 2002
    Publication date: October 31, 2002
    Applicant: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Motonori Nishida, Akira Takagi, Toshiki Ohnishi, Osamu Kajita
  • Publication number: 20020139510
    Abstract: A high-performance, long-lasting, and inexpensive sheet-type regenerative heat exchanger suitable for a refrigerator for achieving low temperature cooling, and a regenerator or a refrigerator using the same are provided. The sheet-type regenerative heat exchanger includes a very thin sheet-like holding base, and at least one layer of numerous granules such as balls, chips, and fine particles having a relatively uniform particle size bonded to one or both surfaces of the sheet-like holding base. An alignment substrate may be used for bonding the granules in alignment to the sheet-like holding base. Alternatively, numerous minute holes may be drilled in the sheet-like holding base at intermediate positions between adjacent small apertures formed in the alignment substrate, for enhancing gas flow efficiency.
    Type: Application
    Filed: June 13, 2001
    Publication date: October 3, 2002
    Applicant: ECTI and FUKUDA METAL FOIL & POWDER CO., LTD
    Inventor: Yoshihiro Ishizaki
  • Patent number: 6440599
    Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent a rise in temperature and explosion so that it may assure the safety and reliability of the battery, when, the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like in such a completely closed battery. A closed battery of the present invention is provided with a closing member serving as a valve chip, which is composed of a metal substrate 1 in which a valve element 5 is provided and defined by a break line 3, and a metal foil 2 adhered to the inner surface of the metal substrate 1.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: August 27, 2002
    Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
  • Patent number: 6423440
    Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent itself from temperature rising and exploding so that in such a completely closed battery it may assure the safety and reliability thereof, when the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like. A valve element 5 is provided with a slit 3 between the circumference thereof and a metal substrate 1. When the internal pressure of a battery is elevated, the valve element 5 is smoothly raised up together with a metal foil 2 from a bending fulcrum portion 4 to thereby cut a lead wire 6 or permit a braze portion 8 to detach from the lead wire 6, thus disconnecting the current reliably.
    Type: Grant
    Filed: November 9, 1999
    Date of Patent: July 23, 2002
    Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
  • Patent number: 6419811
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: July 16, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Publication number: 20020085943
    Abstract: The present invention relates to a Ni-base brazing alloy. The alloy has a good wettability toward a material to be brazed when melting, an excellent corrosion resistance and a high strength. The alloy is used for process of joining two pieces of metal such as stainless steel. The alloy contains Cr in an mount of 25 to 35% by weight, P in an amount of 4 to 8% by weight, Si in an amount of 3 to 6% by weight, wherein the total amount of P and Si is 9 to 11.5% by weight, at least one selected from a group consisting of Al, Ca, Y and misch metal in an amount of 0.01 to 0.10% by weight, and the balance of Ni and unavoidable impurities.
    Type: Application
    Filed: June 12, 2001
    Publication date: July 4, 2002
    Applicant: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shozo Nagai, Kanichi Tanaka, Kensuke Hidaka
  • Publication number: 20020017395
    Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.
    Type: Application
    Filed: April 12, 2001
    Publication date: February 14, 2002
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Masaru Hirose, Masasto Takami
  • Publication number: 20020011418
    Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low rougheness and produce a high adhesive strength to such resin base materials as polymide resin which is weak in adhesive strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or a copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one of the following rust-proofing treatments—chromate treatment, organic rust-proofing treatment and silane coupling agent treatment.
    Type: Application
    Filed: April 12, 2001
    Publication date: January 31, 2002
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Hisanori Manabe, Masasto Takami, Masaru Hirose
  • Patent number: 6336953
    Abstract: The present invention relates to a method for preparing metal powder by means of blowing a cooling liquid toward a flowing down melt metal flow characterized that the cooling liquid is successively discharged downwardly from an annular nozzle toward the melt metal flow for surrounding it in the form of a hyperboloid of one sheet, wherein the annular nozzle is provided with a hole through which the melt metal flow may pass, and that the hyperboloid of one sheet has a pressure reduced by 50˜750 mmHg at the neighborhood of the constricted part inside the hyperboloid of one sheet. According to the present invention, there may be prepared fine and sherical metal powder which has a narrow range of a particle size distribution.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: January 8, 2002
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Masato Kikukawa, Shigemasa Matsunaga, Tsuneta Inaba, Osamu Iwatsu, Tohru Takeda
  • Publication number: 20010004855
    Abstract: There is provided a ball mill having a milling chamber into which metal powder is fed. The ball mill is also provided with milling means for milling metal powder into fine metal powder having a particle size less than a predetermined size. When the ball mill operates, a quantity of heat (Qo) is generated in the milling chamber. The milling chamber is cooled by liquid cooling means and gas cooling means according to the present invention. The liquid cooling means causes cooling liquid to flow along the outside wall of the milling chamber to remove a quantity of heat (Q1) during the ball mill operation. The gas cooling means causes cooling gas to flow through the milling chamber to remove a quantity of heat (Q2) during the ball mill operation. The generated quantity of heat (Qo) can be counterbalanced with the sum of the removed quantities of heat (Q1) and (Q2) so as to prevent the inside of the milling chamber from overheating, so that the ball mill can operate in the condition of Qo/V≧0.
    Type: Application
    Filed: December 22, 2000
    Publication date: June 28, 2001
    Applicant: FUKUDA METAL FOIL & POWDER CO., LTD
    Inventors: Takeshi Fukuda, Kensuke Hidaka, Tamiho Mizutani, Motonori Nishida, Yoshio Kohira
  • Patent number: 6231742
    Abstract: In a process for the production of an electrolytic copper foil from a sulfurically acidic copper sulfate electrolytic solution, the sulfurically acidic copper sulfate electrolytic solution contains additives of 0.1 to 1.0 g/l of an oxyethylenic surfactant, 50 to 250 mg/l of a chloride, 1 to 10 mg/l of a glue or gelatin and 1 to 10 mg/l of a nitrogen-containing organic compound.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: May 15, 2001
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Yasushi Sano, Kazuo Miyamae, Katsunori Yamada, Hisanori Manabe
  • Patent number: 6196480
    Abstract: There is provided a ball mill having a milling chamber into which metal powder is fed. The ball mill is also provided with milling means for milling metal powder into fine metal powder having a particle size less than a predetermined size. When the ball mill operates, a quantity of heat (Q0) is generated in the milling chamber. The milling chamber is cooled by liquid cooling means and gas cooling means according to the present invention. The liquid cooling means causes cooling liquid to flow along the outside wall of the milling chamber to remove a quantity of heat (Q1) during the ball mill operation. The gas cooling means causes cooling gas to flow through the milling chamber to remove a quantity of heat (Q2) during the ball mill operation. The generated quantity of heat (Q0) can be counterbalanced with the sum of the removed quantities of heat (Q1) and (Q2) so as to prevent the inside of the milling chamber from overheating, so that the ball mill can operate in the condition of Q0/V≧0.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: March 6, 2001
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Takeshi Fukuda, Kensuke Hidaka, Tamiho Mizutani, Motonori Nishida, Yoshio Kohira
  • Patent number: 5905004
    Abstract: The primary object of the present invention is to provide an electrode for an alkali secondary battery, the electrode being capable of exhibiting high binding power and showing a high electrical conductivity without use of a binder. An electrode for an alkali secondary battery, the electrode comprising a molded product molded from a mixture containing an active material-containing powder and a flaky nickel powder which has lowered strain.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: May 18, 1999
    Assignees: Director General, Agency of Industrial Science & Technology, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Tetsuo Sakai, Itsuki Uehara, Hiroshi Yoshinaga, Masasi Wada
  • Patent number: 5843243
    Abstract: A wear-resistant copper-based alloy includes 10.0 to 30.0% by weight Ni, 2.0 to 15.0% by weight Fe, 2.0 to 15.0% by weight Co, 0.5 to 5.0% by weight Si, 1.0 to 10.0% by weight Cr, 2.0 to 15.0% by weight at least one first optional element selected from the group consisting of Mo, Ti, Zr, Nb and V, at least one second optional element selected from the group consisting of C and O, and the balance of Cu and inevitable impurities. A carbon content "X" and an oxygen content "Y" satisfy the following relationships; namely: 0.ltoreq."X".ltoreq.0.5, 0.ltoreq."Y".ltoreq.0.05, and "Y".gtoreq.(-0.8)("X")+0.04. The wear-resistant copper-based alloy enables to improve the toughness of weld bead, and to inhibit weld bead from cracking effectively in the solidifying process of a building-up operation.
    Type: Grant
    Filed: February 14, 1996
    Date of Patent: December 1, 1998
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Minoru Kawasaki, Noboru Takayanagi, Hiromi Nomura, Akio Sato, Isaka Kanazawa, Kensuke Hidaka, Shozo Nagai