Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.

Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

Abstract: A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed, circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt be electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).

Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel. 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

Abstract: A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.

Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel, 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness, wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.

Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.

Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

Abstract: The present invention provides a copper powder for use in a conductive paste which allows the paste to possess excellent initial electrical conductivity, thermal resistance, and humidity resistance, and which enables the paste to maintain stable electrical conductivity for a long period of time. The copper powder of the present invention comprises a raw material copper powder; an anti-oxidization film comprising an organic acid salt of a higher aliphatic amine which is formed on the surface of the copper powder; and a surface film which comprises 0.2 to 10 parts by weight of a dispersing agent of a boron-nitrogen composite type and 0.1 to 10 parts by weight of at least one coupling agent of the group consisting of isopropyl-triisostearoyl-titanate and aceoalkoxy-aluminum-diisopropylate, relative to 100 parts by weight of the copper powder, and which is formed on the anti-oxidization film.

Abstract: A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates.

Abstract: Hard facing nickel-base alloy comprising 10 to 25% by weight of chromium, 3 to 15% by weight of molybdenum, 3 to 7% by weight of silicon, 1 to 2.5% by weight of carbon and 1 to 30% by weight of iron, the balance being substantially nickel. The alloy may also contain up to 0.4% by weight of boron, up to 15% by weight of cobalt, up to 4% by weight of tungsten, up to 3% by weight of tantalum or up to 2% by weight of tin, or two or more of these elements, if necessary. No porosity is likely to be produced in the hard facing layer of the alloy formed on a relatively small piece of base metal.

Abstract: Hard facing nickel-base alloys comprising 0.05 to 1.5% by weight of boron, 3 to 7% by weight of silicon, 7.5 to 35% by weight of chromium, 0.05 to 1.5% by weight of carbon, and if necessary, less than 30% by weight of iron and/or less than 5% by weight of tungsten, the balance being nickel, with the weight ratio of silicon to boron being equivalent to or exceeding 3.3. The alloys have a high degree of toughness, ductility, wear resistance and corrosion resistance, and no cracks occur in the hard facing layer. Addition of 0.1 to 3% by weight of the tin and/or 0.1 to 3% by weight of tantalum remarkably increases the corrosion resistance. The alloys can be used as a hard facing material to be applied to parts of various instruments, machines and plants.

Abstract: The present invention relates to a method of treating the surface of the copper foil used in printed wire boards, in which the copper foil, of which the surface thereof was preliminarily roughened, is electrolytically treated in an aqueous solution of zinc chromate containing zinc ions and chromium (VI) ions at a definite range of ratio; the thus-treated copper foil is then preferably immersed in an aqueous solution containing amino silane, sodium silicate and/or potassium silicate at a definite ratio.The use of the so-treated copper foil in multi-layer glass/epoxy printed wire boards (NEMA grade, FR4, FR5) serves to prevent the generation of brown spottings and the elimination of the delamination of the copper conductors. In addition, the use of the so treated copper foil in flame resistant paper/phenol printed wiring boards (NEMA grade FR2) leads to the elimination of the poor adhesive properties and delamination of copper conductors.