Patents Assigned to Fukuda Metal Foil & Powder Co., Ltd.
  • Patent number: 5234573
    Abstract: A method of surface treatment of a copper foil for printed circuit boards comprising the steps of forming a treating layer of copper-zinc or copper-zinc-nickel by electrolysing at least a side of a copper foil in a manner of cathodic electrolysis in a bath of copper-zinc including copper ion, zinc ion, tartaric acid and alkali or further including nickel ion, and giving a chromate treatment to the copper foil. A copper foil for printed circuit boards obtained by using a copper-zinc-nickel bath.
    Type: Grant
    Filed: December 4, 1991
    Date of Patent: August 10, 1993
    Assignee: Fukuda Metal Foil and Powder Co., Ltd.
    Inventor: Masato Takami
  • Patent number: 5019338
    Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.
    Type: Grant
    Filed: October 26, 1989
    Date of Patent: May 28, 1991
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil and Powder Co., Ltd.
    Inventors: Shinji Oishi, Masahiro Nakagawa, Mototsugu Koyama, Kanichi Tanaka, Syozo Nagai, Kensuke Hidaka
  • Patent number: 4948559
    Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.
    Type: Grant
    Filed: July 26, 1989
    Date of Patent: August 14, 1990
    Assignees: Toyota Jidosha Kabushiki Kaisha, Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Shinji Oishi, Masahiro Nakagawa, Mototsugu Koyama, Kanichi Tanaka, Syozo Nagai, Kensuke Hidaka
  • Patent number: 4781980
    Abstract: The present invention provides a copper powder for use in a conductive paste which allows the paste to possess excellent initial electrical conductivity, thermal resistance, and humidity resistance, and which enables the paste to maintain stable electrical conductivity for a long period of time. The copper powder of the present invention comprises a raw material copper powder; an anti-oxidization film comprising an organic acid salt of a higher aliphatic amine which is formed on the surface of the copper powder; and a surface film which comprises 0.2 to 10 parts by weight of a dispersing agent of a boron-nitrogen composite type and 0.1 to 10 parts by weight of at least one coupling agent of the group consisting of isopropyl-triisostearoyl-titanate and aceoalkoxy-aluminum-diisopropylate, relative to 100 parts by weight of the copper powder, and which is formed on the anti-oxidization film.
    Type: Grant
    Filed: March 23, 1987
    Date of Patent: November 1, 1988
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Masayoshi Yoshitake, Shigeru Kito, Jiro Yamamoto
  • Patent number: 4619871
    Abstract: A copper foil resistant to acids and heat and yet easy to etch is obtained by forming a cobalt layer containing molybdenum and/or tungsten on the bonding surface thereof. Roughening of the foil surface prior to formation of the layer provides highly peel-resistant bonding of the foil thereat to resin-containing substrates of the type found in typical printed circuit boards. The provision of a chromate layer on the cobalt further improves the adhesion between the copper foil and resin-containing substrates.
    Type: Grant
    Filed: November 15, 1984
    Date of Patent: October 28, 1986
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventor: Masato Takami
  • Patent number: 4425300
    Abstract: Hard facing nickel-base alloy comprising 10 to 25% by weight of chromium, 3 to 15% by weight of molybdenum, 3 to 7% by weight of silicon, 1 to 2.5% by weight of carbon and 1 to 30% by weight of iron, the balance being substantially nickel. The alloy may also contain up to 0.4% by weight of boron, up to 15% by weight of cobalt, up to 4% by weight of tungsten, up to 3% by weight of tantalum or up to 2% by weight of tin, or two or more of these elements, if necessary. No porosity is likely to be produced in the hard facing layer of the alloy formed on a relatively small piece of base metal.
    Type: Grant
    Filed: April 30, 1981
    Date of Patent: January 10, 1984
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Takao Teramoto, Kensuke Hidaka
  • Patent number: 4404049
    Abstract: Hard facing nickel-base alloys comprising 0.05 to 1.5% by weight of boron, 3 to 7% by weight of silicon, 7.5 to 35% by weight of chromium, 0.05 to 1.5% by weight of carbon, and if necessary, less than 30% by weight of iron and/or less than 5% by weight of tungsten, the balance being nickel, with the weight ratio of silicon to boron being equivalent to or exceeding 3.3. The alloys have a high degree of toughness, ductility, wear resistance and corrosion resistance, and no cracks occur in the hard facing layer. Addition of 0.1 to 3% by weight of the tin and/or 0.1 to 3% by weight of tantalum remarkably increases the corrosion resistance. The alloys can be used as a hard facing material to be applied to parts of various instruments, machines and plants.
    Type: Grant
    Filed: October 24, 1980
    Date of Patent: September 13, 1983
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Kanichi Tanaka, Kensuke Hidaka
  • Patent number: 4387006
    Abstract: The present invention relates to a method of treating the surface of the copper foil used in printed wire boards, in which the copper foil, of which the surface thereof was preliminarily roughened, is electrolytically treated in an aqueous solution of zinc chromate containing zinc ions and chromium (VI) ions at a definite range of ratio; the thus-treated copper foil is then preferably immersed in an aqueous solution containing amino silane, sodium silicate and/or potassium silicate at a definite ratio.The use of the so-treated copper foil in multi-layer glass/epoxy printed wire boards (NEMA grade, FR4, FR5) serves to prevent the generation of brown spottings and the elimination of the delamination of the copper conductors. In addition, the use of the so treated copper foil in flame resistant paper/phenol printed wiring boards (NEMA grade FR2) leads to the elimination of the poor adhesive properties and delamination of copper conductors.
    Type: Grant
    Filed: July 8, 1981
    Date of Patent: June 7, 1983
    Assignee: Fukuda Metal Foil & Powder Co., Ltd.
    Inventors: Toshiyuki Kajiwara, Katsuhito Fukuda, Yoshinori Tanii