Patents Assigned to GA-TEK Inc.
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Patent number: 6824880Abstract: The invention relates to a process to enhance adhesion of resistive foil to laminating materials, including: providing a copper foil; depositing at least one resistive metal layer on at least one side of the copper foil; and applying at least one layer of at least one adhesion-promoting material over and adhered to the resistive metal layer, the adhesion-promoting material being suitable for enhancing adhesion between the resistive metal layer and laminating materials. The resistive metal layer may include NiCr, NiCrAlSi, aluminum, nickel, zinc, titanium, vanadium, chromium, manganese, iron, tantalum, molybdenum, ruthenium, and alloys, oxides, nitrides and silicides thereof. The invention further relates to a multilayer foil and to a laminate, both including the resistive metal layer and adhesion-promoting material.Type: GrantFiled: May 15, 2003Date of Patent: November 30, 2004Assignee: Ga-Tek, Inc.Inventors: Atnaf Admasu, Jiangtao Wang, Sidney Clouser
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Patent number: 6537675Abstract: In one embodiment, the present invention relates to a composite article, comprising a metal foil having a first side and a second side; a protective film of at least one inert silane, titanate or zirconate overlying the first side of the metal foil; and a metal sheet having a first side and a second side, the first side overlying the protective film. In another embodiment, the present invention relates to a method of increasing tarnish resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a protective film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil; and attaching the foil to a metal sheet.Type: GrantFiled: November 15, 2000Date of Patent: March 25, 2003Assignee: Ga-Tek, Inc.Inventors: Sidney J. Clouser, Michael A. Centanni
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Publication number: 20020146556Abstract: A resistor foil comprised of a layer of copper foil and a coating of an organic molecular semiconductor material on one side of the copper foil.Type: ApplicationFiled: April 4, 2001Publication date: October 10, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Joel W. Pankow, Michael A. Centanni
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Publication number: 20020119342Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising:Type: ApplicationFiled: February 23, 2001Publication date: August 29, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventor: R. Richard Steiner
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Patent number: 6426146Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to about 80 Å; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.Type: GrantFiled: February 10, 2000Date of Patent: July 30, 2002Assignee: GA-TEK Inc.Inventors: Thomas J. Ameen, Edward Czapor
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Publication number: 20020071637Abstract: A package for a fiber optic device or fiber optic component having at least one optical fiber extending therefrom. The package is comprised of a support substrate for supporting the optical device or optic component, the support substrate having at least one optical fiber extending therefrom. A housing surrounds the substrate and has an opening at one end. At least one optical fiber extends through the opening. A layer of metal seals the opening of each end of the tube and the glass fiber cladding where the optical fiber extends through the layer of metal.Type: ApplicationFiled: December 11, 2000Publication date: June 13, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner
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Publication number: 20020050400Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: May 2, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Mark Kusner, Michael A. Centanni
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Patent number: 6379487Abstract: A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 &mgr;m to about 70 &mgr;m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.Type: GrantFiled: May 5, 2000Date of Patent: April 30, 2002Assignee: GA-TEK Inc.Inventors: Bernd Schneider, R. Richard Steiner
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Publication number: 20020047773Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.Type: ApplicationFiled: August 2, 2001Publication date: April 25, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
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Patent number: 6361673Abstract: An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.Type: GrantFiled: June 27, 2000Date of Patent: March 26, 2002Assignee: GA-TEK Inc.Inventors: Thomas J. Ameen, Barbara J. Kidon, Peter Peckham
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Publication number: 20020020549Abstract: A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner
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Publication number: 20020020553Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Mark Kusner, Michael A. Centanni
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Publication number: 20020021204Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of an organic molecular semiconductor material is disposed on a second side of the film substrate.Type: ApplicationFiled: March 12, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Joel Pankow, Michael A. Centanni, Mark Kusner
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Patent number: 6341698Abstract: A sheet stacking device comprised of a sheet support bed having a first end and a second end. The sheet support bed is comprised of a plurality of side-by-side rollers, each of the rollers being freely rotatable about an associated roller axis. A drive assembly moves the sheet support bed in a predetermined direction along a closed path, the path having a horizontal upper run and a horizontal lower run, and is dimensioned such that a space exists between the first end and the second end of the sheet support bed as the sheet support bed moves along the path. A roller control assembly for selectively and sequentially controlling rotation of select ones of the rollers at select intervals during a stacking operation.Type: GrantFiled: May 8, 2000Date of Patent: January 29, 2002Assignee: Ga-Tek Inc.Inventor: Hermann Wursthorn
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Patent number: 6316733Abstract: A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.Type: GrantFiled: August 18, 2000Date of Patent: November 13, 2001Assignee: GA-TEK Inc.Inventors: Michael A. Centanni, Mark Kusner
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Patent number: 6296949Abstract: A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.Type: GrantFiled: September 16, 1999Date of Patent: October 2, 2001Assignee: GA-TEK Inc.Inventors: Tad Bergstresser, Charles A. Poutasse
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Patent number: 6284982Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.Type: GrantFiled: August 18, 2000Date of Patent: September 4, 2001Assignee: GA-TEK Inc.Inventors: Mark Kusner, Michael A. Centanni
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Publication number: 20010006740Abstract: A component for use in manufacturing articles, such as printed circuit boards, comprised of a sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of a sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated central zone, and the metal sheet being comprised of carbon steel having a layer of chromium thereon, wherein the chromium defines the substantially uncontaminated surface of the metal sheet.Type: ApplicationFiled: February 23, 2001Publication date: July 5, 2001Applicant: GA-TEK Inc.Inventor: Bernd Schneider
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Patent number: 6238778Abstract: A component for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil that, in a finished circuit board, constitutes a functional element, and a sheet of carbon steel having a layer of an inert metal thereon, the sheet of carbon steel constituting a discardable element. One surface of the copper sheet and the surface of the inert metal layer on the carbon steel sheet are essentially uncontaminated and engageable with each other at interfaces. The copper sheet is attached to the inert metal layer of the carbon steel sheet at their borders and defines substantially uncontaminated central zones inwardly of the edges of the sheets that are unjoined at the interfaces.Type: GrantFiled: March 24, 1999Date of Patent: May 29, 2001Assignee: GA-TEK Inc.Inventor: Bernd Schneider
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Patent number: 6224951Abstract: Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.Type: GrantFiled: June 12, 2000Date of Patent: May 1, 2001Assignee: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner