Abstract: A digital data delivery system which uses satellite broadcasting to deliver digital data along with audio and video signals. Digital data files are divided into packets and combined with audio and video packets in a time-division-multiplexed format. The time-division-multiplexed data is digitally modulated and then uplinked to a satellite transponder. The satellite transponder broadcasts the data to a multiplicity of user stations. The data which are broadcast by the satellite transponder are received by a satellite dish at each user station. Each satellite dish then relays the data to a receiver. The receiver identifies and separates the digital data file packets from the audio and video packets and outputs the digital data file packets to a data output port. A data bridge receives the packets from the data output port, buffers the packets, and converts the packets into a format that can be read by standard commercial I/O cards.

Abstract: A method and apparatus for performing a function on an integrated circuit having a plurality of electrical contact pads is disclosed. The apparatus includes a substrate for performing the function on the integrated circuit, the substrate having a plurality of electrical contact pads and at least one electrical test contact pad. A centering housing encompasses the integrated circuit and centers the integrated circuit with respect to the substrate such that the plurality of electrical contact pads of the integrated circuit electrically connects with the plurality of electrical contact pads of the substrate. A test connector connects integrated circuit to the substrate.

Abstract: A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats the inert liquid to a temperature above the melting temperature of the solder beads. A fluid level adjustment means adjusts the level of the inert liquid in the chamber between a first level below the component and a second level above the component. A first mounting means supports the circuit board above the component, and a second mounting means is positioned at least partially in the container to support the component below the circuit board and to bias the component against the circuit board. An component/board assembly is positioned in the system. The beads are uniformly melted by raising the level of the inert liquid in the chamber to above the component to permit removal of the board.