Abstract: A light-emitting device includes a light-emitting component. The light-emitting component includes a circuit board, a light-emitting diode which is mounted on and electrically connected to the circuit board, a wavelength-converting shell which covers the light-emitting diode, and a heat conductive layer which is formed on the wavelength-converting shell and which includes graphene.

Abstract: A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

Abstract: A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

Abstract: A flip-chip light-emitting diode (LED) unit includes a substrate, an electrode pad set disposed on the substrate, and three flip-chip LEDs disposed on the electrode pad set in a flip-chip manner and including one first LED and two second LEDs that are spaced apart from the first LED and that are electrically coupled to the first LED in a series configuration.

Abstract: An electronic device including an insulating substrate, a chip and a patterned conductive layer is provided. The insulating substrate has an upper surface and a lower surface opposite to each other. The chip is disposed above the upper surface of the insulating substrate. The patterned conductive layer is disposed between the upper surface of the insulating substrate and the chip. The chip is electrically connected to an external circuit via the patterned conductive layer. Heat generated by the chip is transferred to external surroundings via the patterned conductive layer and the insulating substrate.

Abstract: An LED package structure of the invention includes a light-emitting device and a transparent molding compound. The light-emitting device has an upper surface. The transparent molding compound is disposed on the light-emitting device and covers the upper surface, in which the transparent molding compound has a top surface and a bottom surface opposite to each other and a first outside surface connecting the top surface and the bottom surface. A surface area of the first outside surface is greater than or equal to four times of a horizontal projection area of the upper surface.

Abstract: A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure includes a light emitting layer disposed between a n-type semiconductor layer and a p-type semiconductor layer, and a hole supply layer disposed between the light emitting layer and the p-type semiconductor layer. The hole supply layer is made from material InxGa1-xN (0<x<1) and is doped with a Group IV-A element at a concentration ranging from 1017 to 1020 cm?3. By being doped with the Group IV-A element, the concentration of holes is increased and inactivation caused by Mg—H bonds is reduced. Thus Mg is activated as acceptors and the light emitting efficiency is further increased.

Abstract: A light-emitting device including a substrate, a light emitting structure and a coarse structure is provided. The substrate has an upper surface and a lower surface opposite to each other, and an annular side surface connecting the upper surface and the lower surface. The light emitting structure is disposed on the upper surface of the substrate. The coarse structure is formed on the annular side surface of the substrate. A ratio of a thickness of the substrate and a thickness of the coarse structure is greater than or equal to 1 and less than or equal to 20. Therefore, the overall light-emitting efficiency of the light-emitting device may be improved.

Abstract: A protective cover is detachably assembled to and electrically connected to an electronic device having an image capturing unit and a lens. The protective cover includes a base portion, at least one bending portion, and a plurality of light-emitting units. The electronic device is disposed on the base portion. The bending portion is foldably connected to at least one side of the base portion. There is at least one included angle between a side of the electronic device and the bending portion. The light-emitting units are disposed on the bending portion, and the light-emitting units are not coplanar with the lens.

Abstract: An illumination device including at least one light emitting element and a transparent lampshade is provided. The transparent lampshade is disposed on one side of the light emitting element and located on a light emitting path of the light emitting element. The transparent lampshade has a sealed space, a first fluid and a second fluid. The first fluid is a colloidal solution, and the first fluid is immiscible with the second fluid, and the first fluid and the second fluid flow in the sealed space to change a light shape of the emitted light from the light emitting element.

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract: A light emitting device includes a light emitting diode (LED) module and a rotatable wavelength converting structure. The LED module includes a substrate and a plurality of LED chips. The LED chips are disposed on the substrate, and each of the LED chips has a light emitting surface. The rotatable wavelength converting structure is disposed on the LED module and has a plurality of wavelength converting blocks with at least two different colors. Each of the LED chips at least corresponds to one wavelength converting block. The wavelength converting blocks are disposed on the light emitting surfaces of the LED chips. The rotatable wavelength converting structure rotates relative to the LED module so as to change the wavelength converting blocks that the LED chips correspond to.

Abstract: A light emitting device includes a base, a light guiding lamp cover, a light-emitting diode (LED) module and a wavelength converting structure. The light guiding lamp cover is disposed on the base and an accommodating space is defined by the light guiding lamp cover and the base together. The light guiding lamp cover has an inner surface, an outer surface and a bottom surface connecting the inner surface and the outer surface. A curvature of the inner surface is greater than a curvature of the outer surface. The LED module is disposed on the base and located inside the accommodating space. The wavelength converting structure is disposed on the LED module and located inside the accommodating space.

Abstract: A multiple quantum well structure including a plurality of well-barrier pairs arranged along a direction is provided. Each of the well-barrier pairs includes a barrier layer and a well layer adjacent to the barrier layer. The barrier layers and the well layers of the well-barrier pairs are disposed alternately. A ratio of a thickness of the well layer in the direction to a thickness of the barrier layer in the direction in each well-barrier pair is a well-barrier thickness ratio, and the well-barrier thickness ratios of a part of the well-barrier pairs gradually increase along the direction.

Abstract: An illumination system is provided, including a light emitting device and a control device, wherein the control device is coupled to the light emitting device so as to capture a situation data in a remote end and generate a situation signal correspondingly. The light emitting device receives the situation signal and generates a simulating situation.

Abstract: A light emitting diode (LED) structure including a substrate, a polymer layer, and an epitaxy layer is provided. The polymer layer is disposed on the substrate, wherein the polymer layer has a chemical formula of: wherein M represents sodium, zinc, magnesium, or potassium. The epitaxy layer is disposed on the polymer layer. The epitaxy layer is bonded to the substrate via the polymer layer.

Abstract: A wavelength converting structure suitable for covering a carrier carrying at least one light-emitting diode (LED) chip is provided. The wavelength converting structure includes a base film and a fluorescent layer. The base film has a first bending portion and a first flat portion connected to the first bending portion. The first flat portion is disposed on the carrier, and an accommodating space is defined by the first bending portion and the carrier. The LED chip is disposed in the accommodating space. The fluorescent layer is disposed on the base film and has a second bending portion and a second flat portion connected to the second bending portion. The second bending portion is conformal to the first bending portion, and the second flat portion is conformal to the first flat portion.

Abstract: A spray coating apparatus including a containing tank, a spray nozzle, and a detection unit is provided. The containing tank contains a glue. The spray nozzle is connected to the containing tank to spray and coat the glue on a work piece. The detection unit detects specification data of the glue on the work piece.

Abstract: A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier.