Abstract: An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.

Abstract: A DSL network topology is provided for the interconnections between a telecom carrier and households. Each household is provided with an HCC (Home Communications Centre) for facilitating digital communication. The digital communication includes DSL (Digital Subscriber Line) communication. A method of forming a DSL network such that existing copper pair wire is reused is also provided.

Abstract: Concepts and technologies described herein provide for securing a connector shell to a circuit board using a separate connector hat with elongated mounting posts. According to one aspect of the disclosure provided herein, a connector hat includes a one-piece body with a top surface and a pair of mounting posts. The mounting posts extend downwards from opposing side edges of the top surface. The posts are of sufficient length to extend beyond a bottom surface of a connector shell to which the connector hat is configured to attach, and through a bottom surface of an associated circuit board. The two-piece connector assembly design utilizing the connector hat with mounting posts allows the mounting posts to be manufactured at any desirable length to facilitate installation of the connector assembly to a circuit board.

Abstract: An apparatus and method for processing a video signal includes means for receiving the video signal, means for analyzing the video signal based upon a user supplied set of instructions, means for processing the video signal in accordance with the analysis, and means for outputting the processed video signal.

Abstract: A method for manufacturing doped substrates using a continuous large area scanning implantation process is disclosed. In one embodiment, the method includes providing a movable track member. The movable track member is provided in a chamber. The chamber includes an inlet and an outlet. In a specific embodiment, the movable track member can include one or more rollers, air bearings, belt member, and/or movable beam member to provide one or more substrates for a scanning process. The method may also include providing a first substrate. The first substrate includes a first plurality of tiles. The method maintains the first substrate including the first plurality of tiles in a vacuum. The method includes transferring the first substrate including the first plurality of tiles from the inlet port onto the movable track member. The first plurality of tiles are subjected to a scanning implant process. The method also includes maintaining a second substrate including a second plurality of tiles in the vacuum.

Abstract: The invention relates to a modular positioning robotic system and method of use of the positioning system. In general, the modular positioning robotic system is comprised of a controller module, a positioning module and a base that can be either a stationary base or drive module. The positioning module also allows for additional flexibility by allowing for designs with multiple allowable adjustments that can be changed for a change in turn diameter, length, width and weight of a fixture and part combination.

Abstract: A method for temperature control during a process of cleaving a plurality of free-standing thick films from a bulk material includes clamping a bulk material using a mechanical clamp device adapted to engage the bottom region of the bulk material through a seal with a planar surface of a stage to form a cavity with a height between the bottom region and the planar surface. The planar surface includes a plurality of gas passageways allowing a gas filled in the cavity with adjustable pressure. The method also includes maintaining the temperature of the surface region by processing at least input data and executing a control scheme utilizing at least one or more of; particle bombardment to heat the surface region; radiation to heat the surface region; and gas-assisted conduction between the bottom region and the stage.

Abstract: A method of manufacturing an integrated circuit on semiconductor substrates, e.g., silicon wafer. The method includes providing a semiconductor substrate characterized by a first lattice with a first structure and a first spacing. In a specific embodiment, the semiconductor substrate has an overlying film of material with a second lattice with a second structure and a second spacing, the second spacing placing the film of material in a strain mode characterized by a first tensile and/or compressive mode along a single film surface crystal axis across a first portion of the film of material relative to the semiconductor substrate with the first structure and the first spacing. The method patterns a predetermined region of the first portion of the film of material to cause the first tensile and/or compressive mode in the first portion of the film of material to change to a second tensile and/or compressive mode in a resulting patterned portion of the first portion of the film of material.

Abstract: The various embodiments disclosed and pictured illustrate a curved hammer for comminuting various materials. The illustrative embodiments pictured and described herein are primarily for use with a rotatable hammermill assembly. The curved hammer includes a connection portion having a rod hole therein, a contact portion for delivery of energy to the material to be comminuted, and a curved neck portion affixing the connection portion to the contact portion. In other embodiments, a shoulder is positioned around the periphery of the rod hole for added strength. In still other embodiments, a neck reinforcement is positioned along a portion of the neck for increased strength. A weld or plurality of welds may be affixed to various surfaces of the contact portion to aide in comminuting and/or longevity of the curved hammer.

Abstract: A method of fabricating a thickness of silicon material includes providing a silicon ingot material having a surface region and introducing a plurality of particles having an energy of about 1-5 MeV through the surface region to a depth to define a cleave region and a thickness of detachable material between the cleave region and the surface region. Additionally, the method includes processing the silicon ingot material to free the thickness of detachable material at a vicinity of the cleave region and causing formation of a free-standing thickness of material characterized by a carrier lifetime about 10 microseconds and a thickness ranging from about 20 microns to about 150 microns with a thickness variation of less than about five percent. Furthermore, the method includes treating the free-standing thickness of material using a thermal treatment process to recover the carrier lifetime to about 200 microseconds and greater.

Abstract: A method includes providing a donor substrate comprising single crystal silicon and having a surface region, a cleave region, and a thickness of material to be removed between the surface region and the cleave region. The method also includes introducing through the surface region a plurality of hydrogen particles within a vicinity of the cleave region using a high energy implantation process. The method further includes applying compressional energy to cleave the semiconductor substrate and remove the thickness of material from the donor substrate.

Abstract: A computer-based method for generating a program for hedging guaranteed benefits of a set of variable annuity (VA) contracts, including automatically generating interpreted and compiled contract value projection code; generating vectorized integrated scenario sets including arbitrage-free interest rate, hedging instrument, and VA fund values based on financial market data and regression and cointegration analysis of the VA funds and user-selected hedging instruments; multi-threaded vectorized calculating of present value PVGij of projected VA benefit guarantee cash flows for each VA contract i for each vectorized integrated scenario set j; calculating of differences of PVGij to determine sensitivities to financial parameters (“Greeks”) for each contract; calculating of present value PVAij of projected asset cash flows for each asset i for each vectorized integrated scenario set j; calculating of differences of PVAij to determine sensitivities to financial parameters (“Greeks”) for each asset; and, presenting

Abstract: A card and detection system comprises a group of light sensors located under and covered over by a table felt. The light sensors are directed vertically upward to detect changes in light intensity on the top surfaces of the sensors through the felt. This allows flexibility of placement of the sensors and avoids daily maintenance issues. The sensors read through fabric to detect when objects such as chips or cards are placed on top of the felt. With this system, the procedure of detecting chips or cards is imperceptible to the customers or dealers.

Abstract: Free standing thickness of materials are fabricated using one or more semiconductor substrates, e.g., single crystal silicon, polysilicon, silicon germanium, germanium, group III/IV materials, and others. A semiconductor substrate is provided having a surface region and a thickness. The surface region of the semiconductor substrate is subjected to a first plurality of high energy particles generated using a linear accelerator to form a region of a plurality of gettering sites within a cleave region, the cleave region being provided beneath the surface region to defined a thickness of material to be detached, the semiconductor substrate being maintained at a first temperature. The surface region of the semiconductor substrate is subjected to a second plurality of high energy particles generated using the linear accelerator, the second plurality of high energy particles being provided to increase a stress level of the cleave region from a first stress level to a second stress level.

Abstract: A photovoltaic cell device, e.g., solar cell, solar panel, and method of manufacture. The device has an optically transparent substrate comprises a first surface and a second surface. A first thickness of material (e.g., semiconductor material, single crystal material) having a first surface region and a second surface region is included. In a preferred embodiment, the surface region is overlying the first surface of the optically transparent substrate. The device has an optical coupling material provided between the first surface region of the thickness of material and the first surface of the optically transparent material.

Abstract: A hydrogen purifier utilizing a hydrogen permeable membrane, and a gas-tight seal, where the seal is uses a low temperature melting point metal, which upon heating above the melting point subsequently forms a seal alloy with adjacent metals, where the alloy has a melting point above the operational temperature of the purifier. The purifier further is constructed such that a degree of isolation exists between the metal that melts to form the seal and the active area of the purifier membrane, so that the active area of the purifier membrane is not corrupted. A method of forming a hydrogen purifier utilizing a hydrogen permeable membrane with a seal of the same type is also disclosed.

Abstract: A micro-needle roller (MNR) infusion system for transdermal delivery of active agents, skin-care products, and other topical formulations is described herein. The infusion system of the instant invention comprises a needle roller assembly with 0.25 mm needles enclosed in a housing with a vacuum line and a disposable cartridge having the active agent, the skin-care product or the topical formulation. The vacuum delivers the fluid and ensures that the skin is being pulled against the needle wheel surface to ensure that penetration of the needles is complete into the skin, simultaneously the fluid is flowing to the wheel and to skin as it rolls along with the outer housing of the tip cap assembly being occluded to the skin surface.

Abstract: The subject invention relates to novel soluble forms of planar ring structured organic compounds including flavonoids, and their production. The invention also includes the use of these novel formulations of planar ring structured organic compounds in the preparation of formulations and products. The invention also relates to a wide variety of applications of the formulations of the invention. The subject invention includes novel soluble forms and various formulations of flavonoids. Further, the invention includes novel methods of manufacturing the flavonoid formulations. The invention also relates to a wide variety of applications of the flavonoid formulations.