Abstract: A method for slicing a shaped silicon ingot includes providing a single crystal silicon boule characterized by a cropped structure including a first end-face, a second end-face, and a length along an axis in an <100> crystallographic direction substantially vertically extending from the first end-face to the second end-face. The method further includes cutting the single crystal silicon boule substantially through an {110} crystallographic plane in parallel to the axis to separate the single crystal silicon boule into a first portion with a first surface and a second portion with a second surface. Additionally, the method includes exposing either the first surface of the first portion or the second surface of the second portion and performing a layer transfer process to form a single crystal silicon sheet from either the first surface of the first portion or from the second surface of the second portion.

Abstract: Cell aggregate forming chambers are described, suitable for automated loading and unloading, where the airtight chamber contains a mold with a plurality of cavities, where there is an inlet and an outlet for cells, and where air is filtered before it comes into the chamber. Method of using the chamber include injecting cells into the chamber, providing conditions where the cells may grow to form cell aggregates, and extracting the cell aggregates through a cell outlet.

Abstract: A computer-based method for determining a value of an index-offset deposit product, having a principal amount, a term, a specified guaranteed amount, and an index credit comprising the step of setting trial values for fixed-income-linked crediting parameters for the product implying an expected fixed-income-linked credit component at the end of the term. The method further comprises the steps of determining a cost for an option paying an index-linked credit component such that a composite index credit together with the principal is at least equal to a specified guaranteed amount.

Abstract: A computer-based method for determining a value of an index-offset deposit product, having a principal amount, a term, a specified guaranteed amount, and an index credit comprising the step of setting trial values for fixed-income-linked crediting parameters for the product implying an expected fixed-income-linked credit component at the end of the term. The method further comprises the steps of determining a cost for an option paying an index-linked credit component such that a composite index credit together with the principal is at least equal to a specified guaranteed amount.

Abstract: The various embodiments disclosed and pictured illustrate a curved hammer for comminuting various materials. The illustrative embodiments pictured and described herein are primarily for use with a rotatable hammermill assembly. The curved hammer includes a connection portion having a rod hole therein, a contact portion for delivery of energy to the material to be comminuted, and a curved neck portion affixing the connection portion to the contact portion. In other embodiments, a shoulder is positioned around the periphery of the rod hole for added strength. In still other embodiments, a neck reinforcement is positioned along a portion of the neck for increased strength. A weld or plurality of welds may be affixed to various surfaces of the contact portion to aide in comminuting and/or longevity of the curved hammer.

Abstract: An apparatus and method for a game of play for use in a casino establishment, or on a general purpose computing device for offering games with multiple outcomes and including connectable game elements. A base game, or an outcome on a base game that triggers a sub-game or a bonus game involves establishing connections between connectable game elements where the orientation of ends of the elements are in alignment. Alignment and connection of the connectable game elements results in awards to players. The apparatus and method are offered on electronic gaming machines such as slot machines and video poker machines, but may also be deployed on other devices such as on a general purpose computing device or mobile telephone in stand-alone form or connected to a network, such as the internet.

Abstract: A system and method implemented as a software tool for foreground segmentation of video sequences in real-time, which uses two Competing 1-class Support Vector Machines (C-1SVMs) operating to separately identify background and foreground. A globalized, weighted optimizer may resolve unknown or boundary conditions following convergence of the C-1SVMs. The objective of foreground segmentation is to extract the desired foreground object from live input videos, with fuzzy boundaries captured by freely moving cameras. The present disclosure proposes the method of training and maintaining two competing classifiers, based on Competing 1-class Support Vector Machines (C-1SVMs), at each pixel location, which model local color distributions for foreground and background, respectively. By introducing novel acceleration techniques and exploiting the parallel structure of the algorithm (including reweighing and max-pooling of data), real-time processing speed is achieved for VGA-sized videos.

Abstract: A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers.

Abstract: Embodiments relate to use of a particle accelerator beam to form thin films of material from a bulk substrate are described. In particular embodiments, a bulk substrate having a top surface is exposed to a beam of accelerated particles. In certain embodiments, this bulk substrate may comprise GaN; in other embodiments this bulk substrate may comprise (111) single crystal silicon. Then, a thin film or wafer of material is separated from the bulk substrate by performing a controlled cleaving process along a cleave region formed by particles implanted from the beam. In certain embodiments this separated material is incorporated directly into an optoelectronic device, for example a GaN film cleaved from GaN bulk material. In some embodiments, this separated material may be employed as a template for further growth of semiconductor materials (e.g. GaN) that are useful for optoelectronic devices.

Abstract: A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

Abstract: Described in this application is a zero-backlash preload gear assembly. The assembly is specifically described for use with a positioning system in order to significantly reduce or eliminate mechanical error and improve tolerances. Furthermore, the assembly allows for infinite positioning of a work surface in order to facilitate improved efficiency of an automated system.

Abstract: A severe duty grapple with an upper jaw and a lower jaw. A hollow tubular pivot is attached to an inner end of one of the jaws. Two lug plates are mounted on an inner end of the other jaw. Each lug plate having an eyelet. The eyelets are alignable with the open ends of the tubular pivot. A pivot pin is passed through the tubular pivot and eyelets and secured thereat.

Abstract: A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches.

Abstract: A semiconductor light emitting device including a first type doped semiconductor layer, a light emitting layer, a second type doped semiconductor layer, and a reflection layer is provided. The first type doped semiconductor layer has a mesa portion and a depression portion. The light emitting layer is disposed on the mesa portion and has a first surface, a second surface and a first side surface connecting the first surface with the second surface. The second type doped semiconductor layer is disposed on the light emitting layer and has a third surface, a fourth surface and a second side surface connecting the third surface with the fourth surface. Observing from a viewing direction parallel to the light emitting layer, the reflection layer covers at least part of the first side surface and at least part of the second side surface. A flip chip package device is also provided.

Abstract: A light emitting diode device includes an epitaxial substrate, at least one passivation structure, at least one void, a semiconductor layer, a first type doping semiconductor layer, a light-emitting layer and a second type doping semiconductor layer. The passivation structure is disposed on the epitaxial substrate and has an outer surface. The void is located at the passivation structure and at least covering 50% of the outer surface of the passivation structure. The semiconductor layer is disposed on the epitaxial substrate and encapsulating the passivation structure and the void. The first type doping semiconductor layer is disposed on the semiconductor layer. The light-emitting layer is disposed on the first type doping semiconductor layer. The second type doping semiconductor layer is disposed on the light emitting layer.

Abstract: The present invention provides a pattern substrate structure for light emitting angle convergence and a light emitting diode device using the same. The pattern substrate structure has a plurality of enclosed geometric regions defined by at least three stripe-shaped parts on a substrate to provide the light reflection effect through the uneven surface of the substrate and thereby converge the light emitting angle of the light emitting diode element into 100˜110 degrees. Therefore, the illuminant efficiency of the light emitting diode device using the pattern substrate structure is substantially raised because of the improved directivity.

Abstract: A method includes providing a donor substrate comprising single crystal silicon and having a surface region, a cleave region, and a thickness of material to be removed between the surface region and the cleave region. The method also includes introducing through the surface region a plurality of hydrogen particles within a vicinity of the cleave region using a high energy implantation process. The method further includes applying compressional energy to cleave the semiconductor substrate and remove the thickness of material from the donor substrate.

Abstract: A computer-based apparatus for representing and acting on an indexed reversionary annuity, including a memory unit for at least one specially programmed computer configured to store computer readable instructions and an initial income amount, and a processor for the at least one specially programmed computer configured to execute the computer readable instructions to determine a set of indexing parameters P and generate an updated income amount at an end of a specified indexing term T based in part on performance of at least one index and the set of indexing parameters P.

Abstract: A capping system and method of use for sealing injectable drugs within vials is disclosed. The system includes a closure assembly and a locking cap. The closure assembly includes a retainer member and a resilient stopper located within the retainer member. The retainer member is arranged to be disposed on the vial whereupon a gap results between the stopper and the vial. The retainer member is movable to close that gap. The locking cap is used to permanently seal the vial.

Abstract: This disclosure is directed to apparatuses, systems, and methods associated with a heat-dissipating card connector for use with a card reader connected to an electronic device. The connector has a body configured to receive a card that has circuitry, when the card is inserted into the card reader. The connector body includes a plurality of electronic contacts that engage the card circuitry and operationally link the card to the electronic device. The connector body includes at least one heat conductive spring that includes a card engaging portion. The card engaging portion contacts the card and directs heat from the card when the card is inserted in the card reader. A heat directing element, also part of the heat conductive spring, transfers heat from the card engaging portion to a heat-dissipating structure of the electronic device when the card is inserted in the card reader.