Patents Assigned to GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
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Publication number: 20180217752Abstract: A flash controller and a control method for the flash controller. The flash controller comprises an instruction bus interface, a data bus interface, a configuration register, an erase access filter module, a read/write access filter module and a flash control module. The read/write access filter module is configured to receive control information and determine whether the read/write access is sent to the flash control module or not. The erase access filter module is configured to receive control information and determine whether the erase access is sent to the flash control module or not. The flash control module is configured to complete an access to a flash memory. The present disclosure is used to protect programs from being stolen by a client, and also protect against a situation where companies collaboratively developing a program are able to steal programs from one another.Type: ApplicationFiled: January 30, 2015Publication date: August 2, 2018Applicant: GIGADEVICE SEMICONDUCTOR?BEIJING?INC.Inventors: Baokui LI, Jinghua WANG, Nanfei WANG
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Publication number: 20180217945Abstract: The disclosure discloses a method and a device of information protection for a micro control unit (MCU) chip, the MCU chip comprises an instruction bus, a data bus, a flash controller and a user area of a flash memory; the flash controller is used to divide the user area into a first sub-area and a second sub-area; the method comprising: when the instruction bus accesses the user area, determining whether the instruction bus accesses the first sub-area; if yes, entering the first sub-area working state; in the first sub-area working state, if the instruction bus accesses the second sub-area, entering the transition state; determining whether the time at transition state reaches a preset waiting time; if yes, entering the second sub-area working state; the disclosure is used to protect program from being stolen by users and prevent the cooperative companies stealing program from each other.Type: ApplicationFiled: January 26, 2015Publication date: August 2, 2018Applicant: GIGADEVICE SEMICONDUCTOR?BEIJING? INC.Inventors: Baokui LI, Jinghua WANG, Nanfei WANG
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Patent number: 9836236Abstract: An enhanced Flash chip of SPI interface and a method for packaging chip, to solve the problems of high design complexity, long design period and high design cost. The chip comprises SPI FLASH and RPMC which are packaged integrally; the SPI FLASH and the RPMC comprise an independent controller, respectively; the same IO pins in SPI FLASH and RPMC are mutually connected and are connected to the same external sharing pin of the chip. The SPI FLASH and the RPMC further comprise an internal IO pin, respectively, in which the internal IO pin of SPI FLASH is connected with the internal IO pin of RPMC, and the internal mutual communication between the SPI FLASH and the RPMC is achieved through the mutually connected internal IO pins. Thus, it is possible to reduce the package size, decrease the cost of design, shorten design period and improve chip performance.Type: GrantFiled: July 15, 2013Date of Patent: December 5, 2017Assignee: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Qingming Shu, Hong Hu, Sai Zhang, Jianjun Zhang, Jiang Liu, Ronghua Pan
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Publication number: 20170277871Abstract: An information protection method and device based on a plurality of sub-areas for an MCU chip, the MCU chip comprises an instruction bus, a data bus, a flash controller and a user area of a flash memory, the method comprises: determining a preceding sub-area when the instruction bus accesses the user area; entering corresponding preceding sub-area working state; determining the current sub-area when the instruction bus accesses the user area; when the preceding sub-area is inconsistent with the current sub-area, entering the transition state; determining whether the duration of the transition state reaches the preset waiting time; if yes, entering the corresponding current sub-area working state. The information protection method and device prevent the cooperative companies which develop the program together from stealing program from each other.Type: ApplicationFiled: January 30, 2015Publication date: September 28, 2017Applicant: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Baokui LI, Jinghua WANG, Nanfei WANG
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Patent number: 9728520Abstract: An enhanced Flash chip and a method for packaging chip are provided to solve the problems of high design complexity. The enhanced Flash chip comprises: a FLASH and a RPMC packaged integrally, wherein the same IO pins in the FLASH and in the RPMC are mutually connected and are connected to the same external sharing pin of the chip; an external instruction is transmitted to the FLASH and the RPMC through the external sharing pin of the chip, and the controller of the FLASH and the controller of the RPMC respectively judge whether to execute the external instruction; and the FLASH and the RPMC further comprise internal IO pins, respectively, the internal IO pins of the FLASH and the internal IO pins of the RPMC are mutually connected, and internal mutual communication between the FLASH and the RPMC is performed through the pair of mutually connected internal IO pins.Type: GrantFiled: June 21, 2013Date of Patent: August 8, 2017Assignee: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong Hu, Qingming Shu, Sai Zhang, Jianjun Zhang, Jiang Liu, Ronghua Pan
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Publication number: 20170039140Abstract: A network storage device for use in flash memory and a processing method therefor. A network storage system for use in flash memory specifically comprises: a flash memory array device and an application server The application server comprises: a flash memory array management module used for converting, on the basis of organizational information of the flash memory array device, logical address of a data read/write request coming from a client into a physical address of the flash memory array device and converting, on the basis of the physical address, an original device read/write request into a device read/write request directed at the flash memory array device, where the device read/write request directed at the flash memory array device arrives at the flash memory array device via a network. This allows an increased capacity of network storage and increased degree of convenience of network storage.Type: ApplicationFiled: September 26, 2014Publication date: February 9, 2017Applicant: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventor: Rongzhen ZHU
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Patent number: 9490026Abstract: Disclosed are non-volatile memory erasure method and device for solving the problem of unnecessary time expenditure and complex process of the current erasure operation. The method comprises: after receiving an erasure instruction, performing a pre-reading verification on the target erasure area corresponding to the erasure instruction; if the pre-reading verification passes, then performing an erasure operation on the target erasure area; if not, then performing pre-programming verification on the target erasure area, and after the pre-programming verification passes, performing the erasure operation on the target erasure area. The method of the present application can eliminate the unnecessary pre-programming verification process while ensuring the target erasure area is in a full-erasure state before the erasure operation, thus saving erasure time and simplifying the erasure process.Type: GrantFiled: April 24, 2014Date of Patent: November 8, 2016Assignee: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong Hu, Linkai Wang
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Patent number: 9396798Abstract: An enhanced Flash chip and a method for packaging chip, wherein the enhanced Flash chip comprising: a FLASH and a RPMC, packaged integrally; the FLASH and the RPMC each comprising: a first internal IO pin and a second internal IO pin; the FLASH and the RPMC being further provided with a jumper window, one end of which is mutually connected to the first internal IO pin of the FLASH or the RPMC and the other end of which is mutually connected to the first internal IO pin of the RPMC or the FLASH; the second internal IO pin of the FLASH and the second internal IO pin of the RPMC being mutually connected. The enhanced Flash chip provided in the present application may effectively reduce design complexity and chip manufacturing cost, avoid the crossing of the metal lead wires in the chip package, and increase the yield of chip packages.Type: GrantFiled: June 24, 2013Date of Patent: July 19, 2016Assignee: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong Hu, Qingming Shu, Sai Zhang, Jianjun Zhang, Jiang Liu
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Publication number: 20160125952Abstract: Disclosed are non-volatile memory erasure method and device for solving the problem of unnecessary time expenditure and complex process of the current erasure operation. The method comprises: after receiving an erasure instruction, performing a pre-reading verification on the target erasure area corresponding to the erasure instruction; if the pre-reading verification passes, then performing an erasure operation on the target erasure area; if not, then performing pre-programming verification on the target erasure area, and after the pre-programming verification passes, performing the erasure operation on the target erasure area. The method of the present application can eliminate the unnecessary pre-programming verification process while ensuring the target erasure area is in a full-erasure state before the erasure operation, thus saving erasure time and simplifying the erasure process.Type: ApplicationFiled: April 24, 2014Publication date: May 5, 2016Applicant: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong HU, Linkai WANG
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Publication number: 20150348939Abstract: An enhanced Flash chip and a method for packaging chip are provided to solve the problems of high design complexity. The enhanced Flash chip comprises: a FLASH and a RPMC packaged integrally, wherein the same IO pins in the FLASH and in the RPMC are mutually connected and are connected to the same external sharing pin of the chip; an external instruction is transmitted to the FLASH and the RPMC through the external sharing pin of the chip, and the controller of the FLASH and the controller of the RPMC respectively judge whether to execute the external instruction; and the FLASH and the RPMC further comprise internal IO pins, respectively, the internal IO pins of the FLASH and the internal IO pins of the RPMC are mutually connected, and internal mutual communication between the FLASH and the RPMC is performed through the pair of mutually connected internal IO pins.Type: ApplicationFiled: June 21, 2013Publication date: December 3, 2015Applicant: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong HU, Qingming SHU, Sai ZHANG, Jianjun ZHANG, Jiang LIU, Ronghua PAN
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Publication number: 20150318044Abstract: An enhanced Flash chip and a method for packaging chip, wherein the enhanced Flash chip comprising: a FLASH and a RPMC, packaged integrally; the FLASH and the RPMC each comprising: a first internal IO pin and a second internal IO pin; the FLASH and the RPMC being further provided with a jumper window, one end of which is mutually connected to the first internal IO pin of the FLASH or the RPMC and the other end of which is mutually connected to the first internal IO pin of the RPMC or the FLASH; the second internal IO pin of the FLASH and the second internal IO pin of the RPMC being mutually connected. The enhanced Flash chip provided in the present application may effectively reduce design complexity and chip manufacturing cost, avoid the crossing of the metal lead wires in the chip package, and increase the yield of chip packages.Type: ApplicationFiled: June 24, 2013Publication date: November 5, 2015Applicant: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.Inventors: Hong HU, Qingming SHU, Sai ZHANG, Jianjun ZHANG, Jiang LIU