Abstract: A light emitting unit includes a substrate, a first reflecting element, a light-emitting diode (LED), and a second reflecting element. At least one part of the substrate is light permeable. The LED is disposed between the substrate and the first reflecting element, and the first and second reflecting elements are disposed on two opposite sides of the substrate, respectively.

Abstract: A single-stage AC to DC conversion device includes an energy storage unit, a magnetic unit, and a switch unit. The magnetic unit electrically connects the energy storage unit with the switch unit, and has a core, a first winding, a second winding, a third winding, and at least one output winding. The first winding couples with the core and transfers a first electric energy to the core. The second winding couples with the core and stores a second electric energy in the energy storage unit. The third winding couples with the core and transfers the second electric energy to the core. The output winding couples with the core that transfers the first electric energy and the second electric energy, and outputs a third electric energy through the output winding.

Abstract: A die bonding apparatus cooperates to a die and a substrate having a die bonding surface. The die bonding apparatus includes a carrier, a die ejecting mechanism and a substrate holding mechanism. The carrier carries the die. The die ejecting mechanism has at least one ejecting unit. The substrate holding mechanism holds the substrate and is disposed opposite to the die ejecting mechanism. The substrate and the carrier move relatively to each other in two dimensions on a plane parallel to the die-bonding surface. The carrier is located between the die ejecting mechanism and the substrate. The ejecting unit pushes against the carrier for transferring the die on the carrier onto the die bonding surface of the substrate.

Abstract: A light emitting diode (LED) unit includes a carrier, a plurality of LED dies, a reflecting element and a molding material. A length-width ratio of the carrier is greater than or equal to 5. The LED dies are disposed on the carrier along a longitudinal direction of the carrier. The reflecting element has two reflecting portions disposed on the carrier along the longitudinal direction. The LED dies are disposed between the reflecting portions. The molding material covers the LED dies and contacts with the reflecting element.

Abstract: A light emitting apparatus includes a substrate, at least one LED (light-emitting diode) die, a sealant, a cover sheet and a protecting material. The LED die is disposed on the substrate. The sealant covers the LED die and has a top surface and a side surface. The cover sheet is disposed on the top surface of the sealant. The protecting material is disposed at the side surface, and connected with the cover sheet and the substrate. Accordingly, the light emitting apparatus can prevent from moisture or gas that may affect the luminous efficiency thereof, thereby extending the lifetime of the light emitting apparatus.

Abstract: A light emitting unit includes a substrate, a first reflecting element, a light-emitting diode (LED), and a second reflecting element. At least one part of the substrate is light permeable. The LED is disposed between the substrate and the first reflecting element, and the first and second reflecting elements are disposed on two opposite sides of the substrate, respectively.

Abstract: A back plate of a light emitting unit includes a bottom plate, a plurality of first extruding elements, a plurality of second extruding elements and a plurality of connecting elements. The first extruding elements are respectively disposed on two opposite edges of the bottom plate, and the second extruding elements are respectively disposed on the other two opposite edges of the bottom plate. Each of the connecting elements connects the corresponding first and second extruding elements. The first extruding elements, the second extruding elements and the connecting elements form a closed region.