Abstract: Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes generating a photomask for forming a DSA directing pattern overlying a semiconductor substrate. The DSA directing pattern is configured to guide a self-assembly material deposited thereon that undergoes directed self-assembly (DSA) to form a DSA pattern. Generating the photomask includes identifying placement of DSA target patterns in a design layout. The DSA target patterns are grouped into groups including a first group and a first group boundary is defined around the first group. The method further includes determining if a neighboring DSA target pattern to the first group boundary is at least a predetermined minimal keep-away distance from an adjacent DSA target pattern that is within the first group boundary. The method also includes determining if the DSA target patterns in the first group are DSA compatible. An output mask pattern is generated using the first group boundary.

Abstract: An approach for monitoring and protecting electronic data in a networked computing environment (e.g., a cloud computing environment) is provided. In a typical embodiment, an activity monitor gathers characteristics of data traffic of one or more virtual machines. The data traffic is analyzed to determine whether any of the data traffic is indicative of a malicious activity (e.g., unauthorized data transfers). If it appears a VM is engaging in malicious activity, then a counter for the VM is incremented by a predefined value that is associated with the malicious activity. When the counter for the VM exceeds a point threshold, a remediation action is taken with respect to the VM.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A computer generates a modified list of search terms by adding synonyms of the search terms and terms that are related to the search terms to a list of search terms. The computer removes frequently used words from the modified list of search terms. The computer responds to a determination that a user has authorization to view a field of a document by adding to the modified list of search terms an encrypted version of a search term included in a list of search terms. A search using the modified list of search terms returns a result that identifies the document as a search result when either the unencrypted or the encrypted version of the search term is found in a list of index terms associated with the first document.

Abstract: A flame retardant polymer is prepared from renewable content. In an exemplary synthetic method, a bio-derived flame retardant polymer is prepared by a polycondensation reaction of a biobased diol (e.g., isosorbide) and a phosphorus-containing monomer (e.g., phenylphosphonic dichloride). The biobased diol may be obtained either directly from, or through modification of, a biological product. Preferably, at least 50% of the mass of the biobased diol is obtained directly from a biological product. The phosphorus-containing monomer may be a phosphonic dichloride, dichlorophosphate, alkyl/aryl phosphonate, or other phosphorus-containing monomer known for flame retardancy.

Abstract: Methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes forming a first fin structure overlying a first type region in a semiconductor substrate and forming a second fin structure overlying a second type region in the semiconductor substrate. A gate is formed overlying each fin structure and defines a channel region in each fin structure. The method includes masking the second type region and etching the first fin structure around the gate in the first fin structure to expose the channel region in the first fin structure. Further, the method includes doping the channel region in the first fin structure, and forming source/drain regions of the first fin structure around the channel region in the first fin structure.

Abstract: An organic material layer is lithographically patterned to include a linear array portion of lines and spaces. In one embodiment, the organic material layer can be an organic planarization layer that is patterned employing a photoresist layer, which is consumed during patterning of the organic planarization layer. Volume expansion of the organic planarization layer upon exposure to a halogen-including gas causes portions of the linear array to collapse at random locations. In another embodiment, the height of the photoresist layer is selected such that the linear array portion of the photoresist layer is mechanically unstable and produces random photoresist collapses. The pattern including random modifications due to the collapse of the organic material layer is transferred into an underlying layer to generate an array of conductive material lines with random electrical disruption of shorts or opens. The structure with random shorts can be employed as a physical unclonable function.

Abstract: A symmetrical lateral bipolar junction transistor (SLBJT) is provided. The SLBJT includes a p-type semiconductor substrate, a n-type well, an emitter of a SLBJT situated in the n-type well, a base of the SLBJT situated in the n-type well and spaced from the emitter by a distance on one side of the base, a collector of the SLBJT situated in the n-type well and spaced from the base by the distance on an opposite side of the base, and an electrical connection to the substrate outside the n-type well. The SLBJT is used to characterize a transistor in a circuit by electrically coupling the SLBJT to a gate of the test transistor, applying a voltage to the gate, and characterizing aspect(s) of the test transistor under the applied voltage. The SLBJT protects the gate against damage to the gate dielectric.

Abstract: Methods of fabricating circuit structures including FinFET structures are provided, including: providing a substrate and a first material having a first threshold voltage above the substrate, and a second material having a second threshold voltage lower than the first threshold voltage above the first material; forming fins having base fin portions formed from the first material and upper fin portions formed from the second material; providing gate structures over the fins to form one or more FinFET structures, wherein the gate structures wrap around at least the upper fin portions and have an operating voltage lower than the first threshold voltage and higher than the second threshold voltage, so that the upper fin portions define a channel size of the one or more FinFET structures. Circuit structures including FinFET structures are also provided, in which the FinFET structures have a uniform channel size defined only by upper fin portions thereof.

Abstract: A semiconductor device (e.g., field effect transistor (FET)) having an asymmetric feature, includes a first gate formed on a substrate, first and second diffusion regions formed in the substrate on a side of the first gate, and first and second contacts which contact the first and second diffusion regions, respectively, the first contact being asymmetric with respect to the second contact.

Abstract: A method for making a semiconductor device may include forming, above a substrate, a plurality of laterally spaced-apart semiconductor fins, and forming regions of a first dielectric material between the laterally spaced-apart semiconductor fins. The method may further include selectively removing at least one intermediate semiconductor fin from among the plurality of semiconductor fins to define at least one trench between corresponding regions of the first dielectric material, and forming a region of a second dielectric material different than the first dielectric in the at least one trench to provide at least one isolation pillar between adjacent semiconductor fins.

Abstract: A method of forming a semiconductor device is disclosed. The method includes forming a first dielectric layer on a substrate; forming a set of bias lines on the first dielectric layer; covering the set of bias lines with a second dielectric layer; forming a semiconductor layer on the second dielectric layer; and forming a set of devices on the semiconductor layer above the set of bias lines.

Abstract: For semiconductor memory garbage collection, an identification module identifies a garbage collection time window for at least one block of a flash memory array. A garbage collection module garbage collects a first block of the flash memory array with a highest garbage collection level and an open garbage collection time window.

Abstract: Embodiments of the invention include a semiconductor structure containing a back end of line randomly patterned interconnect structure for implementing a physical unclonable function (PUF), a method for forming the semiconductor device, and a circuit for enabling the interconnect structure to implement the physical unclonable function. The method includes forming a semiconductor substrate and a dielectric layer on the substrate. The randomly patterned interconnect structure is formed in the dielectric layer. The random pattern of the interconnect structure is used to implement the physical unclonable function and is a result of defect occurrences during the manufacturing of the semiconductor structure. The circuit includes n-channel and p-channel metal oxide semiconductor field effect transistors (MOSFETs) and the randomly patterned interconnect structure, which acts as electrical connections between the MOSFETs.

Abstract: A private information management apparatus, a method, and a program that allows individual users to easily set and apply their privacy rules. A private information management apparatus receives setting data from a user terminal and creates a privacy rule that defines a condition for restricting disclosure of private information and a restriction method. If undisclosed image data contains private information of a user, the private information management apparatus extracts metadata contained in this undisclosed image data, and determines whether or not the metadata satisfies the condition for restricting disclosure of the private information. If it is determined that the condition is satisfied, the private information management apparatus executes the restriction method defined by the privacy rule.

Abstract: Measurement of thickness of layers of a circuit structure is obtained, where the thickness of the layers is measured using an optical critical dimension (OCD) measurement technique, and the layers includes a high-k layer and an interfacial layer. Measurement of thickness of the high-k layer is separately obtained, where the thickness of the high-k layer is measured using a separate measurement technique from the OCD measurement technique. The separate measurement technique provides greater decoupling, as compared to the OCD measurement technique, of a signal for thickness of the high-k layer from a signal for thickness of the interfacial layer of the layers. Characteristics of the circuit structure, such as a thickness of the interfacial layer, are ascertained using, in part, the separately obtained thickness measurement of the high-k layer.

Abstract: A system, method, and computer program product provide a process that includes storing data on first data storage devices, and a backup copy of the data on the first and/or on second ones of the data storage devices. A probability of a failure of each of at least some of the first and/or second data storage devices is determined, and at least one of the first and/or data storage devices that is determined to have a higher probability of failure than a threshold and/or a probability of failure of another of the data storage devices, is selected. A second backup copy of the data, stored on the selected data storage device(s), is also stored on third ones of the data storage devices. The first and/or second data storage devices determined to have the higher probability of failure are used for their designated purpose after the second backup copy is created.

Abstract: A method includes providing a semiconductor structure. An external mechanical stress is applied to the semiconductor structure. One or more semiconductor manufacturing processes are performed while the external mechanical stress is applied to the semiconductor structure. The one or more semiconductor manufacturing processes provide one or more material layers having an intrinsic stress at the semiconductor structure. After performing the one or more semiconductor manufacturing processes, the external mechanical stress is removed from the semiconductor structure. The removal of the external mechanical stress at least partially relaxes the intrinsic stress of the one or more material layers.

Abstract: Embodiments of the present invention provide a design structure and method for compensating for a change in frequency of oscillation (FOO) of an LC-tank VCO that includes a first node; second node; inductor; first capacitive network (FCN) that allows the design structure to obtain a target FOO; compensating capacitive (CCN) network that compensates for a change in the design structure's FOO; second capacitive network (SCN) that allows the design structure to obtain a desired FOO; a filter that supplies a voltage to the SCN and is coupled to the SCN; a transconductor that compensates for a change in the design structure's FOO; and a sub-circuit coupled to the SCN that generates and supplies voltage to the CCN sufficient to allow the CCN to compensate for a reduction in the design structure's FOO. The first and second nodes are coupled to the inductor, FCN, CCN, SCN, and sub-circuit.

Abstract: A method of fabricating a memory device is provided that may begin with forming a layered gate stack atop a semiconductor substrate and patterning a metal electrode layer stopping on the high-k gate dielectric layer of the layered gate stack to provide a first metal gate electrode and a second metal gate electrode on the semiconductor substrate. In a next process sequence, at least one spacer is formed on the first metal gate electrode atop a portion of the high-k gate dielectric layer, wherein a remaining portion of the high-k gate dielectric is exposed. The remaining portion of the high-k gate dielectric layer is etched to provide a first high-k gate dielectric having a portion that extends beyond a sidewall of the first metal gate electrode and a second high-k gate dielectric having an edge that is aligned to a sidewall of the second metal gate electrode.