Patents Assigned to Green Arrow Asia Limited
  • INTEGRATED CIRCUIT PACKAGE HAVING A CASTELLATED HEATSPREADER
    Publication number: 20110092027
    Abstract: In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.
    Type: Application
    Filed: December 21, 2010
    Publication date: April 21, 2011
    Applicant: GREEN ARROW ASIA LIMITED
    Inventor: Tung Lok LI
  • Integrated circuit package having a castellated heatspreader
    Patent number: 7875970
    Abstract: In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: January 25, 2011
    Assignee: Green Arrow Asia Limited
    Inventor: Tung Lok Li
  • INTEGRATED CIRCUIT PACKAGE HAVING A CASTELLATED HEATSPREADER
    Publication number: 20100314743
    Abstract: In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.
    Type: Application
    Filed: July 29, 2009
    Publication date: December 16, 2010
    Applicant: GREEN ARROW ASIA LIMITED
    Inventor: Tung Lok LI