Abstract: Provided is a method for improving the corrosion resistance of a gold finger, which is applicable to a photovoltaic panel (1) including gold fingers (2), wherein a guide line (3) is arranged at a root portion of the gold fingers (2) of the photovoltaic panel (1). The method comprises the following steps in sequence: 1) electrical connection: using an outer lead (4) to electrically connect all gold fingers (2) of a photovoltaic panel (1); 2) solder resistance: performing solder resistance on an area other than the outer lead (4); 3) gold plating on the gold fingers (2); 4) etching of the outer lead (4); and 5) solder resistance: performing solder resistance on a vacancy after etching of the lead (4). In the method, an outer lead (4) is arranged to electrically connect all gold fingers (2) of a photovoltaic panel (1), so that all sides of the gold fingers (2) are plated with gold, thereby significantly improving the corrosion resistance of the gold fingers (2).

Abstract: A printed circuit board (PCB) panelization method and system. The method comprises the following steps: S1, reading daughterboard information of purchase orders, wherein the daughterboard information comprises the respective areas, delivery quantities and attributes of daughterboards; S2, performing comparison of the daughterboard information, screening for daughterboards having the same attributes, and establishing a panelization rule database; S3, selecting panels (PNL) satisfying the requirements according to panelization requirements; S4, selecting, from the daughterboards having the same attributes as the selected panels, daughterboards to be panelized together for the selected panels, and arranging the layout for the panelization.