Patents Assigned to Hakko Corporation
  • Publication number: 20060054658
    Abstract: An electrically-controlled soldering pot apparatus with a timer control mechanism and a temperature control mechanism; a method of alerting a user when to exchange a solder bath of the apparatus before erosion to the solder bath occurs; and a method of varying the heating rate applied to a variety of lead-free solders in a solder bath housed in the apparatus.
    Type: Application
    Filed: September 15, 2004
    Publication date: March 16, 2006
    Applicant: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Publication number: 20060022018
    Abstract: A soldering iron (and a desoldering iron) with a replaceable tip, which is releasably securable on the forward heat-conducting end of a soldering (or desoldering) iron heat assembly. The tip has a tapered heat conducting core in a tip cap. The face of the core can have a depression for mating engagement with a protrusion of the heat-conducting end. Also, the face can lie in the rear plane of the tip cap. An assembly which allows for the easy removal and application of a replacement tip can include a sleeve with tightening bolt, a coil spring sleeve, or a slotted compressible sleeve. The tip can thus be replaced after it has worn out, and the heat assembly unit need not be replaced until it has burnt out. Methods of manufacturing and using the tip are also disclosed.
    Type: Application
    Filed: May 25, 2005
    Publication date: February 2, 2006
    Applicants: Hakko Corporation, American Hakko Products, Inc.
    Inventors: Kayoko Yoshimura, Takashi Uetani, Takashi Nagasi, Hiroyuki Masaki
  • Patent number: 6972396
    Abstract: Disclosed is a heating device having a elongated body to heat an electric part for soldering or desoldering the electric part. The heating device includes a tip through which the heat is applied to the part, a heater for heating the tip and a temperature sensor for detecting temperature at the tip. The heater and the temperature sensor are longitudinally distant from each other. The temperature sensor is located in a forward portion of the body to be close to the tip. The heater includes a heater core of high heat conductive material, and a heating coil wound around the heater core, with heat being conducted through the heater core in the longitudinal direction of the body to the tip.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: December 6, 2005
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 6916859
    Abstract: This invention provides a grip for a tool that is treated with an anti-microbial material to minimize germs from passing from one person to another. The anti-microbial material includes: about 90% by weight of feldspar particles; about 5% by weight of alumina whiskers; about 2% by weight of silver; and about 3% by weight of zinc. The grip can be formed for a variety of tools such as a soldering iron.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: July 12, 2005
    Assignee: Hakko Corporation
    Inventor: Konishi Hirofumi
  • Patent number: 6871804
    Abstract: A disconnectable hot air nozzle device is provided with a nozzle holder 2 having an introducing portion 2c and a hook shaped retaining portion 2d, an attachment 3, and a cover 4 vertically replaceable for a predetermined amount relative to the attachment and having a retaining pin 4a, with the retaining pin being introduced from the introducing portion 2c of the nozzle holder 3 into a retaining portion 2d. The nozzle holder 2 and the attachment 3 are disconnectably fixed with each other, with the abutting surfaces provided on the nozzle holder 2 and the attachment 3 being brought into abutment with each other by a force applied from a urging member 5 to the nozzle holder 2 via the retaining pin 4a.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: March 29, 2005
    Assignee: Hakko Corporation
    Inventor: Yoshihiro Hagihara
  • Patent number: 6833531
    Abstract: Disclosed is a temperature adjusting device for adjusting or setting temperature of a soldering iron, with the adjustment or setting being allowed to a particular authorized operator. The device comprises a temperature control section having a moveable member which is moveable to change an electric parameter, such as a resistance, as a function of the movement of the moveable member, the temperature control section controlling the temperature of the soldering iron in accordance with the electric parameter; a manipulation member detachably coupled to the moveable member to move the moveable member to change the electric parameter; and an indicator interrelated with the moveable member to indicate an adjusted temperature, the indicator being capable of making the indication even when the manipulation member has been detached from moveable member.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: December 21, 2004
    Assignee: Hakko Corporation
    Inventor: Hiroyuki Masaki
  • Publication number: 20040226982
    Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.
    Type: Application
    Filed: February 24, 2004
    Publication date: November 18, 2004
    Applicant: Hakko Corporation, Japanese corporation
    Inventors: Takashi Nagase, Takashi Uetani, Yoshitomo Teraoka, Takanori Naito, Masayuki Miyabe, Norihisa Sekimori
  • Patent number: 6818862
    Abstract: In an iron tip for a soldering iron, composed of Fe plated copper or copper alloy, an outer surface excluding a solder coating portion in a leading end portion of the iron tip is plated with Cu in a film thickness range of approximately 10 to 50 &mgr;m, the surface is coated with a mixture of Al particles and flux, only the Al particles are melted in an inert gas atmosphere, and the surface is modified into a surface with a Cu—Al alloy coated layer having a high Al concentration. As a result, without using Cr plating, it is possible to provide an electric soldering iron having an excellent resistance to oxidation under high temperature environment and a high heat conductivity.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: November 16, 2004
    Assignee: Hakko Corporation
    Inventors: Takashi Uetani, Mitsuhiko Miyazaki
  • Publication number: 20040222206
    Abstract: A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.
    Type: Application
    Filed: November 21, 2003
    Publication date: November 11, 2004
    Applicant: Hakko Corporation, Japanese corporation
    Inventors: Takashi Nagase, Takashi Uetani, Yoshitomo Teraoka, Takanori Naito, Norihisa Sekimori, Masayuki Miyabe
  • Patent number: 6786386
    Abstract: A soldering iron comprises a tip end; a heater portion for electrically heating the tip end of the soldering iron; a holding portion provided at the rear end of the heater portion: a heat pipe structure provided in the holding portion; a first heat pipe holder for holding a frontal portion of the heat pipe structure to which heat generated at the heater portion is transferred; a second heat pipe holder for holding a rear part of the heat pipe structure; and a grip portion placed externally around the first heat pipe holder.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: September 7, 2004
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 6750431
    Abstract: A tweezer-type hand-held device for removing an electric or electronic component from a substrate is provided with a pair of contact pieces to be brought into contact with the component to grasp and heat the component and melt solder which fixes the component on the substrate. The contacts are respectively held by a pair of legs which, in turn, are interconnected with each other such that one of the legs moves toward the other with the legs and contact pieces being kept in parallel with each other.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: June 15, 2004
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Patent number: 6710304
    Abstract: The present invention allows a user to select a handle that is ergonomically friendly to a user's hand and replace it with the replaceable handle that is designed to fit over a soldering iron rod. There are a number of advantages to the present invention. One of the advantages is that a user can choose an individual handle with the desired shape, size, color, and material. Another advantage is that since each user has an individual handle, hygiene problems may be minimized. Still another advantage is the cost savings because as the replaceable handle wears out, only the handle needs to be replaced rather than the whole soldering iron.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Hakko Corporation
    Inventor: Bungo Yokoo
  • Patent number: D505053
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: May 17, 2005
    Assignee: Hakko Corporation
    Inventor: Miyazaki Mituhiko
  • Patent number: D505605
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: May 31, 2005
    Assignee: Hakko Corporation
    Inventor: Miyazaki Mituhiko
  • Patent number: D480522
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: October 7, 2003
    Assignee: Hakko Corporation
    Inventors: Yasuhiro Sasaki, Toshinobu Ishihara
  • Patent number: D489236
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: May 4, 2004
    Assignee: Hakko Corporation
    Inventor: Miyazaki Mituhiko
  • Patent number: D490448
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: May 25, 2004
    Assignee: Hakko Corporation
    Inventor: Toshinobu Ishihara
  • Patent number: D491030
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: June 8, 2004
    Assignee: Hakko Corporation
    Inventor: Miyazaki Mituhiko
  • Patent number: D493342
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: July 27, 2004
    Assignee: Hakko Corporation
    Inventor: Hiroyuki Masaki
  • Patent number: D497527
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: October 26, 2004
    Assignee: Hakko Corporation
    Inventor: Hiroyuki Masaki