Patents Assigned to Hangzhou Microimage Software Co., Ltd.
  • Patent number: 12613452
    Abstract: A thermal imaging module and an electronic device.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: April 28, 2026
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventors: Hongwei Jiang, Changwei Hu
  • Patent number: D1033517
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: July 2, 2024
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventor: Dingsong Lin
  • Patent number: D1034761
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: July 9, 2024
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventor: Dingsong Lin
  • Patent number: D1043790
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: September 24, 2024
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventor: Dingsong Lin
  • Patent number: D1093460
    Type: Grant
    Filed: November 28, 2021
    Date of Patent: September 16, 2025
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventor: Mengfei An
  • Patent number: D1129529
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: June 9, 2026
    Assignee: Hangzhou Microimage Software Co., Ltd.
    Inventor: Dingsong Lin