Thermal imager

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Description

FIG. 1 is a front view of a thermal imager showing my new design;

FIG. 2 is a back view thereof;

FIG. 3 is a left view thereof;

FIG. 4 is a right view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a front, left and bottom perspective view thereof; and,

FIG. 8 is a back, right and top perspective view thereof.

The broken lines shown in FIGS. 1-8 are included for the purpose of illustrating portions of the thermal imager that form no part of the claimed design.

Claims

The ornamental design for a thermal imager, as shown and described.

Referenced Cited
U.S. Patent Documents
D734803 July 21, 2015 Hallgren
D751622 March 15, 2016 Mao
D826308 August 21, 2018 Tremblay
D884055 May 12, 2020 Jeong
D904482 December 8, 2020 Hoffman
D925638 July 20, 2021 Elrod
D934938 November 2, 2021 Li
D999801 September 26, 2023 Hoffman
D1032684 June 25, 2024 Sun
D1039024 August 13, 2024 Lou
D1054469 December 17, 2024 Lee
D1065300 March 4, 2025 Chen
Foreign Patent Documents
6177936 November 2021 GB
6177937 November 2021 GB
Other references
  • “Hikmicro Thermal Camera” from Amazon.com, first available Apr. 13, 2022 from the internet <https://www.amazon.com/dp/B09XWXS3P3/> (Year: 2022).
  • “Hikmicro Pocket” from Amazon.com, first available Aug. 16, 2022 from the internet <https://www.amazon.com/HIKMICRO-Pocket1-Resolution-Thermal-4%C2%B0F-752%C2%B0F/dp/B0B319PFMN/> (Year: 2022).
Patent History
Patent number: D1093460
Type: Grant
Filed: Nov 28, 2021
Date of Patent: Sep 16, 2025
Assignee: Hangzhou Microimage Software Co., Ltd. (Zhejiang)
Inventor: Mengfei An (Zhejiang)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Lacey Chey Bowman
Application Number: 29/817,018
Classifications
Current U.S. Class: Video Type (D16/202)