Abstract: In a filler for tires containing silica particles and an aggregation inhibitor inhibiting the aggregation of the silica particles, the aggregation inhibitor contains at least one kind selected from the group consisting of phosphate and derivative thereof, amino alcohol, cationic surfactant, water-soluble aminosilane, nitrogen-containing heterocyclic compound, nonionic surfactant, tertiary amine compound, polyvinyl alcohol, non-zinc soap, saturated fatty acid ester, and glycerine fatty acid ester.

Abstract: A resin for an active energy ray curable ink contains a rosin-modified unsaturated polyester resin (A). The rosin-modified unsaturated polyester resin (A) is a reaction product of a material component containing rosins (a), ?,?-unsaturated carboxylic acids (b), and polyols (c); the mole ratio of an unsaturated bond based on the ?,?-unsaturated carboxylic acids (b) with respect to the total amount of the material component is 0.50 mol/kg or more and 2.00 mol/kg or less; the rosins (a) contain a stabilization-treated rosin at a ratio of 90 mass % or more with respect to the total amount of the rosins (a); the ?,?-unsaturated carboxylic acids (b) contain ?,?-unsaturated dicarboxylic acids; and the polyols (c) contain a trihydric or more alcohol.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A method for producing a resin for ink which includes reacting a lignin, a phenol, and an aldehyde so as to obtain a lignin-containing resol phenolic resin; and reacting the obtained lignin-containing resol phenolic resin with a rosin-based resin, and polyhydric alcohol.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, nickel and an additional element, the content ratios of the silver, the copper, the bismuth, the antimony, the indium, the nickel and the additional element, which is at least one of germanium, gallium, iron or phosphorus, are defined, the content ratio of the tin is the remaining ratio, and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less. In a further embodiment, the solder alloy additionally contains a defined amount of cobalt.

Abstract: An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio of 60% by mass or less in a 400° C. heating environment and exhibits a residual ratio of 1.0% by mass or less in a 520° C. heating environment.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A tackifier resin is a reaction product of rosins (A), a ring structure-containing compound (B) capable of reacting with the rosins, and an alcohol (C).

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.

Abstract: A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10 parts by mass or less of K—Al—F flux, 1 part by mass or more and 3 parts by mass or less of (meth)acrylic resin, wherein the mass ratio (Zn/Si) of Zn powder relative to Si powder is 1 or more and 5 or less.

Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.

Abstract: A papermaking chemical consisting of an aqueous solution of an acrylamide-based polymer, the acrylamide-based polymer being a polymer of a polymer component, wherein the polymer component comprises (meth)acrylamide, a quaternary ammonium-based monomer, and (meth)allylsulfonic acid salt, but does not include either a crosslinkable monomer containing nitrogen, or a tertiary amino-based monomer.

Abstract: The acrylamide-based polymer is produced by polymerizing a polymer component including (meth)acrylamide, a quaternary ammonium-based monomer, and (meth)allylsulfonic acid salt, but not including either a crosslinkable monomer containing nitrogen or a tertiary amino-based monomer.

Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A is 4.36 or less wherein A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.82×[Sb content ratio (mass %)].

Abstract: A resin for ink is obtained by reaction of a lignin, phenols, aldehydes, a rosin-based resin, and polyhydric alcohol.

Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.

Abstract: A polyacrylamide resin has at least one kind of a first unit represented by the following formulas (1) to (4) and a second unit represented by the following formula (5). (In the above-described formulas (1) to (4), R1 represents a hydrogen atom, a methyl group, an ethyl group, or a benzyl group; R2 and R3 are independent and represent a hydrogen atom, a methyl group, an ethyl group, or a benzyl group; and X represents an anion). (In the above-described formula (5), R4 represents a hydrogen atom or a methyl group and R5 represents a hydrogen atom, an alkali metal ion, or an ammonium ion).

Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt. Relative to a total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the copper content is 0.3 mass % or more and 1 mass % or less, the bismuth content is more than 4.8 mass % and 10 mass % or less, the antimony content is 3 mass % or more and 10 mass % or less, the cobalt content is 0.001 mass % or more and 0.3 mass % or less, and the tin content is the remaining portion.

Abstract: Agglomerated silica is obtained by mixing silica with a rosin resin to be agglomerated.

Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.