Abstract: A polyacrylamide resin has at least one kind of a first unit represented by the following formulas (1) to (4) and a second unit represented by the following formula (5). (In the above-described formulas (1) to (4), R1 represents a hydrogen atom, a methyl group, an ethyl group, or a benzyl group; R2 and R3 are independent and represent a hydrogen atom, a methyl group, an ethyl group, or a benzyl group; and X represents an anion.) (In the above-described formula (5), R4 represents a hydrogen atom or a methyl group and R5 represents a hydrogen atom, an alkali metal ion, or an ammonium ion.

Abstract: A metal fine particle dispersant is obtained by reaction of a polymer (a) containing a first reactive functional group, an ionic group to be absorbed to metal fine particles, and a polyoxyalkylene side chain with a compound (b) containing a second reactive functional group to be bonded to the first reactive functional group and an active energy ray curable group to be cured by an active energy ray. A metal fine particle dispersion liquid containing the metal fine particle dispersant, metal fine particles, and a dispersion medium is prepared. The metal fine particle dispersion liquid is cured, thereby obtaining a cured film.

Abstract: The acrylamide-based polymer is produced by polymerizing a polymer component including (meth)acrylamide, a quaternary ammonium-based monomer, and (meth)allylsulfonic acid salt, but not including either a crosslinkable monomer containing nitrogen or a tertiary amino-based monomer.

Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less. A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.

Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.

Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

Abstract: Agglomerated silica is obtained by mixing silica with a rosin resin to be agglomerated.

Abstract: An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio of 60% by mass or less in a 400° C. heating environment and exhibits a residual ratio of 1.0% by mass or less in a 520° C. heating environment.

Abstract: A metal fine particle dispersant is obtained by reaction of a polymer (a) containing a first reactive functional group, an ionic group to be absorbed to metal fine particles, and a polyoxyalkylene side chain with a compound (b) containing a second reactive functional group to be bonded to the first reactive functional group and an active energy ray curable group to be cured by an active energy ray. A metal fine particle dispersion liquid containing the metal fine particle dispersant, metal fine particles, and a dispersion medium is prepared. The metal fine particle dispersion liquid is cured, thereby obtaining a cured film.

Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.

Abstract: A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.

Abstract: A brazing composition contains 1 part by mass or more and 10 parts by mass or less of Zn powder, 1 part by mass or more and 5 parts by mass or less of Si powder, 3 parts by mass or more and 10 parts by mass or less of K—Al—F flux, 1 part by mass or more and 3 parts by mass or less of (meth)acrylic resin, wherein the mass ratio (Zn/Si) of Zn powder relative to Si powder is 1 or more and 5 or less.