Abstract: A heat dissipation device, having a base plate for making contact with a heat producing integrated circuit; several fins disposed on and partially covering the base plate, the fins forming flow channels and the fins and the flow channels having proximal ends and distal ends. The device also includes a fan mounted on the base plate for delivering air flow to the fins, the fan being configured to deliver air to the proximal ends of the fins. The device also includes a shroud disposed over the fins and the fan. The shroud has an aperture that has a shape generally matching the overall shape of the fan, where the aperture acts as an air inlet for the fan. The device also includes members for fastening the heat dissipation device against the heat producing integrated circuit. The fastening members hold in alignment the shroud and the base plate against a printed circuit board having the heat producing integrated circuit.