U-shaped condenser heat sink for low profile modules
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The generic circuit boards and the modules shown
The broken line showing on the drawing disclosure is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a U-shaped condenser heat sink for low profile modules, as shown and described.
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Type: Grant
Filed: Nov 26, 2013
Date of Patent: Feb 17, 2015
Assignee: Heatscape, Inc. (Morgan Hill, CA)
Inventors: Ali Mira (Morgan Hill, CA), Yashar Mira (Morgan Hill, CA), Michael Mira (Morgan Hill, CA)
Primary Examiner: Selina Sikder
Application Number: 29/473,920