Patents Assigned to Henkel Loctite Corporation
  • Publication number: 20040266940
    Abstract: The present invention relates to curable elastomer compositions and deformable thermoplastic compositions which are reshapable subsequent to cure or solidification. In particular, the present invention relates to compositions and articles of manufacture which are prepared from curable elastomeric or deformable thermoplastic matrices having distributed therein polymeric powders which have a melting point below the degradation of the matrix and which are present in shape-holding amounts to permit reshaping subsequent to elastomer cure.
    Type: Application
    Filed: November 24, 2003
    Publication date: December 30, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventor: Bahram Issari
  • Publication number: 20040261660
    Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
    Type: Application
    Filed: June 27, 2003
    Publication date: December 30, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
  • Publication number: 20040225045
    Abstract: The present invention relates to resin compositions, particularly those having a high degree of conductivity. In particular, the present invention relates to highly conductive die attach compositions useful for attaching semiconductor devices to carrier substrates. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: May 5, 2003
    Publication date: November 11, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventor: Deborah Derfelt Forray
  • Publication number: 20040166325
    Abstract: A molding composition that is particularly useful for coating and encapsulating electronic or electrical devices is disclosed. The molding composition exhibits improved flame retardancy and includes an epoxy resin, a hardener for the epoxy resin, and flame retardant compounds of melamine cyanurate and an oxyanion of a Group VIA element, such as tungsten trioxide.
    Type: Application
    Filed: August 19, 2003
    Publication date: August 26, 2004
    Applicant: Henkel Loctite Corporation
    Inventors: Anthony A. Gallo, Tom Raught
  • Publication number: 20040166241
    Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.
    Type: Application
    Filed: February 20, 2003
    Publication date: August 26, 2004
    Applicant: Henkel Loctite Corporation
    Inventors: Anthony A Gallo, Mark T. Dimke
  • Publication number: 20040127669
    Abstract: This invention provides a silicone resin composition giving a silicone cured rubber exhibiting a higher elongation percentage as well as improved heat resistance, oil resistance and chemical resistance, which are particularly required for automobile applications. A silicone cured rubber meeting the above physical property requirements can be prepared by moisture-curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (c) an organosilicon crosslinking agent, or alternatively by thermally curing a silicone resin composition including 100 wt parts of (a) an OH-containing polysiloxane, 0.1 to 200 wt parts of (b) a carbodiimide and (d) an amino-containing silane.
    Type: Application
    Filed: September 8, 2003
    Publication date: July 1, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Hideki Ueno, Hiroyuki Kayaki
  • Patent number: 6756465
    Abstract: A moisture curable compound for bonding substrates and a moisture curable adhesive composition are provided. The adhesive composition includes an alkoxysilane functional urethane compound having hydrolyzable alkoxysilane groups anchored on a flexible backbone. Also provided are processes for the preparation of the moisture curable compounds and a method of using them as moisture curable adhesives for bonding substrates to produce bonded composites.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: June 29, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Anthony Francis Jacobine, Steven Thomas Nakos
  • Publication number: 20040102566
    Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
    Type: Application
    Filed: June 12, 2003
    Publication date: May 27, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Deborah Derfelt Forray, Puwei Liu, Benedicto delos Santos
  • Publication number: 20040086719
    Abstract: In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.
    Type: Application
    Filed: November 5, 2002
    Publication date: May 6, 2004
    Applicant: Henkel Loctite Corporation
    Inventors: Bruce C. B. Chan, Michael G. Todd
  • Publication number: 20040082724
    Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and users for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.
    Type: Application
    Filed: July 1, 2003
    Publication date: April 29, 2004
    Applicant: Henkel Loctite Corporation
    Inventors: Stephen M. Dershem, Kevin J. Forrestal, Puwei Liu
  • Patent number: 6727320
    Abstract: The present invention relates to adhesive and sealant compositions in non-flowable form. More particularly, the present invention relates to non-flowable adhesive and sealant compositions which are particularly useful in the threadlocking and sealing applications and which can be packaged in a convenient pocket-sized applicator dispenser.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: April 27, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Shabbir Attarwala, Zhu Qinyan, Matthew P. Burdzy
  • Publication number: 20040077783
    Abstract: This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier material with which the initiator system is unreactive and which renders the composition having a flash point above 140° F. The inventive compositions desirably have a flash point above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure.
    Type: Application
    Filed: April 21, 2003
    Publication date: April 22, 2004
    Applicants: HENKEL LOCTITE CORPORATION, LOCTITE ( R&D) LIMITED
    Inventors: Eerik Maandi, Brendan J. Kneafsey
  • Patent number: 6723763
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: April 20, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Publication number: 20040069175
    Abstract: This invention relates to a visible light or UV/visible light and anaerobically curable composition for encapsulating the surface of the primer mix disposed in the primer cup, particularly for use in center fire ammunition.
    Type: Application
    Filed: May 5, 2003
    Publication date: April 15, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Shabbir Attarwala, Ronald E. Belek
  • Publication number: 20040063840
    Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.
    Type: Application
    Filed: September 22, 2003
    Publication date: April 1, 2004
    Applicant: Henkel Loctite Corporation
    Inventor: Dale Starkey
  • Publication number: 20040063800
    Abstract: This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.
    Type: Application
    Filed: September 16, 2002
    Publication date: April 1, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventors: Karen R. Brantl, Philp T. Klemarczyk
  • Patent number: 6712910
    Abstract: The present invention relates to heat curing impregnation sealant compositions, which are readily separable from water upon mixing.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: March 30, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Frederick F. Newberth, III, Charles M. Muisener, Stephen W. Ernst
  • Patent number: 6710021
    Abstract: Non-staining, active metal-working compositions are disclosed. The compositions contain active sulfur to provide extreme pressure properties for metal-working fluids. A metal corrosion inhibitor is disclosed that reduces the corrosivity of free sulfur on non-ferrous metallic objects.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: March 23, 2004
    Assignee: Henkel Loctite Corporation
    Inventor: Edward A. Y. Fisher
  • Patent number: 6706417
    Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: March 16, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Mark M. Konarski, Jeremy J. Bober
  • Publication number: 20040034116
    Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; a photoinitiator; and a luminescent and/or fluorescent dye.
    Type: Application
    Filed: January 31, 2003
    Publication date: February 19, 2004
    Applicant: HENKEL LOCTITE CORPORATION
    Inventor: Stan Wojciak