Abstract: Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, a curative based on the combination of nitrogen containing compounds and transition metal complexes, and a polysulfide toughening agent.

Abstract: Anaerobic adhesive compositions, the reaction products of which demonstrate improved cure speed and bond strength are disclosed. A high percentage of ultimate bond strength is reached within the first hour of room temperature cure. Higher ultimate bond strengths as compared to conventional compositions are achieved. The anaerobic adhesive compositions incorporate an adhesion promoter which contributes to these properties.

Abstract: The present invention is directed to low intensity UV curable adhesives formulated using a blend of acrylate oligomers and monomers which are capable of bonding glass, provide improved low-yellowing properties and fast cure speed over current glass bonding adhesives, while maintaining good bond strength lo and durability comparable to, or better than, state-of-the-art glass bonding adhesives.

Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: An anti-seize composition which is non-flowable and dimensionally stable at temperatures greater than about 120° F. and dispensable at room temperature without the application of heat is provided. The composition includes a solid anti-seize lubricant, such as of metallic copper, metallic nickel, metallic aluminum, metallic lead, metallic zinc, graphite, calcium oxide, calcium carbonate, calcium fluoride, calcium stearate, lithium, molybdenum disulfide, boron nitride, barium sulfate, or combinations thereof. The anti-seize lubricant is dispersed in a carrier which is a solid at about room temperature. The carrier includes a grease with an ASTM D 217 penetration at 25° C. from about 200 to about 400 mm, a matrix material, and a naphthenic petroleum oil having a viscosity of less than about 300 SUS at 100° F. and having an API gravity at 60° F. from about 23 to about 25. The matrix material is a polymeric material. Optionally, a refined petroleum wax may also be included.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: An alkoxylate adduct of a polyol. The polyol is an amorphous diol having a melting point above about 100° C. The alkoxylate is propylene oxide, butylene oxide, a mixture of propylene oxide and butylene oxide or a mixture of one or both of propylene oxide and butylene oxide with up to 50 mole % of ethylene oxide. The first polyol has an average of from about 1 to about 5 units of alkoxylate per mole of said amorphous diol. The adduct is useful in preparing urethane (meth)acrylate capped resins and compositions thereof. Resins prepared from such adducts have better manufacturing and solubility properties while retaining similar physical properties to resins prepared from the unadducted diol. The adduct may be for instance a propoxylate of hydrogenated bisphenol A having an average of from 1.5 to 3.5 moles of PO per mole of hydrogenated bisphenol A.

Abstract: A UV curing lamp assembly permits adjustable positioning of a UV curing lamp with respect to a bracket supporting a reflector. The assembly includes an elongate UV lamp having opposed ends. A reflector having a central base and a curved reflective wall includes a pair of opposed openings through the reflector wall for passage of the UV lamp therethough. A bracket adjustably supports the reflector and the lamp. The bracket includes a bracket body movably supporting a mounting member for adjustably supporting the reflector with respect to the bracket body. A support arm extends from the bracket body towards one of the openings in the reflector. The support arm adjustably supports one of the ends of the UV lamp with respect to the reflector.

Abstract: In accordance with the present invention, there are provided free-radical polymerizable compositions comprising polycyclic olefins, wherein the polycyclic olefins contain little, if any, cyclopentenyl unsaturation. As a result, these olefins are sufficiently reactive with the propagating free-radicals during cure to provide a highly crosslinked thermoset resin. Moreover, invention compositions comprise high molecular weight polycyclic olefins having low volatility. Accordingly, the observed undesirable weight loss upon cure of prior art thermosetting compositions is considerably reduced. Further provided by the present invention are compositions comprising functionalized polycyclic olefin monomers. These functionalized olefin monomers provide additional benefits such as increased adhesion to a variety of surfaces and greater control over glass transition temperatures.

Abstract: An aerosol solvent and co-solvent system provides for a more miscible fluorinated oil composition so that typical oil additives such as anti-wear, extreme pressure, lubricity additives, corrosion inhibitors, and oxidation inhibitors may be combined with perfluorinated and highly fluorinated oils.

Abstract: Multi-component compositions comprising as a first component a fluorinated compound, as a second component a fluorinated aromatic compound and a third component comprising an alkane are disclosed. These compositions can be formulated to provide single phase systems which serve as effective solvents for fluorinated oils as well as petroleum oils. The compositions can serve as solvent cleaners or can be combined directly with oils to provide a delivery system for the oil.

Abstract: This invention relates to cyanoacrylate-containing compositions that include, in addition to the cyanoacrylate component, the combination of two accelerators to improve fixture speeds on certain substrates.

Abstract: Compositions and methods for inhibiting corrosion of metallic surfaces are disclosed. The corrosion-inhibiting compositions are cost efficient, easy to use and can be conveniently removed or replaced. The corrosion-inhibiting compositions include a putty-like base material that is pliable and has sufficient tackiness to be securely affixed to surfaces. Corrosion inhibiting compounds are combined with the base material. These compositions provide a vapor phase corrosion inhibitor for both direct and indirect contact with metallic objects.

Abstract: The present invention provides UV/anaerobic dual cure adhesives, particularly well-suited for sealing the ring around the primer cup in center fire ammunition by UV cure and the primer cup in the cartridge by anaerobic cure.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: The present invention relates to dual curing silicone compositions which are capable of cross-linking when subjected to ultraviolet (“UV”) or visible (“VIS”) light and/or by a moisture condensation method. When cured, these compositions have excellent adhesion to a variety of substrates. These are particularly useful in potting and coating applications.

Abstract: A methacrylate ester or acrylate ester two-part reactive adhesive composition including vinyl-terminated liquid rubber and polymeric elastomer. The vinyl-terminated liquid rubber is preferably methacrylate-terminated or acrylate-terminated polybutadiene; the polymeric elastomer is preferably polychloroprene, core shell polymer and/or block copolymer rubber.