Abstract: A catalyst comprising a plurality of catalyst gauzes that are arranged in series is provided. Each catalyst gauze is made of a first noble-metal-containing wire and a second noble-metal-containing wire which is embedded in the catalyst gauze and which gives the catalyst gauze a preferential direction. The catalyst gauzes according to the invention are arranged in series such that the angles between the preferential directions of neighboring catalyst gauzes ranges from 0° to 180°. The catalyst ensures a product yield that is reproducible over time and has a long service life.

Abstract: A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 ?m. The wire has a diameter in the range of from 100 ?m to 600 ?m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

Abstract: An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.

Abstract: The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 ?m to 600 ?m. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.

Abstract: A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than 200° C., producing stable contact points having low porosity and high electrical and thermal conductivity. The method includes (a) providing a sandwich arrangement having at least a first component, a second component, and a metal paste located between the first and second components, and (b) sintering the sandwich arrangement. The metal paste includes (A) 75-90 wt. % of at least one metal present in the form of particles having an organic compound-containing coating, (B) 0-12wt % of at least one metal precursor, (C) 6-20wt % of at least one solvent, and (D) 0.1-15 wt % of at least one sintering agent selected from (i) salts of C1-C4 organic acids, (ii) esters of C1-C4 organic acids, and (iii) carbonyl complexes.

Abstract: A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids.

Abstract: Known textile flat structures contain precious metal wire or they are composed completely thereof. In order to achieve high flexural and tensile strength, at the same time with high flexibility of the flat structure, the precious metal wire is configured as a precious metal cord having a plurality of cords or a plurality of individual precious metal wires or a combination of cords and individual precious metal wires, which are in each case laid around one another and/or twisted around one another.

Abstract: A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.

Abstract: A wire is provided for producing a sliding contact, wherein at least an inner core of the wire consists of a copper-silver alloy. A sliding contact is also provided having at least one such wire, wherein a counter-contact is provided whose conductive surface has at least one of the wires touch against it. The spring force of the wire acting on the conductive surface of the counter-contact effects electrical contacting between the wire and the counter-contact and the counter-contact is mobile with respect to the wire, such that the surface of the wire slides over the counter-contact when the counter-contact moves. Components having the sliding contact are also provided, including a potentiometric sensor, potentiometer, sliding dolly regulator, position sensor, rotary switch, electrical motor, generator, wind turbine, slip ring system, actuator, or current collector.

Abstract: A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties: I. an average size of crystal grains of the core is between 0.8 ?m and 3 ?m, II. the amount of crystal grains having an orientation in the <001> direction in a wire cross section is in a range of 10-20%, III. the amount of crystal grains having an orientation in the <111> direction in a wire cross section is in a range of 5-15%, and IV. the total amount of crystal grains having orientations in the <001> and <111> directions in a wire cross section is in a range of 15-40%.

Abstract: A catalyst comprising a plurality of catalyst gauzes that are arranged in series is provided. Each catalyst gauze is made of a first noble-metal-containing wire and a second noble-metal-containing wire which is embedded in the catalyst gauze and which gives the catalyst gauze a preferential direction. The catalyst gauzes according to the invention are arranged in series such that the angles between the preferential directions of neighboring catalyst gauzes are between 0° and 180°. The catalyst ensures a product yield that is reproducible over time and has a long service life.

Abstract: A catalyst comprising a plurality of catalyst gauzes that are arranged in series is provided. Each catalyst gauze is made of a first noble-metal-containing wire and a second noble-metal-containing wire which is embedded in the catalyst gauze and which gives the catalyst gauze a preferential direction. The catalyst gauzes according to the invention are arranged in series such that the angles between the preferential directions of neighboring catalyst gauzes ranges from 0° to 180°. The catalyst ensures a product yield that is reproducible over time and has a long service life.

Abstract: The addition of 0.5 to 30 ppm boron and 0.5 to 20 ppm calcium to iridium and the Zr- and Hf-free alloys thereof and rhodium and the Zr- and Hf-free alloys thereof surprisingly increases the creep rupture strength at high temperatures, in particular around 1,800° C.

Abstract: A method for producing a laminate made up of at least two films/foils is provided. At least one first film/foil is structured and subsequently laminated to at least one second film/foil. The at least one second film/foil is punched by at least one tool in a single working step and is laminated to the structured first film/foil simultaneously. The films/foils are conveyed, at least part of the time, to the at least one tool. A laminate produced according to such a method and a device for producing a laminate using such a method are also provided. The device is suited for conveying and laminating the at least one first and second films/foils, wherein regions of the films/foils are aligned to be parallel with respect to each other. The device includes at least one tool that can be used to punch-laminate second film/foil onto the first film/foil.

Abstract: A TFT structure is provided in which an oxidic semiconductor is used in combination with an electrode material based on a Cu alloy.

Abstract: Planar or tubular sputtering targets made of a silver base alloy and at least one further alloy component selected from indium, tin, antimony, and bismuth accounting jointly for a weight fraction of 0.01 to 5.0% by weight are known. However, moving on to ever larger targets, spark discharges are evident and often lead to losses especially in the production of large and high-resolution displays having comparatively small pixels. For producing a sputtering target with a large surface area on the basis of a silver alloy of this type, which has a surface area of more than 0.3 m2 as a planar sputtering target and has a length of at least 1.0 m as a tubular sputtering target, and in which the danger of spark discharges is reduced and thus a sputtering process with comparatively high power density is made feasible, the invention proposes that the silver base alloy has a crystalline structure with a mean grain size of less than 120 ?m, an oxygen content of less than 50 wt.

Abstract: A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.

Abstract: The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component.

Abstract: A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.

Abstract: Methods for reducing the evaporation rate of platinum and Pt alloys upon their use at high temperatures >1,200° C. in an oxidizing atmosphere include the steps: (A) providing a component made of platinum or a platinum alloy; (B) wrapping the outer surface of the component with a flexible bandage having open porosity and provided with an oxide ceramic material and/or a glass-forming material; (C) using the component at operating temperatures >1,200° C. Methods for scavenging noble metal oxides evaporating or sublimating from the surface of platinum or Pt alloys include: (A) providing a component made of platinum or a platinum alloy; (B) wrapping the outer surface of the component with a flexible bandage having open porosity; and (C) using the component at operating temperatures >1,200° C. Correspondingly wrapped components are also provided.