Abstract: A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

Abstract: A new apparatus of plural charged particle beams with multi-axis magnetic lenses is provided, which comprises a plurality of sub-columns The apparatus employs two modified multi-axis magnetic lenses, and magnetic sub-lenses thereof therefore function as the objective lenses and the condenser lenses of all the sub-columns respectively. The plurality of sub-columns can perform the same function or different functions required for observing a surface of a specimen, such as high-throughput inspection and high-resolution review of interested features thereon. Accordingly, the apparatus can be used as a yield management tool in semiconductor manufacturing industry.

Abstract: A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.

Abstract: The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

Abstract: A selectable Coulomb aperture in charged particle system comprises a non-magnetic conductive plate with a plurality of holes therein. The plurality of holes has variant sizes or diameters to select different beam currents of primary beam in the charged particle system. The charged particle system may include a charged particle source for emitting a primary beam, a condenser lens for receiving the primary beam and condensing the primary beam, an objective lens for receiving the primary beam and focusing the primary beam on a surface of a specimen. The selectable Coulomb aperture is positioned between the charged particle source and the condenser lens.

Abstract: A system for operating EUV mask stored in reticle SMIF pod and/or dual pod is provided, wherein the reticle SMIF pod and Dual pod are for storing EUV mask. The system can be a sorter for EUV mask transferred from reticle SMIF pod into dual pod, and vice versa, or an operating system for tools relating to EUV mask, wherein the tools may be EUV lithography, or inspection tool for inspecting EUV mask.

Abstract: The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

Abstract: A cellular-type PD unit is proposed and a plurality of the cellular-type PD units is used in pairs in a multi-axis magnetic lens for focusing a plurality of charged beams. First type PD units or second type PD units (called as hybrid PD unit as well) can be applied to cellular-type PD units to flexibly construct sub-lenses. Furthermore, magnetic shielding plates with a plurality of through openings can be placed above and/or below the multi-axis magnetic lens to make magnetic flux leaking out of the multi-axis magnetic lens vanish away rapidly outside the magnetic shielding plates.

Abstract: An assembly for a charged particle detection unit is described. The assembly comprises a scintillator disc, a partially coated light guide a thin metal tube for allowing the primary charged particle beam to pass through and a photomultiplier tube (PMT). The shape of scintillator disc and light guide are redesigned to improved the light signal transmission thereafter enhance the light collection efficiency. A light guide with a conicoidal surface over an embedded scintillator improved the light collection efficiency of 34% over a conventional design.

Abstract: A method, apparatus and computer readable medium for charged particle beam inspection of a sample comprising at least one sampling region and at least one skip region is disclosed. The method, apparatus and computer readable medium comprise receiving an imaging recipe which at least comprises information of the area of the sampling and skip regions; calculating a default stage speed according to the imaging recipe; calculating an alternative stage speed at least according to the default stage speed, the sampling region area information, and the skip region area information; calculating at least one imaging scan compensation offset at least according to the alternative stage speed; and inspecting the sample at the alternative stage speed while adjusting the motion of the charged particle beam according to the imaging scan compensation offsets, such that the charged particle beam tightly follows the motion of the stage and images only the sampling regions on the sample.

Abstract: A cellular-type PD unit is proposed and a plurality of the cellular-type PD units is used in pairs in a multi-axis magnetic lens for focusing a plurality of charged beams. First type PD units or second type PD units (called as hybrid PD unit as well) can be applied to cellular-type PD units to flexibly construct sub-lenses. Furthermore, magnetic shielding plates with a plurality of through openings can be placed above and/or below the multi-axis magnetic lens to make magnetic flux leaking out of the multi-axis magnetic lens vanish away rapidly outside the magnetic shielding plates.

Abstract: This invention provides a multi-pole type Wien filter, which acts more purely approaching its fundamentally expected performance. A 12-electrode electric device acts as an electric deflector,or acts as an electric deflector and an electric stigmator together. A cylindrical 4-coil magnetic device with a magnetic core acts as a magnetic deflector. Both can produce a dipole field while only incurring a negligibly-small 3rd order field harmonic. The magnetic core enhances the strength and more preciously regulates the distribution of the magnetic field originally generated by the coils. Then two ways to construct a Wien filter are proposed. One way is based on both of the foregoing electric and magnetic devices, and the other way is based on the foregoing electric device and a conventional magnetic deflector. The astigmatism in each of such Wien filters can be compensated by the electric stigmator of the electric device.

Abstract: This invention provides a multi-pole type Wien filter, which acts more purely approaching its fundamentally expected performance. A 12-electrode electric device acts as an electric deflector, or acts as an electric deflector and an electric stigmator together. A cylindrical 4-coil magnetic device with a magnetic core acts as a magnetic deflector. Both can produce a dipole field while only incurring a negligibly-small 3rd order field harmonic. The magnetic core enhances the strength and more preciously regulates the distribution of the magnetic field originally generated by the coils. Then two ways to construct a Wien filter are proposed. One way is based on both of the foregoing electric and magnetic devices, and the other way is based on the foregoing electric device and a conventional magnetic deflector. The astigmatism in each of such Wien filters can be compensated by the electric stigmator of the electric device.

Abstract: This invention provides a design of Wien filter for satisfying Wien Condition so as to ensure the Wien filter's performance. At first, to minimize the magnetic flux leaking out of the Wien filter, the invention proposes three measures to form a magnetic circuit to cover the magnetic device of a Wien filter respectively. The measures especially benefit a Wien filter acting as beam separator or Monochromator in a high resolution SEM. Secondly, based on the Wien filter proposed in cross-reference, several ways are provided for reducing the dissatisfaction of Wien Condition within the Wien filter, which especially modify either or both of the distribution shapes of the on-axis electric and magnetic dipole fields at two ends of the Wien filter. These ways provide more flexibility to reduce the dissatisfaction of Wien Condition in a Wien filter to a given degree at a reasonable manufacturing cost.

Abstract: An electron gun comprises an electron emitter, an electrode surrounding the electron emitter, an extraction electrode, and a double condenser lens assembly, the double condenser lens assembly comprising a magnetic immersion pre-condenser lens and a condenser lens. In combination with a probe forming objective lens, the electron gun apparatus can provide an electron beam of independently adjustable probe size and probe current, as is desirable in electron beam applications. The electron emitter is immersed in the magnetic field generated by a magnetic type pre-condenser lens. When activated, the pre-condenser lens collimates the beam effectively to increase its angular intensity while at the same time enlarging the virtual source as compared with non-immersion case, due to geometric magnification and aberrations of its lens action. The pre-condenser lens is followed by a condenser lens.

Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.

Abstract: System and method for charged particle beam. According an embodiment, the present invention provides a charged particle beam apparatus. The apparatus includes a charged particle source for generating a primary charged particle beam. The apparatus also includes at least one condenser lens for pre-focusing the primary charge particle beam. Furthermore, the apparatus includes a compound objective lens for forming the magnetic field and the electrostatic field to focus the primary charged particle beam onto a specimen in the charged particle beam path. The specimen includes a specimen surface. The compound objective lens includes a conical magnetic lens, an immersion magnetic lens, and an electrostatic lens, the conical magnetic lens including an upper pole piece, a shared pole piece being electrically insulated from the upper pole piece, and an excitation coil.

Abstract: The present invention discloses a structure and method for determining a defect in integrated circuit manufacturing process, wherein the structure comprises a plurality of normal active areas formed in a plurality of first arrays and a plurality of defective active areas formed in a plurality of second arrays. The first arrays and second arrays are interlaced, and the defect is determined by monitoring a voltage contrast from a charged particle microscope image of the active areas.

Abstract: A method, apparatus and computer readable medium for charged particle beam inspection of a sample comprising at least one sampling region and at least one skip region is disclosed. The method, apparatus and computer readable medium comprise receiving an imaging recipe which at least comprises information of the area of the sampling and skip regions; calculating a default stage speed according to the imaging recipe; calculating an alternative stage speed at least according to the default stage speed, the sampling region area information, and the skip region area information; calculating at least one imaging scan compensation offset at least according to the alternative stage speed; and inspecting the sample at the alternative stage speed while adjusting the motion of the charged particle beam according to the imaging scan compensation offsets, such that the charged particle beam tightly follows the motion of the stage and images only the sampling regions on the sample.

Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.