Patents Assigned to Hexcel Composites
  • Publication number: 20120301665
    Abstract: A structural panel comprising an internal core material having first and second opposing faces, first and second face sheets bonded to the first and second opposing faces respectively, wherein the panel comprises an open-structured sheet, interposed between a first face of the core material and its respective face sheet and the panel comprises less than 200 gsm adhesive.
    Type: Application
    Filed: January 17, 2011
    Publication date: November 29, 2012
    Applicants: HEXCEL COMPOSITES, S.A.S., HEXCEL COMPOSITES, LTD
    Inventors: Steve Mortimer, Emille Legoff, Bertrand Germain, Clement Casaliggi, Sarah Lasfargues
  • Publication number: 20120296009
    Abstract: A one-component syntactic paste comprising epoxy resin, hollow particles and a hydrazide curing agent.
    Type: Application
    Filed: November 3, 2010
    Publication date: November 22, 2012
    Applicant: HEXCEL COMPOSITES LIMITED
    Inventors: Matthew Cleaver, Rhian Lewis
  • Patent number: 8313825
    Abstract: A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: November 20, 2012
    Assignees: Hexcel Composites Limited, Conductive Inkjet Technology Limited
    Inventors: Martin Simmons, John Leslie Cawse, Ian Rees, Xiuyan Sun
  • Publication number: 20120282434
    Abstract: Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent. The resins have reduced levels of solvent-induced micro crack formation and do not lose their adhesiveness when attacked by solvent. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause reductions in solvent-induced micro crack formation and solvent-induced loss of adhesiveness when compared to the same toughened thermosetting resin in which a non-irradiated version of the thermoplastic toughening agent is used.
    Type: Application
    Filed: October 7, 2009
    Publication date: November 8, 2012
    Applicant: HEXCEL COMPOSITES, LTD.
    Inventors: John L. Cawse, Stephen Mortimer
  • Patent number: 8304080
    Abstract: A resin composition that is storable at ambient temperatures. The resin composition forms a cured resin when exposed to a curing agent and heated to a curing temperature that is relatively close to ambient temperature. The resin composition includes a crystalline resin component that is sandwiched between two non-crystalline resin components to provide a zone that is rich in crystalline thermosetting resin. The crystalline thermosetting resin has a melting point that is above ambient temperature, but below the curing temperature. The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: November 6, 2012
    Assignee: Hexcel Composites Ltd.
    Inventors: Chris Harrington, Philip C. Hadley
  • Patent number: 8263503
    Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: September 11, 2012
    Assignee: Hexcel Composites, Ltd.
    Inventors: John L. Cawse, Martin Simmons, George Green
  • Publication number: 20120219745
    Abstract: A curable flexible electromagnetic hazard resistance laminate, comprising a layer of electrically conductive metal material and thermosetting resin, wherein a first external face of the laminate comprises a releasable backing sheet in contact with resin, and a second external face of the laminate comprises resin, wherein the second external face has greater adhesiveness than the first external face with the backing sheet removed.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 30, 2012
    Applicant: Hexcel Composites Limited
    Inventors: Emilie Fisset, John Ellis, Paul MacKenzie
  • Publication number: 20120219775
    Abstract: A curable flexible electromagnetic hazard resistance laminate, comprising a layer of electrically conductive metal material and thermosetting resin, wherein an external face of the laminate comprises a releasable backing sheet in contact with resin, and the laminate further comprises a substantially non-reshapable sheet of solid material.
    Type: Application
    Filed: September 19, 2010
    Publication date: August 30, 2012
    Applicant: Hexcel Composites Limited
    Inventors: Emilie Fisset, John Ellis, Paul Mackenzie
  • Patent number: 8220821
    Abstract: An uncured fiber reinforced assembly that includes a reinforcement layer containing a fibrous material and at least one highly reactive curing agent. A matrix film layer is applied to the reinforcement layer so that it does not substantially impregnate the reinforcement layer. The matrix film layer includes at least one uncured epoxy resin and at least one latent epoxy curing agent. The assembly is designed for use in making snowboards and skis.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: July 17, 2012
    Assignee: Hexcel Composites, Ltd.
    Inventors: Killian O'Byrne, Phlip C. Hadley, Chris Harrington
  • Publication number: 20120146256
    Abstract: The processing window for thermosetting resins that contain particulate hardeners is prolonged using the combined steps of heat-treating the resin to form a low-viscosity resin mixture in which the particles are dissolved and then moulding the low-viscosity resin mixture at temperatures below the dissolution temperature of the particles to infuse a fibrous preform. The infused resin preform is heated to the curing temperature of the resin to provide final curing of the resin.
    Type: Application
    Filed: September 14, 2009
    Publication date: June 14, 2012
    Applicants: HEXCEL COMPOSITES, S.A.S, HEXCEL COMPOSITES, LTD.
    Inventors: Stephen Mortimer, Neal Patel, Estaban Vilalon
  • Publication number: 20120141763
    Abstract: A curable prepreg comprising a structural layer of conductive fibres and a first outer layer of thermosetting resin, the resin layer comprising thermoplastic particles and glassy carbon particles provides improved electrical conductivity and excellent mechanical properties.
    Type: Application
    Filed: September 2, 2010
    Publication date: June 7, 2012
    Applicant: HEXCEL COMPOSITES, LTD.
    Inventors: John Cawse, Martin Simmons
  • Publication number: 20120114899
    Abstract: A curable prepreg or semipreg material comprising a layer of fibres and a substantially non-flowable curable resin having a layer of porous sheet material on an outer surface, the material allows automatic lay-up of high fibre content prepregs or semiprepregs typically used in industrial applications such as wind turbine blades.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 10, 2012
    Applicant: Hexcel Composites, Ltd.
    Inventor: John Ellis
  • Publication number: 20120100335
    Abstract: A prepreg comprising a structural layer of packed unidirectional conductive fibres comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and being essentially free of unidirectional conductive fibres, which when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed unidirectional conductive fibres and a first outer layer of cured resin comprising unidirectional conductive fibres dispersed within.
    Type: Application
    Filed: June 25, 2010
    Publication date: April 26, 2012
    Applicant: HEXCEL COMPOSITES LIMITED
    Inventors: John Ellis, Emille Fisset, David Tilbrook, Paul Mackenzie
  • Publication number: 20120100362
    Abstract: A process for the manufacture of a prepreg comprising feeding a layer of unidirectional conductive fibres having a defined width, bringing into contact with a first face of the fibres a first layer of resin comprising thermosetting resin, and compressing the resin and fibres together by passing over one or more impregnation rollers, wherein the pressure exerted onto the conductive fibres and resin does not exceed 40 kg per centimetre of the width of the conductive fibres, and the resin being in sufficient amount for the resin to enter the interstices of the fibres and leave a first outer layer of resin essentially free of unidirectional conductive fibres.
    Type: Application
    Filed: June 25, 2010
    Publication date: April 26, 2012
    Applicants: Hexcel Composites, S.A.S, Hexcel Composites Ltd.
    Inventors: John Ellis, Emille Fisset, David Tilbrook, Paul MacKenzie, Isabelle Blanc, Lucien Fiore, Bernadette Tizon
  • Publication number: 20120052284
    Abstract: A resin composition that is storable at ambient temperatures. The resin composition forms a cured resin when exposed to a curing agent and heated to a curing temperature that is relatively close to ambient temperature. The resin composition includes a resin component that is composed of a liquid part that is made up of one or more liquid thermosetting resins and a solid part that includes particles of one or more solid thermosetting resins. The liquid part further includes a gelation agent that is present in a sufficient amount to maintain the particles in suspension within the liquid part at ambient temperatures. The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature. The high viscosity state is substantially more viscous than the low viscosity state.
    Type: Application
    Filed: November 8, 2011
    Publication date: March 1, 2012
    Applicant: Hexcel Composites, Ltd.
    Inventors: Chris Harrington, Philip C. Hadley
  • Patent number: 8105964
    Abstract: A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: January 31, 2012
    Assignee: Hexcel Composites, Ltd.
    Inventors: John L. Cawse, Martin Simmons, George Green
  • Patent number: 8101106
    Abstract: Molding material that includes a layer of fibrous reinforcing material having one surface on which a first layer of a resin partially impregnates the fibrous material and a further resin layer located on the opposite surface which retains in position surface fibers of the fibrous material. The further resin layer is of lower weight than the first layer and is formed as an openwork structure with a solid part and spaces through which the fibrous material is exposed.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: January 24, 2012
    Assignee: Hexcel Composites, Ltd.
    Inventor: John Ellis
  • Patent number: 8097333
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: January 17, 2012
    Assignees: Hexcel Corporation, Hexcel Composites, Ltd.
    Inventors: David Tilbrook, Dana Blair, Maureen Boyle, Paul Mackenzie
  • Patent number: 8071207
    Abstract: A resin composition that is storable at ambient temperatures. The resin composition forms a cured resin when exposed to a curing agent and heated to a curing temperature that is relatively close to ambient temperature. The resin composition includes a resin component that is composed of a liquid part that is made up of one or more liquid thermosetting resins and a solid part that includes particles of one or more solid thermosetting resins. The liquid part further includes a gelation agent that is present in a sufficient amount to maintain the particles in suspension within the liquid part at ambient temperatures. The viscosity of the resin component changes from a high viscosity state to a low viscosity state when the temperature is increased from ambient temperature to the curing temperature. The high viscosity state is substantially more viscous than the low viscosity state.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: December 6, 2011
    Assignee: Hexcel Composites Limited
    Inventors: Chris Harrington, Philip C. Hadley
  • Publication number: 20110294387
    Abstract: One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles. The structured thermoplastic polymer may be coated with a conductive material to improve electrical conductivity through the laminate.
    Type: Application
    Filed: June 22, 2011
    Publication date: December 1, 2011
    Applicant: Hexcel Composites, Ltd.
    Inventors: Martin Simmons, Dana Blair, Steve Mortimer