Abstract: Process for forming a permanent join between two sections of fibrous material contained in a thermosetting resin matrix, said process comprising overlaying the two sections and subjecting the overlaid sections to ultrasonic welding to form a permanent join between the two sections, wherein there is no significant change in the sub-ambient Tg of the fibrous material contained in the thermosetting resin matrix in the region of the permanent join.

Abstract: The invention relates to a resin infusion process wherein a curable flowing fluid resin composition is supplied to form a curable matrix around a fibrous reinforcement material, wherein the curable flowing fluid resin composition comprises a resin component (1) and an activator component (2), and at least one property of the curable flowing fluid resin composition is monitored prior to supply.

Abstract: The invention relates to a particulate curing component for a thermosetting resin, the particulate curing component comprising particles of a solid resin, wherein a curative for the thermosetting resin is dispersed within the particles of solid resin. The invention also relates to methods of forming particulate curing components and compositions comprising particulate curing components.

Abstract: The present invention relates to a composite material (10) comprising a layer of electrically conductive material (12) being provided on both sides with a lightweight fibrous veil (14), each veil (14) being coated on its surface remote from the electrically conductive material layer (12) with a curable thermosetting resin matrix material (16).

Abstract: The invention relates to a prepreg comprising a structural layer of conductive fibres comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and comprising a population of conductive free filaments located at the interface between the structural layer and the outer resin layer which, when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed conductive fibres and a first outer layer of cured resin, the outer layer of cured resin, comprising a proportion of the population of conductive free filaments dispersed therein, and to a process for manufacturing prepregs wherein the electrically conductive fibres pass a fibre disrupting means to cause a proportion of the fibres on an external face of the sheet to become free filaments.

Abstract: A curable sheet-like composite material comprising a layer of curable resin and at least one layer of structural fibres and comprising an outer backing layer of substantially resin-free material which is gas permeable but is substantially non-permeable with respect to the curable resin at room temperature.

Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl]4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.

Abstract: One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles.

Abstract: Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.

Abstract: A method of controlling a process for the manufacture of a multicomponent sheet material having a desired pre-determined parameter comprising applying electromagnetic energy to interact with the sheet material whereby the interaction modifies the applied energy, detecting the modified energy, comparing the modified energy or data derived from it with data relating to the pre-determined parameter and modifying at least one step of the process whereby the data relating to the modified energy is modified towards the data relating to the pre-determined parameter.

Abstract: Epoxy formulations comprising a polyfunctional epoxy resin, a solid bisphenol A epoxy resin, a phenolic end capped bisphenol A resin, a rubber epoxy adduct and a curative are provided as is their use in prepregs and as matrix materials in laminates of metal foil and fiber reinforced epoxy resins.

Abstract: An adhesive composition comprising an aromatic epoxy resin, an epoxy resin rubber adduct, an amine curing agent; and optionally one or more of an oil absorbent, a corrosion inhibitor and a urone accelerator, wherein the adhesive composition is curable at 150° C. in no more than 210 seconds.

Abstract: This invention relates to an additive for a thermoset resin matrix having a core and a reactive cross-linked thermoset coating. The reactive cross-linked thermoset coating is the reaction product of a thermoset resin and a curative in a dispersant.

Abstract: One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles. The structured thermoplastic polymer may be coated with a conductive material to improve electrical conductivity through the laminate.

Abstract: A strip of curable prepreg comprising unidirectional fibers aligned with the length of the strip, the fibers being at least partially impregnated with curable thermosetting resin and comprising a flexible polymeric sheet on an outer face of the strip, wherein the strip has a substantially rectangular cross-section defining a width and a thickness of the strip.

Abstract: Laminar structures comprising a fiber reinforced layer bonded to an expandable filler containing layer to provide improved flexural stiffness to weight ratio at lower fiber loading; a process for the manufacture of the laminar structures in which the material are selected so that migration of the expandable filler into the fiber structure of the fiber reinforced layer as they expand is minimized or prevented.

Abstract: A molding material comprising a fibrous reinforcement layer and a curable resin matrix. The fibrous reinforcement layer comprises a non-woven fabric comprising a single layer of unidirectional tows arranged at an angle greater than 0° in relation to the lengthwise direction of the fabric and a support structure for maintaining the arrangement of the tows.

Abstract: This invention relates to an epoxy resin formulation containing a curative that can be cured at 150° C. to 95% cure in no more than 150 seconds, and can be cured at 120° C. to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140° C. wherein the formulation further contains a mould release agent.

Abstract: A method of separating a composite material stack comprising multiple elements (12) in contact with one another is discloses. Each element (12) comprises reinforcement fibers and an uncured resin matrix, and the method comprises the steps of temperature treating the stack and/or applying a stress to the stack to separate the elements.

Abstract: Preforms for use in molding composite parts are made directly from composite chips that are composed of fibers and an uncured thermosetting resin. Cold composite chips are formed into a stream of non-agglomerating chips that is used to fill the cavity of a preform tool. The non-agglomerating chips flow into the preform tool cavity to form a population of non-cohesive composite chips. The non-cohesive composite chips are then heated to form a preform made up of a consolidated population of cohesive composite chips in which the non-sticky uncured thermosetting resin of the non-cohesive chips has been converted to a sticky uncured thermosetting resin.