Abstract: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and ?-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

Abstract: The present disclosure relates to the isolation of a novel reagent selected for its binding characteristics to the proteins internalin B or internalin A. InIB is a surface-localized protein of Listeria monocytogenes that binds and activates the receptor tyrosine kinase Met. InIB promotes invasion of a number of cells including hepatocytes, endothelial and epithelial cell lines and causes activation of the actin-mediated internalization of the bacterium. InIA belongs to a large group of surface-localized leucine-rich repeat (LRR) proteins identified in the Listeria genome. InIA enables Listeria monocytogenes to invade non-phagocytic cells such as those of the human intestinal epithelium and is sufficient for adhesion to and inducing uptake into epithelial cells.

Abstract: A method for predicting patient responsiveness to rheumatoid arthritis treatments involving altering expression of tumor necrosis factor superfamily (“TNFSF”)-2, TNFSF-8, or TNFSF-15 is disclosed. A method for monitoring the effectiveness of such therapy is also disclosed. Furthermore, a method of screening compounds for use in the treatment of rheumatoid arthritis is disclosed. A method of monitoring the disease state over time in rheumatoid arthritis patients is also disclosed.

Abstract: A method is provided for performing a reaction, such as the synthesis of concentrated cDNA, in the wells of a microplate while minimizing the volume of the solution of reagents required to perform the reaction. In the method, a pestle is inserted into the well of a microplate to which a substance has been immobilized. A volume of reagent solution is introduced into the well that is insufficient to cover the portion of the well onto which the substance is immobilized. The insertion of the pestle displaces reagent solution and increases the surface area of the solution in contact with the portion of the well to which the substance has been immobilized when the pestle is inserted.

Abstract: The invention provides an optical resin composition being transparent, having suitable adhesion and necessary impact absorption for protection of an image display device etc., not affecting constituent materials of a image display panel, and being excellent in reliability, and an optical resin material using the same. Disclosed is an optical resin composition containing (A) a first acrylate derivative that is a compound having one polymerizable unsaturated bond in its molecule, (B) a second acrylate derivative that is a compound having two or more polymerizable unsaturated bonds in its molecule, and (C) an acrylate derivative polymer, and an optical resin material produced by curing reaction of the optical resin composition.

Abstract: A polishing slurry comprises a metal-oxidizing agent, a metal anticorrosive agent, an oxidized metal dissolving agent and water. The oxidized metal dissolving agent is at least one kind selected from the group consisting of an acid in which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is 3.5 or more, an ammonium salt of the acid and an organic acid ester of the acid. The pH of the polishing slurry is within the range of 3 to 4. The concentration of the metal-oxidizing agent is within the range of 0.01 to 3 percent by weight. In the wiring-formation process of the semiconductor device, the conductor used for the barrier layer can be polished at a high polishing rate by using the polishing slurry having the low polishing particle concentration and the low metal anticorrosive agent concentration.

Abstract: A photosensitive resin composition comprising (A) a binder polymer with a weight-average molecular weight of 35000 to 65000, (B) a photopolymerizable compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein component (B) includes (B1) a photopolymerizable compound with one ethylenically unsaturated bond, (B2) a photopolymerizable compound with two ethylenically unsaturated bonds and (B3) a photopolymerizable compound with three ethylenically unsaturated bonds, and the proportion of component (B3) with respect to the total of component (B) is 15 to 30 wt %.

Abstract: An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.

Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract: A CMP polishing slurry of the present invention contains cerium oxide particles, water, and a polymer of at least one of a methacrylic acid and the salt thereof, and/or a polymer of at least one of a methacrylic acid and the salt thereof and a monomer having an unsaturated double bond, preferably contains furthermore a dispersant or a polymer of monomers containing at least one of an acrylic acid and the salt thereof. The present invention provides a CMP polishing slurry and a polishing method that, after polishing, give a polished film having a smaller difference in residual film thickness due to a pattern density difference.

Abstract: To provide a method of producing an electronic apparatus that is inexpensive, contributes to high productivity, and can achieve good communication characteristics. A method of producing an electronic apparatus composed of an IC chip (100) having an external electrode formed on each of a set of opposing surfaces of the IC chip; an antenna circuit (201) having a slit formed in it; and a short circuit plate (300) for electrically connecting the IC chip (100) and the antenna circuit (201). In the method, a disc-like conveyor (703) has hands (704) on its outer periphery, and each hand (704) is capable of holding a single IC chip (100). The hands (704) hold IC chips (100) individually, and the IC chips (100) are conveyed by rotation of the disc-like conveyor (703). As a result, a plurality of IC chips (100) whose maximum number is equal to the number of the hands (704) can be simultaneously conveyed.

Abstract: The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.

Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.

Abstract: A polishing slurry for semiconductor planarization containing cerium oxide particles and water, wherein the content of the cerium oxide particles having a diameter of 3 ?m or more is 500 ppm or less (weight ratio) in a solid, preferably 100 ppm or less and it is more preferable that D99 (99% by volume of the whole particles in polishing slurry) of the cerium oxide particles is 1 ?m or less. The polishing slurry can reduce the generation of scratches, and can polish a surface of the semiconductor substrate in the wiring formation process of semiconductor device precisely at a high speed.

Abstract: Disclosed is a friction material composition, comprising a fiber matrix, a binder, an organic filler, and an inorganic filler, wherein the fiber matrix contains at least two types of mineral fibers different in average fiber length from each other, and the difference between the minimum value and the maximum value among the average fiber lengths of the mineral fibers is 50 ?m or more. Also disclosed is a friction material produced by pressure-molding the friction material composition while heating. Further disclosed is a friction material having an underlayer material interposed between a friction surface and a back metal, while the underlayer material is produced by pressure-molding the friction material composition while heating.

Abstract: To provide a device for pasting a film exhibiting dichroism and a film exhibiting birefringence at an arbitrary angle with high precision. The device for pasting a film exhibiting dichroism and a film exhibiting birefringence at an arbitrary angle comprises a detector for detecting the angle of an axis where absorption is maximum or minimum in the plane of a film exhibiting dichroism, and a detector for detecting the slow axis in the plane of a film exhibiting birefringence. An angle between the film exhibiting dichroism and the film exhibiting birefringence is controlled using the detector for a film exhibiting dichroism and the detector for a film exhibiting birefringence.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to oligo(dT)-immobilized multi-well plates.

Abstract: Tumor necrosis factor (TNF) is capable of inducing apoptosis by interacting with specific TNF receptors on the surface of cancer cells. Because multiple members of TNF ligand and receptor are present within each superfamily, over 300 different ligand-receptor combinations exist. Activated blood leukocytes produce TNF as part of the immune response to cancer, as well as producing chemokines to attract other leukocytes to the site. A method is disclosed of detecting significant induction of a variety of TNF superfamily subtype and chemokine mRNAs in blood leukocytes when whole blood is exposed to heat-aggregated IgG or anti-T cell receptor antibodies as a model of immune system interactions. Substantial individual-to-individual variation is observed in TNF subtypes and chemokines induced. Since peripheral blood leukocytes are the supply of anti-cancer immune cells, the quantitation of ex vivo inducibility of appropriate TNF ligands and chemokines in blood will be useful in individualized cancer immunotherapy.