Patents Assigned to Hitachi Chemical Co.
  • Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device
    Patent number: 8129467
    Abstract: The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: March 6, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventor: Shinya Nakamura
  • Prepreg and its application products for low thermal expansion and low dielectric tangent
    Patent number: 8115105
    Abstract: A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 14, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Satoru Amou, Hiroshi Shimizu, Akinori Hanawa
  • Organic siloxane film, semiconductor device using the same, flat panel display device, and raw material liquid
    Patent number: 8106385
    Abstract: Disclosed is materials design for prolonging the duration of the low relative dielectric constant of an organic siloxane film having a low relative dielectric constant. Specifically, in an organic siloxane film having a relative dielectric constant of not more than 2.1, the elemental ratio of carbon to silicon in the film is set to not less than 0.10 and not more than 0.55.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: January 31, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Daisuke Ryuzaki, Hiroshi Fukuda
  • Device and method for high-throughput quantification of mRNA from whole blood
    Patent number: 8101344
    Abstract: Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to oligo(dT)-immobilized multi-well plates.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: January 24, 2012
    Assignees: Hitachi Chemical Research Center, Inc., Hitachi Chemical Co., Ltd.
    Inventor: Masato Mitsuhashi
  • Light guide plate and backlight unit
    Patent number: 8096693
    Abstract: A light guide plate includes: a plate surrounded by two main surfaces and a plurality of end surfaces connecting the main surfaces, one of the end surfaces designated as an entrance surface, one of the main surfaces designated as a reflection surface; a first reflection element provided in a first region of the reflection surface separated from the entrance surface, and configured to reflect a light incident from the entrance surface in a first angle with respect to the reflection surface; and a second reflection element provided in a second region of the reflection surface between the entrance surface and the first region, and configured to reflect the light in a second angle different from the first angle with respect to the reflection surface.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: January 17, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masato Taya, Tokutarou Komatsu, Yasushi Sugimoto, Tadashi Okuda, Teruo Teshima
  • Light control film and light control glass
    Patent number: 8098419
    Abstract: The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates, wherein the light control layer contains a resin matrix and a light control suspension dispersed in the resin matrix, and the thickness of the transparent electroconductive resin substrates is from 130 to 500 ?m.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: January 17, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Osamu Higashida, Hitoshi Yamazaki
  • Polishing slurry and polishing method
    Patent number: 8084363
    Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: December 27, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
  • Epoxy resin molding material for sealing and electronic component device
    Patent number: 8084130
    Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: December 27, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa
  • Polishing slurry and polishing method
    Patent number: 8084362
    Abstract: The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive, wherein the surface of the abrasive is modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: December 27, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Jin Amanokura, Takafumi Sakurada, Sou Anzai, Masato Fukasawa, Shouichi Sasaki
  • Purification process for organic electronics material
    Patent number: 8075943
    Abstract: Objects of the present invention are to provide a purification process that enables Pd contained in an organic electronics material to be removed effectively, to provide an electroluminescent device middle layer material purified by the process, and to provide an electroluminescent device employing the middle layer material. The present invention relates to a process for purifying an organic electronics material, the process involving treating, with a phosphorus-containing material, an organic electronics material that contains Pd as an impurity so as to remove the Pd.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: December 13, 2011
    Assignees: Hitachi Chemical Co., Ltd., Maxdem Incorporated
    Inventors: Yoshihiro Tsuda, Yoshii Morishita, Satoyuki Nomura, Yousuke Hoshi, Shigeaki Funyuu, Farshad J. Motamedi, Li-Sheng Wang
  • Device and method for high-throughput quantification of MRNA from whole blood
    Patent number: 8076105
    Abstract: Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to oligo(dT)-immobilized multi-well plates.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: December 13, 2011
    Assignees: Hitachi Chemical Research Center, Inc., Hitachi Chemical Co., Ltd.
    Inventor: Masato Mitsuhashi
  • Polishing slurry and polishing method
    Patent number: 8075800
    Abstract: A polishing slurry containing a slurry dispersing particles of tetravalent metal hydroxide in a medium therein and an additive, characterized in that the additive is a polymer containing at least one kind of monomer component selected from a group of monomers represented with a general formulae (I) and (II) below (In the general formulae (I) and (II), R1 denotes hydrogen, a methyl group, a phenyl group, a benzil group, a chlorine group, a difluoromethyl group, a trifluoromethyl group or a cyano group, R2 and R3 denote hydrogen or an alkyl chain having 1 to 18 carbon atoms, a methylol group, an acetyl group or a diacetonyl group, and a case where both are hydrogen is not included. R4 denotes a morpholino group, a thiomorpholino group, a pyrrolidinyl group or a piperidino group.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: December 13, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Naoyuki Koyama, Youichi Machii, Masato Yoshida, Masato Fukasawa, Toranosuke Ashizawa
  • Light control film and light control glass
    Patent number: 8059331
    Abstract: The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates, wherein the light control layer contains a resin matrix and a light control suspension dispersed in the resin matrix, and the thickness of the transparent electroconductive resin substrates is from 10 to 80 ?m.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: November 15, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Osamu Higashida, Hitoshi Yamazaki, Shigeshi Ohno
  • Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
    Patent number: 8043709
    Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: October 25, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
  • Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same
    Patent number: 8044379
    Abstract: A method of producing silicon nanowires includes providing a substrate in the form of a doped material; formulating an etching solution; and applying an appropriate current density for an appropriate length of time. Related structures and devices composed at least in part from silicon nanowires are also described.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: October 25, 2011
    Assignees: Hitachi Chemical Co., Ltd., Hitachi Chemical Research Center, Inc.
    Inventor: Yongxian Wu
  • Friction material composition and friction material produced therewith
    Patent number: 8034427
    Abstract: Disclosed is a friction material composition, comprising a fiber matrix, a binder, an organic filler, and an inorganic filler, wherein the fiber matrix contains at least two types of mineral fibers different in average fiber length from each other, and the difference between the minimum value and the maximum value among the average fiber lengths of the mineral fibers is 50 ?m or more. Also disclosed is a friction material produced by pressure-molding the friction material composition while heating. Further disclosed is a friction material having an underlayer material interposed between a friction surface and a back metal, while the underlayer material is produced by pressure-molding the friction material composition while heating.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: October 11, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Mitsuo Unno, Kazuya Baba
  • Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
    Patent number: 8034545
    Abstract: The present invention provides a radiation curing composition comprising (a): a siloxane resin, (b): a photoacid generator or photobase generator, and (c): a solvent capable of dissolving component (a) and containing an aprotic solvent.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: October 11, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Haruaki Sakurai, Koichi Abe
  • Mixed conductive powder and use thereof
    Patent number: 8029701
    Abstract: There are disclosed a highly packed, mixed conductive powder with a relative packing density of at least 68%, a process for producing the same, a conductive paste using the mixed conductive powder and a process for producing the same, as well as a sheet and a sheet with attached film using the mixed conductive powder. This mixed conductive powder comprises substantially monodispersed conductive scale-like particles (A1) and conductive substantially spherical particles (B1). Or, this mixed conductive powder comprises substantially monodispersed, conductive, substantially spherical particles (A2) and conductive substantially spherical particles (B2) with a smaller particle diameter than that of the substantially spherical particles (A2).
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: October 4, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventor: Hideji Kuwajima
  • Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
    Patent number: 8028402
    Abstract: Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: October 4, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike, Kousuke Hiroki
  • High-molecular copolymer containing metal coordination compound and organic electroluminescence element using the same
    Patent number: 8008418
    Abstract: It is an object of the present invention to provide a copolymer containing a metal coordination compound that has blue phosphorescence emission with excellent color purity and, furthermore, to provide a copolymer containing a metal coordination compound that has luminescence of various colors from blue to red and a long operating life. The present invention relates to a metal coordination compound-containing copolymer that contains a metal coordination compound monomer unit represented by any one of Formulae (1) to (12): and at least one type of monomer unit selected from the group consisting of a substituted or unsubstituted quinoline monomer unit, a substituted or unsubstituted arylene and/or heteroarylene monomer unit, a substituted or unsubstituted branched monomer unit, and a substituted or unsubstituted conjugated monomer unit.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: August 30, 2011
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yoshii Morishita, Satoyuki Nomura, Yoshihiro Tsuda