Patents Assigned to Hitachi Chemical Company, Ltd.
  • Patent number: 10773422
    Abstract: A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; and a separation process of separating the inorganic material from the processing solution including a decomposition product of the first organic substance and the second organic substance, the contact process and the separation process including adjusting the processing solution to have a temperature that is equal to or greater than a softening point of the second organic substance.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 15, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akira Shimizu, Kazuhito Kobayashi, Kouichi Aoyagi
  • Patent number: 10774194
    Abstract: A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; a separation process of separating the processing solution including a decomposition product of the first organic substance, from a recovered product including the inorganic material and the second organic substance; and a thermal treatment process of subjecting the recovered product to a thermal treatment at a temperature that is equal to or greater than a temperature at which the second organic substance is eliminated.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 15, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akira Shimizu, Kazuhito Kobayashi, Kouichi Aoyagi
  • Patent number: 10766999
    Abstract: A polyamideimide resin composition containing: (A) a polyamideimide resin which has isocyanate groups at the terminals and in which at least a portion of the isocyanate groups are blocked with a blocking agent selected from the group consisting of alcohols, oximes and lactams, (B) N-formylmorpholine, and (C) water.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 8, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Atsushi Takahashi
  • Patent number: 10763509
    Abstract: Provided are a positive electrode for a lithium ion secondary battery, the positive electrode including a positive electrode active material layer, the positive electrode active material layer including insulating polyolefin particles and an electroconductive material; an electrode for a lithium ion secondary battery, the electrode including an electrode active material layer, the electrode active material layer including polyolefin particles and a resin including a structural unit derived from a nitrile group-containing monomer; and a lithium ion secondary battery using the same.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroki Kuzuoka, Eisuke Haba, Shunsuke Nagai, Kenji Takaoka
  • Patent number: 10759968
    Abstract: A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hisataka Minami, Tomohiro Iwano, Toshiaki Akutsu
  • Patent number: 10759937
    Abstract: A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroshi Matsutani, Nanako Mizuguchi, Satoshi Asaka, Misao Inaba, Yohei Ishikawa, Keiko Kudoh, Katsuya Maeyama
  • Publication number: 20200270447
    Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
    Type: Application
    Filed: September 29, 2017
    Publication date: August 27, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Naoki MARUYAMA, Yuka YOSHIDA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Keiichiro NISHIMURA, Yoshitaka TAKEZAWA
  • Patent number: 10752807
    Abstract: A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen atom not bound to a hydrogen atom; and a charge of the endocyclic nitrogen atom obtained by using the Merz-Kollman method is ?0.45 or less.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: August 25, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD
    Inventors: Hisataka Minami, Tomohiro Iwano, Keita Arakawa, Takahiro Hidaka
  • Patent number: 10756008
    Abstract: There are provided an organic interposer capable of improving insulation reliability and a method for manufacturing the organic interposer. An organic interposer 10 is provided with: an organic insulating laminate 12 comprising a plurality of organic insulating layers; and a plurality of wires 13 arranged in the organic insulating laminate 12, and each of the wires 13 and each of the organic insulating layers are separated by a barrier metal film 14. The organic insulating laminate 12 may include: a first organic insulating layer 21 having a plurality of grooves 21a each having each of the wires 13 disposed therein; and a second organic insulating layer 22 laminated to the first organic insulating layer 21 in such a way as to embed the wires 13.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: August 25, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuyuki Mitsukura, Masaya Toba, Yoshinori Ejiri, Kazuhiko Kurafuchi
  • Publication number: 20200262969
    Abstract: An epoxy resin, comprising (1) an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to the two aromatic rings, and at least one of the mesogenic structures being bonded to the aromatic ring at an angle with a molecular axis of the divalent biphenyl structure; (2) an epoxy compound having two aromatic rings that form a divalent biphenyl structure and mesogenic structures that are bonded to the two aromatic rings, and at least one of bonding sites of the aromatic ring to the mesogenic structure being at an ortho position or a meta position with respect to a carbon atom that bonds the aromatic rings; or (3) an epoxy compound having a phenylene group and two mesogenic structures that are bonded to the phenylene group at an angle with each other.
    Type: Application
    Filed: September 29, 2017
    Publication date: August 20, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomoko HIGASHIUCHI, Naoki MARUYAMA, Yuka YOSHIDA, Kazumasa FUKUDA, Yoshitaka TAKEZAWA
  • Patent number: 10748865
    Abstract: Provided is a copper paste for joining including copper particles, second particles including a metal element other than copper, and a dispersion medium, in which the copper particles include submicro copper particles having a volume-average particle diameter of 0.12 ?m or more and 0.8 ?m or less and micro copper particles having a volume-average particle diameter of 2 ?m or more and 50 ?m or less, a sum of a content of the submicro copper particles and a content of the micro copper particles is 80% by mass or more of a sum of masses of the copper particles and the second particles, the content of the submicro copper particles is 30% by mass or more and 90% by mass or less of a sum of a mass of the submicro copper particles and a mass of the micro copper particles, and a content of the second particles is 0.01% by mass or more and 10% by mass or less of the sum of the masses of the copper particles and the second particles.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: August 18, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuki Kawana, Hideo Nakako, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri
  • Patent number: 10738165
    Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: August 11, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Masato Miyatake, Hikari Murai
  • Publication number: 20200247943
    Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.
    Type: Application
    Filed: September 29, 2017
    Publication date: August 6, 2020
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuka YOSHIDA, Naoki MARUYAMA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Keiichiro NISHIMURA, Yoshitaka TAKEZAWA
  • Patent number: 10734350
    Abstract: There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: August 4, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazutaka Honda, Koichi Chabana, Makoto Satou, Akira Nagai
  • Publication number: 20200239686
    Abstract: Disclosed are a polyamideimide resin composition comprising (A) a polyamideimide resin, (B) a 3-alkoxy-N,N-dimethylpropanamide, and (C) water; and a fluorine-based coating material comprising the polyamideimide resin composition and a fluororesin.
    Type: Application
    Filed: February 20, 2017
    Publication date: July 30, 2020
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Atsushi TAKAHASHI
  • Patent number: 10717893
    Abstract: A mobile phone including a touch panel including a base material; a sensing region including at least one electrode provided over the base material; and a frame region provided at a periphery of the sensing region, the frame region including metal wiring provided over the base material and being electrically connected to the at least one electrode; and a cured product of a photosensitive resin composition disposed at least on the metal wiring, the photosensitive resin composition contains a component (A): a binder polymer, a component (B): a photopolymerizable compound, and a component (C): a photopolymerization initiator; and the component (B) includes a di(meth)acrylate compound having at least one selected from the group consisting of a dicyclopentanyl structure and a dicyclopentenyl structure.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: July 21, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Mayumi Sato, Koji Abe, Hideo Takahashi
  • Patent number: 10703947
    Abstract: The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: July 7, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiro Iwano, Hirotaka Akimoto, Takenori Narita, Tadahiro Kimura, Daisuke Ryuzaki
  • Publication number: 20200199287
    Abstract: An epoxy resin, comprising an epoxy compound, the epoxy compound comprising two or more structures represented by the following Formula (I) and at least one divalent biphenyl group: wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
    Type: Application
    Filed: October 14, 2016
    Publication date: June 25, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomoko HIGASHIUCHI, Naoki MARUYAMA, Yuka YOSHIDA, Kazumasa FUKUDA, Yoshitaka TAKEZAWA
  • Patent number: 10693130
    Abstract: A negative electrode material for a lithium ion secondary battery including carbon over a part or a whole of a surface of an oxide of silicon, in which the content of the carbon is from 0.5 mass-% to less than 5 mass-%.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: June 23, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masayuki Kouzu, Hideyuki Tsuchiya, Katsutomo Ohzeki, Yoshie Oosaki, Tatsuya Nishida
  • Patent number: 10681807
    Abstract: The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 9, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shinji Tsuchikawa, Shin Takanezawa