Abstract: A plasma treatment apparatus has a reaction vessel (11) provided with a top electrode (13) and a bottom electrode (14), and the first electrode is supplied with a VHF band high frequency power from a VHF band high frequency power source (32), while the bottom electrode on which a substrate (12) is loaded and is moved by a vertical movement mechanism. The plasma treatment system has a controller (36) which, at the time of a cleaning process after forming a film on the substrate (12), controls a vertical movement mechanism to move the bottom electrode to narrow the gap between the top electrode and bottom electrode and form a narrow space and starts cleaning by a predetermined high density plasma in that narrow space. In the cleaning process, step cleaning is performed. Due to this, the efficiency of utilization of the cleaning gas is increased, the amount of exhaust gas is cut, and the cleaning speed is raised. Further, the amount of the process gas used is cut and the process cost is reduced.

Abstract: A substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of confirming an operation of a liquid flowrate control device are provided. The substrate processing apparatus comprises: a process chamber accommodating a substrate; a liquid source supply system supplying a liquid source into the process chamber; a solvent supply system supplying a solvent having a vapor pressure greater than that of the liquid source into the process chamber; a liquid flowrate control device controlling flowrates of the liquid source and the solvent; and a controller controlling the liquid source supply system, the solvent supply system, and the liquid flowrate control device so that the solvent is supplied into the liquid flowrate control device than the solvent supply system to confirm an operation of the liquid flowrate control device before the liquid source supply system supplies the liquid source into the process chamber.

Abstract: Provided is a substrate processing apparatus and a method of manufacturing a semiconductor device, which are hard to cause a defect in processing a substrate owing to that a pressure inside a process chamber is not kept constant, and which enable a better processing of a substrate.

Abstract: A substrate processing apparatus includes a display unit having an operation screen, a first control section that transmits a control instruction for processing a substrate and a second control section that performs control according to the control instruction from the first control section. The first control section has a screen file that stores screen data in which the first row is settable as item data for a data number, a data name or the like, a parameter file that stores parameter data corresponding to the item data at least, and a display control section that displays the monitor screen by executing the screen file and placing the screen data on the operation screen as a monitor screen and executing the parameter file, searching through the parameter file based on the data number and placing the parameter data corresponding to the item data.

Abstract: A radio communication apparatus has a GPS function, is internally included in or is removably connected to an information processing apparatus. A reference position setting unit sets a reference position. A positional condition setting unit sets a positional condition about the reference position which is a condition for performing the processing under a predetermined security mode. A positional condition determining unit determines whether the condition for performing the processing under a predetermined security mode is obtained or not on the basis of the positional condition and its positional information obtained by the GPS function. A security mode processing performing unit performs processing under a predetermined security mode if it is determined that the condition for performing the processing under a predetermined security mode is obtained.

Abstract: An image processing apparatus connected to a monitoring camera and a display for processing an image input from the monitoring camera includes an image storage storing an image input from the monitoring camera, a characteristic parameter storage storing a characteristic parameter characterizing a specific image, a specific image extraction unit, wherein the specific image extraction unit cuts out images having a plurality of predetermined sizes from all parts of the input image stored in the image storage, executes character evaluation processing for checking whether or not cut out images have an identical character to the specific image for each cut out image, and extracts the cut out images which has an identical character to the specific image by the character evaluation processing, and a display image generation unit for generating a display image for displaying a whole image of the input image and the extraction specific image on the display.

Abstract: In a radio-frequency wave module including a transmission path based on a distributed parameter element, the transmission path being part of an input/output terminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted components therein, grounding-use metallic electrodes, dielectric substrates of at least two or more layers, and semiconductors, electrical separation is established between the grounding-use metallic electrodes which form the transmission paths based on the distributed parameter element and at least one of the grounding-use metallic electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions for containing the semiconductor-including mounted components therein.

Abstract: Substrate processing of a substrate is performed in a processing chamber and the evenness in in-plane film thickness is enhanced. An exhaust unit exhausts the atmosphere in the processing chamber and a processing gas is supplied that is excited by an exciting unit. A rotational drive unit horizontally rotates a support unit that supports a mounting substrate on which the substrate is mounted; and a coolant supply/discharge unit is connected to the lower end of the support unit through a connecting unit. The substrate mounting unit has a coolant circulation path therein. The support unit includes a first coolant flow path for passing coolant through the coolant circulation path. The coolant supply/discharge unit includes a second coolant flow path. The connecting unit connects the first coolant flow path and the second coolant flow path together and is provided outside the processing chamber.

Abstract: Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device which are able to form a conductive film, which is dense, includes a low concentration of source-derived impurities and has low resistivity, at a higher film-forming rate. The substrate processing apparatus includes a processing chamber configured to stack and accommodate a plurality of substrates; a first processing gas supply system configured to supply a first processing gas into the processing chamber; a second processing gas supply system configured to supply a second processing gas into the processing chamber; and a control unit configured to control the first processing gas supply system and the second processing gas supply system.

Abstract: An image pickup device having an electron multiplying-charge coupled device includes a control unit for controlling an electron multiplication factor of the electron multiplying-charge coupled device; an obtaining unit for obtaining signals output from predetermined pixels of the electron multiplying-charge coupled device; and an averaging unit for performing an inter-line averaging process of the signals obtained by the obtaining unit. The device further includes a suppression unit for performing low-level and high-level suppressions on the signal averaged by the averaging unit based on the electron multiplication factor of the electron multiplication factor control unit; an acquisition unit for acquiring image signals output from the pixels other than the predetermined pixels of the electron multiplying-charge coupled device; and a subtractor for subtracting the signal suppressed by the suppression unit from the image signals acquired by the acquisition unit.

Abstract: When half-duplex many-to-many communication is performed among a plurality of mobile stations having different codecs in a single group, transcoding is performed with a small number of codec circuits. A transcoder manages an SSRC of a received RTP packet, detaches voice information from a jitter buffer, which is identical to a latest SSRC, and inputs the detached voice information to a codec circuit. As the latest SSRC is switched, a voice sending station subject to transcode is switched, and mobile stations using the same codec share the codec circuit. Therefore, in a half-duplex many-to-many communication (group communication) system, called a professional mobile radio system, push-talk, or press-talk, it is not necessary to switch the transcoder until a radio station which takes a talk burst is changed during a single call (call session).

Abstract: The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder for holding substrates in a multistage manner and a substrate transfer unit for transferring the substrates into the substrate holder, wherein a substrate holding condition of the substrate holder is sensed by a sensing section. The sensing section has photo-sensors, and sensing waveforms sensed by the photo-sensors are compared with a normal waveform. A control section is provided, which controls a substrate transfer unit such that substrates other than at least a substrate that was determined to be abnormal are transferred by the unit.

Abstract: Provided is a substrate processing apparatus comprising a closing assistance mechanism in which bending of a seal cap and a furnace port shutter arm is corrected, an O-ring is sufficiently pressed, and a process chamber is sufficiently sealed. The substrate processing apparatus comprises: a process chamber comprising an opening for loading a substrate therethrough, the process chamber performing a processing operation on the substrate loaded therein; a first cover configured to close the opening of the process chamber when a substrate is loaded in the process chamber; a first opening/closing mechanism configured to open/close the first cover; a second cover configured to close the opening of the process chamber when no substrate is loaded in the process chamber; a second opening/closing mechanism configured to open/close the second cover; and a closing assistance mechanism configured to assist the first and the second opening/closing mechanisms.

Abstract: A method of manufacturing a semiconductor device and a substrate processing apparatus capable of providing a TiN film that is higher in quality than a TiN film formed by a conventional CVD method at a higher film-forming rate, that is, with a higher productivity than a TiN film formed by an ALD method.

Abstract: A method for correcting a pixel defect of a solid-state image pickup device includes acquiring deviation of image signals obtained by imaging respective spectral lights at specific image pickup position or at vicinities of the specific image pickup position by image pickup device; comparing the deviation with a reference value; detecting a pixel defect in an image pickup device which has imaged one of the spectral lights based on the comparing result; and correcting a pixel defect. For each detected pixel defect, at least address in an image frame, deviation, and information specifying one of the spectral lights are stored, and a determination on a pixel defect correction is made based on the above information.

Abstract: A digital transmission system of a type in which a digitally-modulated transmission signal is mapped to two-dimensional data and transmitted from at least one relay point, and at a reception side, the two-dimensional data is identified and reproduced into the transmission signal. The system includes first and second memories provided in the relay point for alternately writing and reading transmission signal display information to display a transmission status of the transmission signal, and also includes a display data transmitter for alternately reading and transmitting the transmission signal display information. In the reception side, a display data reception circuit has third and fourth memories for receiving the transmission signal display information and performing write, read and output operations. The circuit alternately reads and outputs the transmission signal display information.

Abstract: Disclosed is a producing method or a semiconductor device including: loading at least one substrate into a processing chamber; forming a metal oxide film or a silicon oxide film on a surface of the substrate by repeatedly supplying a metal compound or a silicon compound, each of which is a first material, an oxide material which is a second material including an oxygen atom, and a hydride material which is a third material, into the processing chamber predetermined times; and unloading the substrate from the processing chamber.

Abstract: Provided is a substrate processing apparatus suppressing the vibration of a cover in an initial stage of unloading a boat from a process pipe. The substrate processing apparatus comprises: a boat for placing a substrate; a process pipe receiving the boat; a cover on which the boat is placed, the cover opening and closing a furnace port installed on a lower end of the process pipe; an elevation mechanism moving the cover upward and downward; a motor driving the elevation mechanism; a sealing member sealing a space between the cover and a lower end surface of the process pipe; and a controller controlling torque of the motor such that the substrate is maintained a rest position within the boat in a deformation recovery period of the cover occurring when the sealing member is removed from a surface of the cover or the lower end surface of the process pipe.

Abstract: The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder 26 for holding substrates 12 in a multistage manner and a substrate transfer unit 34 for transferring the substrates 12 into the substrate holder 26, wherein a substrate holding condition of the substrate holder 26 is sensed by a sensing section 60. The sensing section 60 has photo-sensors 64a, 64b, and sensing waveforms sensed by the photo-sensors 64a, 64b are compared with a normal waveform. A control section 66 is provided, which controls a substrate transfer unit 34 such that substrates 12 other than at least a substrate 12 that was determined to be abnormal are transferred by the unit.

Abstract: A supply voltage control device for an amplifier that controls a supply voltage for the amplifier has been improved.