Patents Assigned to Hiwin Mikrosystem Corp.
  • Patent number: 7397160
    Abstract: An insulation device for being assembled in a linear motor is primarily made through molding a sheet insulation material into an insulation module with the shape harmonized with the shape of an iron core of a linear motor. Thus, coil wildings can be indirectly wrapped around the iron core with the insulation module positioned intermediately and thereby a linear motor with perfect insulation treatment between the iron and coil windings is achieved.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: July 8, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Lieh-Feng Huang, Chia-Ming Chang
  • Publication number: 20070216324
    Abstract: A demodulation method of a resolver output position signal comprises the steps of: inputting an excitation signal, using a push-pull amplifier circuit to increase fan-out; using a voltage regulator to adjust the amplitude of resolver signals to the same level, for improving resolution; modulating with a subtracter; amplifying the signal with an amplifier circuit for providing signal waveform readable by a resolver to digital converter or a controller.
    Type: Application
    Filed: March 17, 2006
    Publication date: September 20, 2007
    Applicant: HIWIN MIKROSYSTEM CORP.
    Inventors: Ming-Shing LIU, Yi-Cheng SU
  • Patent number: 7268710
    Abstract: A logic device for the transformation of the output of the RDC into series A-B pulses according to the present invention comprises: a chip with its two minimal bits (LSB-LSB-1) simulating as the clock source of A-B pulses, a signal-processing pin (BUSY) which output a TTL pulse wave as a control signal resource while LSB shifts from a low level to a high level and contrariwise, and a logic processing circuit as well as a buffer to output the displacement and velocity of a rotor in the form of A-B serial pulses.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: September 11, 2007
    Assignee: Hiwin Mikrosystems Corp.
    Inventors: Ming-Hsing Liu, Ming-Yuan Lee
  • Patent number: 7262377
    Abstract: A limit switch control device for an actuator is disposed at both ends of a linearly moveable mover and comprises at least: two limit switches, a circuit board, and a connecting rod assembly. The two limit switches are disposed on the circuit board, both ends of the connecting rod assembly define the effective travel length of the mover. One end of the connecting rod assembly is moved by the mover to control the other limit switch. By such arrangements, the limit switch is simplified, and with the arrangement of the connecting rod assembly, the number of the brake devices or the limit switches can be increased as desired. Further, the circuit board and the connecting rod assembly are modular designed.
    Type: Grant
    Filed: November 23, 2006
    Date of Patent: August 28, 2007
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chia-Chun Wei, Yu-Jian Lin
  • Patent number: D546352
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: July 10, 2007
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Wen-Chia Tsou, Cheng-Han Tsai
  • Patent number: D549663
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: August 28, 2007
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Wen-Chia Tsou, Li-Shua Sun
  • Patent number: D552039
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: October 2, 2007
    Assignee: Hiwin Mikrosystem Corp.
    Inventor: Li-Fen Liao
  • Patent number: D561421
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: February 5, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Don-Hua Cheng, Chi-Yuan Cheng
  • Patent number: D562158
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: February 19, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventor: Hung-Sheng Tsai
  • Patent number: D562789
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: February 26, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Ming-Chih Huang, Ming-Hsing Chi, Ming-Hsing Liu
  • Patent number: D563330
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: March 4, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Yu-Jian Lin, Cheng-Han Tsai
  • Patent number: D564552
    Type: Grant
    Filed: October 14, 2006
    Date of Patent: March 18, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chia-Ming Chang, Cheng-Han Tsai
  • Patent number: D565435
    Type: Grant
    Filed: November 23, 2006
    Date of Patent: April 1, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventor: Don-Hua Cheng
  • Patent number: D565437
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: April 1, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Ming-Chih Huang, Chih-Mao Shiao
  • Patent number: D565617
    Type: Grant
    Filed: October 14, 2006
    Date of Patent: April 1, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chia-Ming Chang, Cheng-Han Tsai
  • Patent number: D565973
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: April 8, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Ming-Chih Huang, Don-Hua Cheng
  • Patent number: D570385
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: June 3, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventor: Yung-Tsai Chuo
  • Patent number: D572281
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: July 1, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chia-Chun Wei, Yu-Jian Lin
  • Patent number: D573091
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: July 15, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Jie-Siang Shih, Yu-Tzu Ku
  • Patent number: D574865
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: August 12, 2008
    Assignee: Hiwin Mikrosystem Corp.
    Inventor: Don-Hua Cheng