Patents Assigned to Hosiden Corporation
  • Publication number: 20200267477
    Abstract: A sound producing device in which an adhesive layer between a piezoelectric element and a metal plate has sufficient electrical conductivity includes: a metal plate; a piezoelectric ceramic including a first adhesion surface, the first adhesion surface being a surface bonded to the metal plate; an alternating current power supply that applies an alternating voltage to the piezoelectric ceramic; and an adhesive layer formed from conductive adhesive and thermosetting adhesive which are spread over the first adhesion surface, the conductive adhesive being applied in a center portion of the first adhesion surface and the thermosetting adhesive being applied at three or more locations in a periphery of the first adhesion surface. An adhesion surface of the metal plate that is bonded to the piezoelectric ceramic is a second adhesion surface, and the first adhesion surface and the second adhesion surface are bonded together by the adhesive layer.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 20, 2020
    Applicant: HOSIDEN CORPORATION
    Inventors: Ryo INOUE, Tadashi HANAI, Satoru FUJIWARA
  • Patent number: 10741972
    Abstract: A connector including a shield case, a body housed in the shield case, at least one terminal held by the body, and a shield cover. The shield case includes a tube extending in a first direction and a pair of walls. The walls are located on one side in the first direction relative to the tube, face each other in a second direction orthogonal to the first direction, and extend to one side in a third direction. The third direction crosses the first and second directions. The body includes a first portion in the tube, and a second portion. The first portion includes a basal portion, which includes an exposed portion exposed to one side in the third direction between the walls. The second portion extends between the walls from the basal portion. The shield cover includes a cover portion disposed between the walls to cover at least part of the exposed portion.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 11, 2020
    Assignee: HOSIDEN CORPORATION
    Inventors: Yuta Iwamoto, Hayato Kondo
  • Publication number: 20200252063
    Abstract: A proximity sensor including a first substrate, a second substrate, a first connecting member, at least one first electrode, and a detection part. The first substrate is disposed in the vicinity of a first detection space. The second substrate is disposed on an opposite side of the first substrate to the first detection space. The second substrate faces the first substrate. The first connecting member connects the first substrate and the second substrate. The at least one first electrode is provided on the first substrate and configured such that a signal from the at least one first electrode changes in response to a change in a first capacitance caused by a detection target approaching to the first detection space. The detection part is provided on the second substrate and configured to detect the approach of the detection target based on the signal from the at least one first electrode.
    Type: Application
    Filed: January 23, 2020
    Publication date: August 6, 2020
    Applicant: HOSIDEN CORPORATION
    Inventors: Shigeki Mokuo, Yohei Sanada
  • Patent number: 10723101
    Abstract: An optical laminate structure including first and second layers each having a bonding face, at least one step on at least one of the bonding faces, a retarder layer between the first and second layers, and first and second adhesive layers. The first layer may cause outgassing. The retarder layer has first and second bonding faces facing the first and second layers, respectively. The first adhesive layer bonds together the bonding face of the first layer and the first bonding face of the retarder layer and has such hardness that suppresses the outgassing at an interface between the first layer and the first adhesive layer. The second adhesive layer bonds together the bonding face of the second layer and the second bonding face of the retarder layer, is more flexible than the first adhesive layer, and has such hardness as to get distorted by the step and thereby absorb height of the step.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: July 28, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Masato Shimizu
  • Patent number: 10693325
    Abstract: A contactless power transfer apparatus includes an E-class amplifier having a coil configured to store an amount of energy for use in contactless power transfer and a field-effect transistor for controlling a current that flows in the coil, and an arrester provided between a drain terminal and a source terminal of the field-effect transistor and configured to be operated in response to application of a voltage having a voltage value lower than an absolute maximum rated voltage value between the drain and the source of the field-effect transistor.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: June 23, 2020
    Assignee: Hosiden Corporation
    Inventors: Eiji Sato, Hiroshi Ema
  • Publication number: 20200161782
    Abstract: A connector includes a body and a contact that is inserted into the body. The contact includes a protruding part that is protruded in a direction orthogonal to an insertion direction of the contact, a protrusion that is provided on an outer periphery of the contact, and an overhanging part that overhangs in the direction orthogonal to the insertion direction. The body includes, on an inner surface thereof, a guide groove that is fitted with the protruding part and is extended in the insertion direction, a housing part that has an internal dimension for press-fitting the contact, which includes the protrusion, thereto, and a press-fitting part that has an internal dimension for press-fitting the contact, which includes the overhanging part, thereto. An insertion distance A of the protruding part, an insertion distance B of the protrusion, and an insertion distance C of the overhanging part satisfy a relation A>B>C.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 21, 2020
    Applicant: HOSIDEN CORPORATION
    Inventor: Yuta IWAMOTO
  • Patent number: 10658781
    Abstract: A connector includes a cable including a plurality of core wires, a plurality of contacts, a body, a body cover housing the body, and an inner mold part. The plurality of contacts are respectively connected to ends, on one side, of the plurality of core wires of the cable. The body includes a plurality of first grooves that have an arc shape on a section orthogonal to an extending direction of the core wires and respectively support the ends, on one side, of the core wires in a contact state. The body cover includes a plurality of lines of rails on an inner side surface thereof, the plurality of lines of rails respectively having second grooves and being extended in parallel with the extending direction of the core wires, the second grooves having an arc shape on the section orthogonal to the extending direction of the core wires.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: May 19, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Toshiharu Miyoshi
  • Patent number: 10601191
    Abstract: A connector module that has an inexpensive configuration and a high shielding ability is provided. The connector module includes a terminal module and a shield case. The terminal module has a central conductor, a tubular insulator holder that supports the central conductor, and a tubular conductive shell. A bottom portion of the shield case has multiple elastic portions that are capable of elastic deformation and are bent from and protrude from an edge portion of an opening portion for passage of the terminal module. The terminal module is joined to the shield case in a state where the annular recession portion of the conductive shell and the elastic portions are in electrical contact with each other.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 24, 2020
    Assignee: Hosiden Corporation
    Inventor: Masakazu Yamazaki
  • Patent number: 10579178
    Abstract: An input device includes a plate-like operation panel in which a touch sensor is placed. The plate-like operation panel has a touch surface to be touch-operated by an operator, a support that supports the operation panel to a printed circuit board in a manner that the operation panel is displaceable in one axial direction, which extends along the touch surface, and an actuator that vibrates the operation panel in the one axial direction. The support is configured by metal plate springs disposed respectively in four places between the printed circuit board and one of the operation panel and a metal fitting fixed to the operation panel. The plate springs each have a spring property only in the one axial direction.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: March 3, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Hitoshi Ao
  • Patent number: 10571748
    Abstract: The invention provides an optical component including a resin part having translucency and a phase plate. The phase plate is configured to be disposed on an emitting direction side of a display part capable of emitting linearly polarized light. The resin part is uncontrolled in terms of phase difference. The phase plate is configured to be disposed between the display part and the resin part. The phase plate has three to five times as large retardation as the resin part.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: February 25, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Masato Shimizu
  • Patent number: 10556399
    Abstract: A plastic laminate structure including a plurality of, or a plurality of kinds of, plastic layers and an adhesive layer. The plastic layers are laminated together in a first direction. All the plastic layers are comprised exclusively of extruded plastic layers. The adhesive layer affixes together two of the plastic layers that are adjacent to each other in the first direction.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: February 11, 2020
    Assignee: HOSIDEN CORPORATION
    Inventors: Takeshi Isoda, Naoki Shiga
  • Patent number: 10547147
    Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: January 28, 2020
    Assignee: HOSIDEN CORPORATION
    Inventors: Keiichi Taniguchi, Katsutoshi Yamamoto
  • Patent number: 10548220
    Abstract: A multilayer printed wiring board including insulating layers, ground layers thereon, and at least one via hole. The ground layers include a wiring layer and a first impedance adjustment layer. The wiring layer includes a solid conductor and a conductive line. The conductive line is disposed inside an opening and a passage of the solid conductor. The first impedance adjustment layer includes a solid conductor having an opening. The via hole is located inside the openings of the wiring layer and the first impedance adjustment layer and is connected to the conductive line. A first distance is smaller than a second distance, where the first distance is a distance from an outline of the opening of the wiring layer to the via hole, and the second distance is a distance from an outline of the opening of the first impedance adjustment layer to the via hole.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: January 28, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Hayato Kondo
  • Patent number: D873219
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: January 21, 2020
    Assignee: Hosiden Corporation
    Inventor: Daisuke Sasaki
  • Patent number: D883223
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 5, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Takao Asano
  • Patent number: D883224
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 5, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Takao Asano
  • Patent number: D883225
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 5, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Takao Asano
  • Patent number: D887360
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: June 16, 2020
    Assignee: Hosiden Corporation
    Inventors: Toshimune Okamoto, Hideto Kobayashi
  • Patent number: D890705
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: July 21, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Hideto Kobayashi
  • Patent number: D890706
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: July 21, 2020
    Assignee: HOSIDEN CORPORATION
    Inventor: Hideto Kobayashi