Patents Assigned to HOYA Corporation USA
  • Patent number: 7373067
    Abstract: A multiple-core optical waveguide comprises: a substrate; lower and upper waveguide core layers; a waveguide core between the upper and lower waveguide core layers; upper and lower cladding; and middle cladding between the upper and lower waveguide core layers substantially surrounding the waveguide core. Each of the lower, middle, and upper claddings has a refractive index less than refractive indices of the lower waveguide core layer, the upper waveguide core layer, and the waveguide core. Along at least a given portion of the optical waveguide, the upper and lower waveguide core layers extend bilaterally substantially beyond the lateral extent of a propagating optical mode supported by the optical waveguide, the lateral extent of the supported optical mode being determined at least in part by the width of the waveguide core along the given portion of the optical waveguide.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: May 13, 2008
    Assignee: HOYA Corporation USA DBA Xponent
    Inventors: Henry A. Blauvelt, David W. Vernooy
  • Patent number: 7366379
    Abstract: An optical component may comprise a horizontal member with two side walls and a substantially transparent end wall protruding from the horizontal member. The end wall, side walls and horizontal member may partially enclose an interior volume, and optical functionality is imparted in any suitable manner on at least a portion of the end wall. An optical assembly may comprise such an optical component mounted on a waveguide substrate along with a planar waveguide and a second waveguide, which are end-coupled by either reflection from the optical component end wall or transmission through the optical component end wall. An end portion of a planar waveguide may be received within the interior volume of the mounted component. Proper positioning of the optical component relative to the waveguides may be facilitated by alignment surfaces and/or alignment marks on the component and/or waveguide substrate.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: April 29, 2008
    Assignee: Hoya Corporation USA
    Inventors: Henry A. Blauvelt, Joel S. Paslaski, David W. Vernooy
  • Publication number: 20080090104
    Abstract: A magnetic recording medium for perpendicular magnetic recording includes a substrate, a granular layer having magnetic crystal grains exhibiting perpendicular magnetic anisotropy and nonmagnetic substances for magnetically separating the magnetic crystal grains from each other at grain boundaries of the magnetic crystal grains, and a continuous film layer having magnetic grains to be exchange-coupled to the magnetic crystal grains, the grain boundary width of the magnetic grains being smaller than that of the magnetic crystal grains, wherein separation regions for magnetically separating tracks from each other are disposed in regions between the tracks of the magnetic recording medium in at least the continuous film layer.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 17, 2008
    Applicants: HOYA CORPORATION, HOYA MAGNETICS SINGAPORE PTE. LTD., HOYA CORPORATION USA
    Inventors: Yoshiaki SONOBE, Teiichiro UMEZAWA, Koichi WAGO
  • Publication number: 20080075845
    Abstract: A method for manufacturing a magnetic recording medium includes the steps of (a) forming a perpendicular magnetic recording layer and (b) applying an ion beam to regions between tracks of the perpendicular magnetic recording layer so as to form separation regions for magnetically separating the tracks from each other. In the step (a), a continuous film layer composed of a multilayer film is formed, and CoB layers and Pd layers are laminated in the multilayer film. In the step (b), the CoB layers and the Pd layers are melted by the ion beam so as to form an alloy of metals contained in the CoB layers and the Pd layers to thereby form the separation regions.
    Type: Application
    Filed: September 27, 2007
    Publication date: March 27, 2008
    Applicants: HOYA CORPORATION, HOYA MAGNETICS SINGAPORE PTE. LTD., HOYA CORPORATION USA
    Inventors: Yoshiaki SONOBE, Teiichiro UMEZAWA, Koichi WAGO
  • Patent number: 7330619
    Abstract: An optical apparatus comprises: a waveguide substrate; three planar optical waveguides formed on the substrate, each comprising a transmission core and cladding; a laser positioned to launch its optical output to propagate along the first waveguide; a photodetector positioned to receive an optical signal propagating along the second waveguide; and means formed on the substrate for i) transferring a first fraction of laser optical output propagating along the first waveguide to the second waveguide, and ii) transferring a second fraction of the laser optical output propagating along the first waveguide to the third waveguide. The transferring means may comprise: i) a pair of parallel spaced-apart tap core segments; ii) a branched splitter core; or iii) a lateral splitter core.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: February 12, 2008
    Assignee: HOYA Corporation USA
    Inventors: David W. Vernooy, Joel S. Paslaski
  • Patent number: 5447746
    Abstract: A magnetic recording disk is zone-textured by using two or more tubular needles with outlets opening to its surface. While the disk is rotated around its center axis, different coating materials such as solutions containing and not containing colloidal silica are passed through these needles and deposited through their outlets inside different zones on the disk surface. The needles are moved such that the radial distances of their outlets from the disk center vary within certain ranges corresponding to different zones such as the data and landing zones on the disk surface.
    Type: Grant
    Filed: November 18, 1994
    Date of Patent: September 5, 1995
    Assignee: Hoya Corporation USA
    Inventors: Rohit Ishizaki, Akinori Kurikawa, Rohit Narendra
  • Patent number: 5180977
    Abstract: The present invention provides a membrane probe contact bump compliancy system implemented in an integrated circuit (IC) testing system to nondestructively test a wafer. This integrated circuit system includes a test controller which is capable of controlling and executing a set of test programs, a wafer dispensing system, and a probe card. Under control of the test controller, the wafer dispensing system handles and controls the wafer for the performance of said set of test program. The probe card has a performance board and a plurality of probes. In cooperation with the wafer dispensing system, the probe card positions each of the probes to engage the wafer substantially at a predefined location with a controlled amount of force. The performance board further includes a transmission line corresponding to each probe.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: January 19, 1993
    Assignee: Hoya Corporation USA
    Inventor: Richard E. Huff