Abstract: A cover protector contains a heat insulation material containing fibers including first organic fibers and/or inorganic fibers; and an organic film bonded to at least a part of a surface of the heat insulation material. At least a part of the fibers protrudes from the surface of the heat insulation material. The first organic fibers may be water-insoluble. The heat insulation material may contain the first organic fibers and second organic fibers having a different property from the first organic fibers.

Abstract: A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.

Abstract: A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.

Abstract: A heat transfer suppression sheet contains a heat insulation material containing an inorganic particle and an organic fiber or an inorganic fiber; and a mica sheet stacked on at least one of a first surface and a second surface of the heat insulation material orthogonal to a thickness direction. The heat insulation material may have a plurality of three-dimensionally connected pores.

Abstract: A bus bar for use in a power storage device including a battery cell includes a bus bar body containing a conductive material; and a heat-resistant insulating film containing a filler and covering the bus bar body. The heat-resistant insulating film has a surface roughness (Ry) of 0 ?m<Ry<50 ?m. The filler may include an inorganic compound, and the inorganic compound may include a silicate compound.

Abstract: A wiring substrate includes a core substrate including a main body and a magnetic resin body, and through-hole conductors formed in the magnetic resin body in the core substrate such that the through-hole conductors are penetrating through the magnetic resin body in the core substrate. The core substrate is formed such that an inter-conductor material is positioned between the through-hole conductors in the magnetic resin body and that the inter-conductor material has magnetism that is lower than magnetism of the magnetic resin body or is non-magnetic.

Abstract: A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.

Abstract: A wiring substrate includes a first build-up part includes first insulating layers, first conductor layers and first via conductors, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers and second via conductors. The first conductor layers in the first build-up part and the second conductor layers in the second build-up part include wirings such that a wiring width and an inter-wiring distance of the wirings in the first conductor layers are smaller than a wiring width and an inter-wiring distance of the wirings in the second conductor layers, an aspect ratio of the wirings in the first conductor layers is in the range of 2.0 to 4.0, the wiring width of the wirings in the first conductor layers is 3 ?m or less, and the inter-wiring distance of the wirings in the first conductor layers is 3 ?m or less.

Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that each of the coils includes wirings formed on the first surface of the flexible substrate and wirings formed on the second surface of the flexible substrate. The coils include an N-th coil forming an N-th phase and an (N+1)-th coil formed adjacent to the N-th coil and forming an (N+1)-th phase different from the N-th phase, and each coil is formed such that an inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the N-th coil, and the inter-wiring distance between the wirings forming the N-th coil and the wirings forming the (N+1)-th coil is larger than an inter-wiring distance between the wirings forming the (N+1)-th coil.

Abstract: A mat material including: a base mat containing inorganic fibers and having a first main surface and a second main surface; and a sheet material disposed on at least one of the first main surface or the second main surface, wherein the sheet material is a stacked sheet material in which longitudinally oriented fibers and transversely oriented fibers are stacked, the sheet material has openings surrounded by the longitudinally oriented fibers and the transversely oriented fibers, and an average opening area of the sheet material is more than 0 mm2/piece and 0.7 mm2/piece or less.

Abstract: A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is connected to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is formed in a through hole penetrating through the glass substrate, and the conductor layer and via conductor are formed such that the seed layer is formed by sputtering and includes an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium.

Abstract: An optical waveguide includes an optical waveguide body including a lower cladding, a core and an upper cladding and having an upper cladding non-formation region and an upper cladding formation region. The optical waveguide body has a core exposed portion and a core non-exposed portion formed such that the core exposed portion has an upper surface of the core exposed at at least one end of the optical waveguide body in the upper cladding non-formation region, the core non-exposed portion has the upper surface of the core not exposed in the upper cladding formation region, and the optical waveguide body is formed to satisfy W1>W2, where W1 is a core width of the core exposed portion and W2 is a core width of the core non-exposed portion.

Abstract: A heat transfer suppression sheet contains a heat insulation material containing inorganic particles; an elastic sheet stacked on the heat insulation material; and a resin film covering the heat insulation material and the elastic sheet. The heat insulation material has a pair of heat insulation material main surfaces orthogonal to a thickness direction, the elastic sheet has a pair of elastic sheet main surfaces orthogonal to a thickness direction and elastic sheet end surfaces connecting the pair of elastic sheet main surfaces, the heat insulation material and the elastic sheet are stacked such that at least one of the heat insulation material main surfaces and the one elastic sheet main surface face each other, and at least one end surface of the elastic sheet end surfaces is pressed by the resin film to be inclined inward as being away from the heat insulation material.

Abstract: A wiring substrate includes a core substrate, a build-up part formed on a surface of the substrate and including insulating layers and conductor layers, and a covering insulating layer formed on the build-up part such that the covering layer is covering the outermost surface of the build-up part. The build-up part is formed such that the insulating layers include a first insulating layer forming the outermost one of the insulating layers, that the conductor layers include a first conductor layer formed on the first insulating layer and including a first conductor pad, and that a tensile strength of the first insulating layer is higher than a tensile strength of each insulating layer other than the first insulating layer in the first build-up part, and the covering layer is formed such that the covering layer has opening entirely exposing an upper surface and a side surface of the first conductor pad.

Abstract: Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). The first inorganic fibers (30) are amorphous fibers. The second inorganic fibers (31) contain at least one kind selected from amorphous fibers having a glass transition point higher than that of the first inorganic fibers (30) and crystalline fibers.

Abstract: A method for manufacturing a wiring substrate includes forming a laminate including a core substrate, a first build-up part, and a second build-up part, forming a first groove on the laminate from surface of the laminate on a first build-up part side such that the first groove is formed in the first build-up part, forming a second groove on the laminate from surface of the laminate on a second build-up part side such that the second groove is formed in the second build-up part and has center of width that is offset from center of width of the first groove, and cutting the core substrate along one of the first and the second grooves such that the laminate is divided into multiple wiring substrates. The first build-up part is formed on first surface of the core substrate. The second build-up part is formed on second surface of the core substrate.

Abstract: A heat transfer suppression sheet contains an elastic body that remains in a compressed state at temperatures below 90° C. and that is released from the compressed state at a temperature that is 90° C. or higher. The elastic body may be maintained in the compressed state by a blended binder material, and the elastic body may be stacked with a heat insulation material.

Abstract: A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 ?m to 0.23 ?m, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 ?m around an outer edge of the through hole on the surface of the pad.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in an opening formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The via conductor is formed such that the via conductor includes a seed layer covering an inner wall surface of the resin insulating layer inside of the opening and an electrolytic plating layer formed on the seed layer such that the seed layer has a plurality of columnar parts grown in columnar shapes.