Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

Abstract: A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the smallest line width of the wirings in the embedded wiring layer is in the range of 2 ?m to 8 ?m, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the smallest line width of the wirings in the embedded wiring layer.

Abstract: A wiring substrate includes an insulating layer including resin and filler particles, and an embedded wiring layer including wirings and embedded in the insulating layer such that the wirings are filling grooves formed on a surface of the insulating layer, respectively. The embedded wiring layer is formed such that the inter-wiring distance between the closest two wirings of the wirings in the embedded wiring layer is in the range of 2 ?m to 8 ?m, and the insulating layer is formed such that the maximum particle size of the filler particles is 50% or less of the inter-wiring distance.

Abstract: A wiring board includes a resin insulating layer having a component mounting surface, first connection pads formed on the component mounting surface of the resin insulating layer, second connection pads formed on the component mounting surface of the resin insulating layer such that the second connection pads are surrounding the first connection pads, and a protruding part including a metal material and formed on the component mounting surface of the resin insulating layer such that a portion of the protruding part is embedded in the resin insulating layer and that the protruding part is positioned between the first connection pads and the second connection pads and surrounding the first connection pads.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

Abstract: A semiconductor package includes a printed wiring board, a logic IC mounted on the printed wiring board, a connector mounted on the printed wiring board, an optical element that is accommodated inside the printed wiring board and converts an optical signal to an electrical signal and/or the electrical signal to the optical signal, an optical waveguide formed between the optical element inside the printed wiring board and the connector on the printed wiring board such that the optical waveguide optically connects the optical element and the connector, and an electrical path formed between the optical element and the logic IC such that the electrical path connects the logic IC and the optical element and that a length of the electrical path is 1 mm or less.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.

Abstract: The present invention provides an antiviral substrate that is excellent in antiviral properties, is excellent in transparency or the like, and is capable of maintaining characteristics such as the transparency of a base material and the color of the surface of the base material. The present invention relates to an antiviral substrate in which a cured material of an electromagnetic curable resin containing a copper compound is scattered in the form of islands on a surface of a base material, and at least a part of the copper compound is exposed on a surface of the cured material of the electromagnetic curable resin.

Abstract: A method for manufacturing a wiring substrate includes forming a plating film on a metal foil laminated on a surface of an insulating layer, forming an etching resist on the plating film such that the etching resist has an opening for forming a conductor pattern, conducting a first etching process such that part of the plating film exposed from the opening of the etching resist is removed and that part of the metal foil is exposed, removing the etching resist from the plating film on the metal foil laminated on the surface of an insulating layer, and conducting a second etching process such that the part of the metal foil exposed by the first etching process is removed and that a conductor layer having the conductor pattern is formed on the surface of the insulating layer.

Abstract: A wiring substrate includes an insulating layer including resin and filler particles, conductor layers including an upper-layer conductor layer and a lower-layer conductor layer such that the insulating layer is sandwiched between the upper-layer and lower-layer conductor layers, and a penetrating conductor formed in the insulating layer such that the penetrating conductor is penetrating through the insulating layer and connecting the upper-layer and lower-layer conductor layers. The penetrating conductor is formed such that the penetrating conductor has a first length which is the maximum width of the penetrating conductor in the direction orthogonal to the thickness direction of the wiring substrate and the first length is 25 ?m or less, and the insulating layer is formed such that the maximum particle size of the filler particles in a region within the distance of 40% of the first length from the penetrating conductor is 20% or less of the first length.

Abstract: The present invention provides a method of producing a honeycomb structured body having excellent mechanical strength.

Abstract: The present invention provides a method of producing a honeycomb structured body having excellent mechanical strength.

Abstract: A printed wiring board includes resin insulating layers, and conductor layers laminated on the resin insulating layers, respectively. The conductor layers includes a conductor layer including a conductor circuit formed such that the conductor circuit has recesses each having a depth of 2.0 ?m or more and a bottom whose diameter is larger than a diameter of an opening part of a respective one of the recesses.

Abstract: A printed wiring board includes resin insulating layers, and conductor layers including a conductor layer such that the conductor layer includes a conductor circuit and that the conductor circuit has a surface index X/Y in a range of 1.00 to 2.20 where X is a length of an outer circumference of cross section of the conductor circuit, and Y is a length of an outer circumference of a reference quadrangle in the cross section of the conductor circuit. The reference quadrangle has a first reference line drawn with reference to bottom of deepest recess on first side, a second reference line is drawn with reference to bottom of deepest recess on second side, a third reference line is drawn with reference to bottom of deepest recess on third side, and a fourth reference line is drawn with reference to bottom of deepest recess on fourth side of the outer circumference.

Abstract: A sound-absorbing member has a Helmholtz resonance structure including an inlet passage and a hollow portion connected to the outside through the inlet passage, wherein the sound-absorbing member includes a first layer and a second layer disposed on the first layer, the first layer includes a first main surface and a second main surface opposite to the first main surface, the second layer includes a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, the first layer includes a first through-hole penetrating through the second main surface from the first main surface and defining the inlet passage, the second main surface includes a second main surface opening defining an end portion of the first through-hole and a second main surface flat portion, the third main surface includes a third main surface opening defining an end portion of the hollow portion and a third main surface flat portion, the second main surface opening has an opening area smaller

Abstract: To provide a heat insulation sheet for a battery pack that has a good shape retention property and can maintain an excellent heat insulation property even when vibration or pressure is applied, and a battery pack in which a heat insulation sheet for a battery pack is interposed between battery cells. A heat insulation sheet (10) of the present invention is a heat insulation sheet for a battery pack, the heat insulation sheet being interposed between battery cells in a battery pack in which a plurality of battery cells is connected in series or in parallel. The heat insulation sheet (10) includes: a first heat insulation material (21) containing a silica nanoparticle; and a second heat insulation material (22) containing a plate-shaped particle containing a silica component and having a curved surface.

Abstract: A printed wiring board includes a resin insulating layer, pads formed on the resin insulating layer, an uppermost resin insulating layer formed on the resin insulating layer such that the uppermost resin insulating layer is covering the pads and has openings exposing the pads, respectively, via conductors formed in the uppermost resin insulating layer such that the via conductors are formed on the pads exposed from the openings in the uppermost resin insulating layer, respectively, and metal posts formed on the via conductors such that each of the metal posts has a portion on a surface of the uppermost resin insulating layer around the via conductors and a side surface having a flared bottom extending toward the uppermost resin insulating layer.

Abstract: Provided is a heat insulation sheet for battery pack that can achieve uniform heat insulation property and heat dissipation property, and can insulate heat between adjacent battery cells and quickly dissipate heat generated by the battery cells when thermal runaway occurs in the battery cells, and a battery pack in which a heat insulation sheet for battery pack is interposed between battery cells. A heat insulation sheet (10) for battery pack in which battery cells are connected in series or in parallel, the heat insulation sheet being interposed between the battery cells and containing: a first particle (21) that is uniformly dispersed and contains a silica nanoparticle; and an inorganic fiber (23) that is uniformly dispersed and oriented in one direction which is parallel to a main surface of the heat insulation sheet (10).