Abstract: A cover protector includes a heat insulation material containing inorganic particles, an inorganic fiber sheet, and an adhesive layer bonding the heat insulation material and the inorganic fiber sheet and containing an organic material. The adhesive layer includes a plurality of island-like portions and a mesh-like portion connecting the plurality of island-like portions to each other when viewed in a stacking direction of the heat insulation material and the inorganic fiber sheet.

Abstract: A method for manufacturing a wiring substrate includes forming a conductor layer on a surface of a first insulating layer such that the conductor layer includes a conductor pad forming a laser stopper, forming a second insulating layer on the first insulating layer such that the second insulating layer covers the conductor layer, forming an opening in the second insulating layer by irradiation with laser light such that the opening partially exposes the conductor pad, etching the conductor pad such that a recess is formed in an inner wall surface of the second insulating layer in the opening and exposes a surface of a remaining portion of the conductor pad at position recessed from the inner wall surface, cutting the inner wall surface such that a depth of the recess is reduced, positioning a component in the opening formed in the second insulating layer, and filling the opening with resin.

Abstract: A method for manufacturing a printed wiring board includes preparing an intermediate substrate including an insulating layer, a conductor layer including circuits, and a first resin insulating layer, inputting, to a laser processing machine that forms openings, positions of the openings, generating, based on analysis of the conductor layer, classification of the circuits, inputting, to the machine, shot numbers for forming the openings determined based on the classification, and executing the machine based on the positions and shot numbers such that the openings are formed. The circuits include power supply, ground, and signal circuits, the classification includes stratifying such that the power supply and ground circuits belong to the first category and the signal circuits belong to the second category, and the inputting includes setting the shot number for the openings belonging to the first category is smaller than the shot number for the openings belonging to the second category.

Abstract: 39 A papermaking mat that is less likely to be cracked even when being wound around a base material is provided. A papermaking mat of the present invention has a rectangular shape in a plan view and includes inorganic fibers, a first main surface, and a second main surface facing the first main surface. The first main surface includes multiple raised portions each having a linear shape. When the papermaking mat is viewed in a plan view, the raised portions: are aligned in one direction in a plane direction of the first main surface; have an average length of 5 to 200 mm, an average width of 1 to 50 mm, and an average height of 0.05 to 0.50 mm; amount to five or more in a range of a freely selected 10 cm-long×10 cm-wide square of the first main surface; and include a fiber bundle being formed by entangling multiple fibers and twisting together.

Abstract: The present invention provides a papermaking mat that is less likely to crack even when wound around a base material and that has a sufficiently high surface pressure. The papermaking mat of the present invention is a papermaking mat containing: inorganic fibers including inorganic fibers forming fiber bundles each formed from 10 or more of the inorganic fibers entangled and twisted together, and the inorganic fibers forming no fiber bundles, wherein the fiber bundles have an average length of more than 5 mm, and when the papermaking mat is subjected to fiber opening by a fiber opening method for papermaking mats described below to obtain a slurry containing the inorganic fibers, the inorganic fibers in the slurry have a bulk specific gravity in water of 0.012 to 0.035 g/cm3. In the fiber opening method for papermaking mats, a papermaking mat is heat-treated at 600° C. for one hour; 5.

Abstract: A heat transfer suppression sheet contains an inorganic particle, an organic fiber and a plurality of three-dimensionally connected pores. The organic fiber may include a fusion portion covering at least a portion of a surface of the organic fiber, and at least a portion of the inorganic particle may be fused to the organic fiber by the fusion portion.

Abstract: A printed wiring board includes an outermost resin insulating layer, a conductor layer formed on the outermost resin insulating layer, a solder resist layer formed on the outermost resin insulating layer such that the solder resist layer is covering the conductor layer, a Ni layer formed on a surface of a portion of the conductor layer such that the solder resist layer has an opening exposing the portion of the conductor layer, an alloy layer formed on a surface of the Ni layer such that the alloy layer is positioned in the opening formed in the solder resist layer, and a solder bump layer formed on a surface of the alloy layer such that the solder bump layer includes an Sn-Pd alloy having a Pd content of 0.5 at% or less.

Abstract: A bus bar for use in a power storage device including a battery cell includes a bus bar body having a plurality of planar portions and a corner portion that is formed between adjacent planar portions and that extends linearly; and an insulating film formed on a surface of the bus bar body. A film thickness of the insulating film formed on the corner portion of the bus bar body is smaller than a film thickness of the insulating film formed on the planar portion of the bus bar body.

Abstract: A papermaking mat with a sufficiently high surface pressure is provided. The papermaking mat of the present invention includes: inorganic fibers including inorganic fibers forming fiber bundles each formed from 10 or more of the inorganic fibers entangled and twisted together, and inorganic fibers forming no fiber bundles, wherein the fiber bundles have an average length of 5 to 15 mm, the fiber bundles have an average width of 0.2 to 1.0 mm, the fiber bundles include a crimped fiber bundle, and a trace length of the crimped fiber bundle is greater than a length of the crimped fiber bundle by 0.1 mm or more as measured by a trace length measurement method in which a crimped fiber bundle is placed still on a flat surface, and the crimped fiber bundle placed still is traced therealong from one end to another end thereof as viewed from above to determine a traced distance as “trace length of the crimped fiber bundle”.

Abstract: A wiring substrate includes a core part including a glass plate and a through-hole conductor penetrating through the glass plate, and a build-up part formed on a surface of the glass plate of the core part and including conductor layers and insulating layers. The build-up part is formed such that the conductor layers include four or more conductor layers and that the insulating layers include four or more insulating layers, the core part includes a land and an adhesive film formed such that the land is formed on the surface of the glass plate and positioned on the through-hole conductor and that the adhesive film includes a diamond-like carbon film and is covering a surface of the land and the surface of the glass plate not covered by the land.

Abstract: A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.

Abstract: A heat transfer suppression sheet contains an inorganic particle and an organic fiber. A surface of the heat transfer suppression sheet has a first region and a second region, the first region containing a stripe-like fiber bundle composed of the organic fibers, and the second region does not contain the fiber bundle. The first region may contain the stripe-like fiber bundle passing through at least three continuous virtual frames, each frame being a 5 mm square.

Abstract: A heat transfer suppression sheet contains at least one kind of fiber selected from an inorganic fiber and an organic fiber, and a liquid repellent substance having a surface tension smaller than a surface tension of water. The heat transfer suppression sheet may contain inorganic particles, and at least a part of the inorganic particles may be the liquid repellent substance.

Abstract: A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer such that the adhesive layer is covering an upper surface and a side surface of the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer formed on the insulating layer. The conductor layer is formed such that the upper surface of the conductor layer has an unevenness having a root mean square roughness Rq of 0.23 ?m or less.

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first and second conductor layers and has a land portion extending on a boundary part of the resin insulating layer. The via conductor is formed in a via hole formed in the resin insulating layer. The resin insulating layer is formed such that the boundary part has a surface roughness that is larger than a surface roughness of the surface on which the second conductor layer formed and that an inner wall surface in the via hole in the resin insulating layer is equal to or larger than the surface roughness of the boundary part of the resin insulating layer.

Abstract: A cover protector contains a heat insulation material containing fibers including first organic fibers and/or inorganic fibers; and an organic film bonded to at least a part of a surface of the heat insulation material. At least a part of the fibers protrudes from the surface of the heat insulation material. The first organic fibers may be water-insoluble. The heat insulation material may contain the first organic fibers and second organic fibers having a different property from the first organic fibers.

Abstract: A wiring substrate includes a substrate, and a conductor layer formed on the substrate and including copper such that the conductor layer is patterned. The conductor layer is formed such that the upper surface of the conductor layer has a width that is equal to or larger than a width of the lower surface of the conductor layer and that the width of the lower surface is larger than the minimum width of a middle portion of the conductor layer between the upper surface and the lower surface.

Abstract: A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.

Abstract: A heat transfer suppression sheet contains a heat insulation material containing an inorganic particle and an organic fiber or an inorganic fiber; and a mica sheet stacked on at least one of a first surface and a second surface of the heat insulation material orthogonal to a thickness direction. The heat insulation material may have a plurality of three-dimensionally connected pores.

Abstract: A wiring substrate includes a core substrate including a main body and a magnetic resin body, and through-hole conductors formed in the magnetic resin body in the core substrate such that the through-hole conductors are penetrating through the magnetic resin body in the core substrate. The core substrate is formed such that an inter-conductor material is positioned between the through-hole conductors in the magnetic resin body and that the inter-conductor material has magnetism that is lower than magnetism of the magnetic resin body or is non-magnetic.