Patents Assigned to Ibiden Co., Ltd.
  • Patent number: 10440823
    Abstract: A printed wiring board includes a core substrate, a first build-up layer, and a second build-up layer. The core substrate includes a core layer, through-hole conductors and through-hole lands. Metal foils of the through-hole lands in the core substrate have mat surfaces at interfaces of the core layer in the core substrate, metal foils of via lands in the build-up layers have inner mat surfaces at interfaces of insulating layers, and metal foils of outermost conductor layers in the build-up layers have outermost mat surfaces at interfaces of outermost insulating layers. Ten-point average roughness (RzI1) of the inner first mat surface is smaller than each often-point average roughness (Rz1, Rz2) of the mat surfaces and ten-point average roughness (RzO1, RzO2) of the outermost mat surfaces. Ten-point average roughness (RzI2) of the inner second mat surface is smaller than each of the ten-point average roughness (Rz1, Rz2, RzO1, RzO2).
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: October 8, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Publication number: 20190288398
    Abstract: A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Patent number: 10420214
    Abstract: A printed wiring board includes a substrate having first and second surfaces such that the substrate has a thickness in a range of 30 ?m to 100 ?m between the first and second surfaces, and through hole conductors including plating material such that the through hole conductors are formed in through holes extending from the first surface to the second surface. Each through hole has a first opening portion and a second opening portion connected to the first opening portion such that the first opening portion has a tapered shape decreasing in diameter from the first surface toward the second surface, the second opening portion has a tapered shape decreasing in diameter from the second surface toward the first surface, and center lines of the first and second opening portions are shifted from each other by a distance that is equal to or less than the thickness of the substrate.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: September 17, 2019
    Assignee: IBIDEN CO., LTD.
    Inventor: Toshiaki Hibino
  • Patent number: 10405426
    Abstract: A printed wiring board includes: a core substrate having a core layer, first and second conductor layers, and through-hole conductors penetrating through the core layer and connecting the conductor layers; and first and second build-up layers each including an insulating layer, an inner side conductor layer, an outermost insulating layer, an outermost conductor layer, and a solder resist layer. Each of the conductor layers includes conductor circuits having substantially a trapezoid cross-sectional shape, and spaces between adjacent conductor circuits, and includes a metal foil, a seed layer, and an electrolytic plating film. The inner side conductor layers have the smallest minimum circuit width, the smallest minimum space width and the largest base angle among the conductor layers. The insulating layers have the smallest ten-point average roughness rz3, rz7 among the ten-point average roughness rz3, rz7, rz1, rz2, rz5 and rz9 of the core layer, insulating layers and outermost insulating layers.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 3, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 10398038
    Abstract: A printed wiring board includes a laminate, conductor posts formed on a surface of the laminate, and a mold resin layer formed on the surface of the laminate such that the posts are in the mold layer covering side surfaces of the posts. The laminate includes conductor layers and one or more resin insulating layers, the conductor layers includes a first conductor layer embedded in a resin insulating layer forming the surface of the laminate and has one surface exposed on the surface of the laminate, the first conductor layer includes first and second conductor pads such that the second pads are formed on outer peripheral side of the first pads, the mold layer has a cavity exposing the first pads, the posts are formed on the second pads on the surface of the laminate, and the first conductor layer includes fan-out wirings extending from inside to outside the cavity.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 27, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Kazuki Kajihara, Naoki Kurahashi
  • Patent number: 10388451
    Abstract: An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 ?m to 200 ?m and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 20, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasuhiko Mano, Hiroaki Kodama, Hisashi Kato
  • Publication number: 20190246496
    Abstract: A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 ?m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 8, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Youhong WU
  • Publication number: 20190245401
    Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 8, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 10375828
    Abstract: A printed wiring board includes: a core substrate having a core layer and first and second conductor layers; a first build-up layer including a first insulating layer, an inner first conductor layer, an outermost first insulating layer, and an outermost first conductor layer; and a second build-up layer including a second insulating layer, an inner second conductor layer, an outermost second insulating layer, and an outermost second conductor layer. Each conductor layer includes metal foil, seed layer, and electrolytic plating film, t1/T1, t2/T2, u1/U1 and u2/U2 are smaller than 1, and s1/S1 and s2/S2 are larger than 1, where t1, t2, u1, u2, s1 and s2 are electrolytic plating film thicknesses of the first and second and outermost and inner first and second conductor layers, T1, T2, U1, U2, S1 and S2 are metal foil thicknesses of the first and second and outermost and inner first and second conductor layers.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: August 6, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Publication number: 20190232218
    Abstract: A filter membrane includes a membrane having through holes that selectively separates specific material in processing medium, the membrane including first, second and third layers such that the first layer has first surface that is supplied with processing medium, the third layer has second surface on the opposite side of the first surface, and the second layer is formed between the first and third layers. The first layer includes first convex and concave portions, the third layer includes second convex and concave portions each having a larger area than each first concave portion, the second convex portions are formed to surround the second concave portions and connected to one another, the second layer has through holes connecting the second concave portions and first set of the first concave portions, and the first concave portions include second set in regions opposing the second convex portions that is connected to each other.
    Type: Application
    Filed: January 29, 2019
    Publication date: August 1, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Masatoshi KUNIEDA, Hirokazu HIGASHI, Tatsuhiro KAWAI
  • Patent number: 10363552
    Abstract: Provided is a honeycomb fired body in which the pressure loss in the initial state where PM has not accumulated is sufficiently low, the strength is sufficiently high, and the heat capacity is not small.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: July 30, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Shunpei Enoshita, Satoshi Shinohara
  • Patent number: 10368440
    Abstract: A printed wiring board includes: a core substrate having a core layer, conductor layers on the core layer, and through-hole conductors; a first build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer; and a second build-up layer including an insulating layer on the substrate, an inner side conductor layer on the insulating layer, an outermost insulating layer on the inner side conductor layer, and an outermost conductor layer on the outermost insulating layer. Each of the conductor layers, inner side conductor layers, and outermost conductor layers has a metal foil, a seed layer and an electrolytic plating film, and that each inner side conductor layer has the smallest thickness among the conductor layers, inner side conductor layers and outermost conductor layers.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: July 30, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takema Adachi, Toshihide Makino, Hidetoshi Noguchi
  • Patent number: 10368438
    Abstract: A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material, the conductor layer has pattern including conductor pads in contact with the resist layer such that the pads are positioned in openings in the resist layer, and the resist layer satisfies a first condition that a chemical species derived from a photopolymerization initiator has concentration higher in the portion in contact with the laminated material than concentration in the surface portion and/or a second condition that the chemical species derived from the initiator in the portion in contact with the laminated material has photopolymerization initiating ability higher than a chemical species derived from a photopolymerization initiator in the surface portion.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: July 30, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Hiroyuki Nishioka, Shinsuke Ishikawa
  • Publication number: 20190215959
    Abstract: A printed wiring board includes a core substrate, a first build-up layer, and a second build-up layer. The core substrate includes a core layer, through-hole conductors and through-hole lands. Metal foils of the through-hole lands in the core substrate have mat surfaces at interfaces of the core layer in the core substrate, metal foils of via lands in the build-up layers have inner mat surfaces at interfaces of insulating layers, and metal foils of outermost conductor layers in the build-up layers have outermost mat surfaces at interfaces of outermost insulating layers. Ten-point average roughness (RzI1) of the inner first mat surface is smaller than each of ten-point average roughness (Rz1, Rz2) of the mat surfaces and ten-point average roughness (RzO1, RzO2) of the outermost mat surfaces. Ten-point average roughness (RzI2) of the inner second mat surface is smaller than each of the ten-point average roughness (Rz1, Rz2, RzO1, RzO2).
    Type: Application
    Filed: January 11, 2019
    Publication date: July 11, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Takema ADACHI, Toshihide MAKINO, Hidetoshi NOGUCHI
  • Publication number: 20190215958
    Abstract: A printed wiring board includes a build-up layer including an insulating layer and a first conductor layer including a component mounting pad, a covering layer formed on the build-up layer such that the covering layer is covering the insulating layer and has opening exposing the pad, a reinforcement layer formed on the covering layer and having cavity exposing the pad and the covering layer, a conductor layer formed on the reinforcement layer such that the conductor layer is on the opposite side of the covering layer on the build-up layer, and a via conductor formed in the reinforcement layer such that the via conductor electrically connects the first conductor layer and conductor layer on the reinforcement layer. The first conductor layer is embedded in the insulating layer forming a surface of the build-up layer such that the first conductor layer has surface exposed on the surface of the build-up layer.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 11, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Shunsuke Sakai
  • Patent number: 10335727
    Abstract: The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open end at the exhaust gas outlet side and a plugged end at the exhaust gas inlet side, and an outer wall on the periphery thereof. The cross-sectional shape of each exhaust gas introduction cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion. The cross-sectional shape of each exhaust gas emission cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: July 2, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiaki Shibata, Akihito Ogiso, Hirokazu Suzuki
  • Publication number: 20190200462
    Abstract: A printed wiring board includes a core substrate having cavity to accommodate an electronic component and including a front conductor layer formed on front side of the core substrate, and a back conductor layer formed on back side of the core substrate, through-hole conductors formed through the core substrate such that the through-hole conductors connect the front and back conductor layers of the core substrate, a front build-up layer formed on front surface of the core substrate and including interlayer insulating layers and conductor layers, and a back build-up layer formed on back surface of the core substrate and including interlayer insulating layers and conductor layers. The conductor layers in the front build-up layer include a conductor layer sandwiching one of the interlayer insulating layers with the front conductor layer such that the conductor layer and the front conductor layer have the same electric potential in region surrounding the cavity.
    Type: Application
    Filed: December 27, 2018
    Publication date: June 27, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Takema Adachi, Toshihide Makino, Yasushi Usami
  • Publication number: 20190200465
    Abstract: A multilayer wiring board includes a base substrate including conductor layers and insulating layers formed such that the conductor layers and the insulating layers are laminated alternately and that the conductor layers include a first conductor pattern, an inter-pattern insulating resin layer formed on a surface of the base substrate and including an insulating resin layer and an insulating base material laminated on the insulating resin layer such that resin forming the insulating resin layer is filling gaps formed between portions of the first conductor pattern, and a second conductor pattern formed on an outer layer side of the first conductor pattern such that the inter-pattern insulating resin layer is formed between the first conductor pattern and the second conductor pattern. The base substrate, the inter-pattern insulating resin layer and the second conductor pattern form an antenna portion.
    Type: Application
    Filed: December 27, 2018
    Publication date: June 27, 2019
    Applicant: Ibiden Co., Ltd.
    Inventors: Yoji Mori, Toshihide Makino, Taichi Ito
  • Publication number: 20190198446
    Abstract: A printed wiring board includes a core substrate, and a build-up layer formed on the substrate. The substrate includes core material, third conductor layer, fourth conductor layer, and through-hole conductors. The build-up layer is formed on the core material and third conductor layer and includes insulating layers, first conductor layers, and via conductors. The build-up layer has central area and outer peripheral area such that the via conductors include central area via conductors and outer peripheral area via conductors, diameter of central area via conductor is smaller than diameter of outer peripheral area via conductor, the outermost first conductor layer includes first pads to mount first electronic component and second pads to mount second electronic component, the first and second pads are connected to each other via the central via conductors, and the lowermost insulating layer does not have the via conductors in the central area of the build-up layer.
    Type: Application
    Filed: December 26, 2018
    Publication date: June 27, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Yoji SAWADA
  • Patent number: 10319892
    Abstract: A light-emitting element mounting substrate includes a substrate including insulating resin, a first conductor layer formed on a first surface of the substrate and having an element mounting portion, a second conductor layer formed on a second surface of the substrate on the opposite side of the first surface, metal blocks formed such that the metal blocks are penetrating through the first conductor layer, the substrate and the second conductor layer and positioned in the element mounting portion of the first conductor layer, and through-hole conductors formed adjacent to the metal blocks respectively such that the through-hole conductors electrically connect the first conductor layer and the second conductor layer and that a diameter of each metal block is larger than a diameter of each through-hole conductor.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: June 11, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Takahisa Hirasawa, Kiyotaka Tsukada