Abstract: A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.

Abstract: A printed wiring board includes an insulating layer, and a conductor layer formed on the insulating layer and having degas holes formed such that the degas holes are penetrating through the conductor layer and exposing portions of the insulating layer. The conductor layer is formed such that each of the degas holes is a polygon shape having at least one inner angle of 100 degrees or more.

Abstract: A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, and coils including first wirings and second wirings such that the first wirings are formed on the first surface of the flexible substrate and that the second wirings are formed on the second surface of the flexible substrate. The flexible substrate has one or more recesses formed on one or more longitudinal sides of the flexible substrate and is formed to be wound in a circumferential direction around an axis extending in the width direction of the flexible substrate orthogonal to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape.

Abstract: A coil substrate includes a flexible substrate and coils including first wirings and second wirings. The first wirings are formed on a first surface of the substrate. The second wirings are formed on a second surface of the substrate. The flexible substrate has a first end in a longitudinal direction of the substrate and is wound from the first end in a circumferential direction around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the substrate is formed into a cylindrical shape, the first surface of the substrate is positioned on an inner circumferential side of the cylindrical shape, and the second surface of the substrate is positioned on an outer circumferential side of the cylindrical shape, and the substrate has a first region adjacent to the first end such that the first region includes the second wirings and does not include the first wirings.

Abstract: A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer.

Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and coils such that the coils include first wirings formed on a first surface of the flexible substrate and second wirings formed on a second surface of the flexible substrate on the opposite side. The coil substrate is wound N turns where N is an integer of 2 or more in a circumferential direction such that the first surface of the flexible substrate is positioned on an inner circumferential side of the coil substrate, the second surface of the flexible substrate is positioned on an outer circumferential side of the coil substrate, and a gap is formed between an M-th layer where M is an integer equal to or larger than 1 and less than N and an (M+1)-th layer from an inner side of N circumferential layers formed by winding the coil substrate N turns.

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on a surface of the insulating layer and including a conductor pad, a covering layer formed on the insulating layer and covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including a core part, and a conductor post including plating metal and formed on the conductor pad such that the conductor post is penetrating through the covering layer and connected to a component. The insulating layer has a component region covered by the component when the component is connected to the conductor post, the core part has an end surface facing the opposite direction with respect to the insulating layer and exposed in the component region and a distance between the end surface and the surface of the insulating layer is greater than a thickness of the covering layer.

Abstract: Provided are a heat transfer suppression sheet having an excellent heat transfer prevention effect and excellent retainability of inorganic particles and shape retainability at a high temperature, and a battery pack in which the heat transfer suppression sheet is interposed between battery cells. The heat transfer suppression sheet (10) includes inorganic particles (20), first inorganic fibers (30), and second inorganic fibers (31). An average fiber diameter of the first inorganic fibers (30) is larger than an average fiber diameter of the second inorganic fibers (31). The first inorganic fibers (30) have a linear shape or a needle shape, and the second inorganic fibers (31) have a dendritic shape or a crimped shape.

Abstract: A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.

Abstract: A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part laminated on the first build-up part and including an insulating layer and a conductor layer. The minimum width and minimum inter-wiring distance of wirings in the first build-up part are smaller than the minimum width and minimum inter-wiring distance of wirings in the second build-up part. The insulating layer in the first build-up part includes resin and inorganic particles including first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin such that the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin, respectively. The insulating layer of the first build-up part has a surface covered by the conductor layer and including a surface of the resin and exposed surfaces of the first portions.

Abstract: A wiring substrate includes a first build-up part including first insulating layers, first conductor layers, and first via conductors, and a second build-up part including second insulating layers and second conductor layers. The minimum wiring width and minimum inter-wiring distance in the first conductor layers are smaller than the minimum wiring width and minimum inter-wiring distance in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer formed on the first layer. The first layer includes a lower layer including a sputtering film including an alloy including copper, aluminum, and at least one element selected from nickel, zinc, gallium, silicon, and magnesium, and an upper layer including a sputtering film including copper. The lower layer is formed in contact with surfaces of the first insulating layers and inner wall surfaces and bottom surfaces in via openings for the first via conductors.

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.

Abstract: A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 ?m to 0.23 ?m, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 ?m around an outer edge of the through hole on the surface of the pad.

Abstract: Provided is a method of producing an inorganic fiber mat, the method including: a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat; a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.

Abstract: A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.

Abstract: A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.

Abstract: A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.

Abstract: A thermal insulation material having carbon fibers, the thermal insulation material containing; a covering layer containing pyrolytic carbon at a surface of the thermal insulation material; and a base layer containing carbon-based particles between the carbon fibers below the covering layer. A method for producing a thermal insulation material including: forming a base layer by impregnating a surface of a molded body containing carbon fibers with a slurry containing carbon-based particles; and forming a covering layer containing pyrolytic carbon on the base layer by applying a chemical vapor deposition method to the molded body in a CVD furnace.

Abstract: A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part including an insulating layer and a conductor layer. The minimum wiring width of wirings in the conductor layer of the first build-up part is smaller than the minimum wiring width of wirings in the conductor layer of the second build-up part. The minimum inter-wiring distance of the wirings in the first part is smaller than the minimum inter-wiring distance of the wirings in the second part. The first build-up part is formed such that the conductor layer includes a conductor pattern including a first metal layer, a second metal layer, and a third metal layer. The width of the first metal layer is larger than the width of the second metal layer. The width of the third metal layer is larger than the width of the first metal layer.

Abstract: Provided is a method of producing an inorganic fiber mat the method including: a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat; a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.