Patents Assigned to Ibiden Co., Ltd.
  • Patent number: 10813232
    Abstract: A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: October 20, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshihide Makino, Hidetoshi Noguchi
  • Publication number: 20200329568
    Abstract: A wiring substrate includes a laminate having a through hole and including conductor layers and insulating layers interposed between the conductor layers, solder resist layers formed on the laminate and including a first solder resist layer covering first surface of the laminate and a second solder resist layer covering second surface of the laminate and that the first and second solder resist layers have openings exposing the through hole, and a resin film covering the laminate not covered by the solder resist layers such that the resin film is formed on the first and second surfaces of the laminate inside the openings of the first and second solder resist layers without overlapping with the solder resist layers on the first and second surfaces and that the resin film covers inner wall surface inside the through hole and at least part of the first and second surfaces exposed inside the openings.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 15, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Kotaro Takagi, Yoji Mori
  • Patent number: 10804191
    Abstract: A printed wiring board includes a first build-up layer having first insulating layer, conductor layer and via conductor, a second build-up layer formed on the first build-up layer and having second insulating layer, conductor layer and via conductor, a third build-up layer formed on the second build-up layer and having third insulating layer, conductor layer and via conductor, and a fourth build-up layer formed on the third build-up layer and having fourth insulating layer, conductor layer and via conductor. The first insulating layer has a thickness that is larger than a thickness of the second insulating layer, the thickness of the second insulating layer is larger than a thickness of the third insulating layer, the thickness of the second insulating layer is larger than a thickness of the fourth insulating layer, and the thickness of the fourth insulating layer is larger than the thickness of the third insulating layer.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: October 13, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Hajime Sakamoto, Yoji Sawada
  • Publication number: 20200318917
    Abstract: Disclosed is a heat exchanger that includes first cells through which a first fluid flows, second cells through which a second fluid flows, and partition walls that partition the first cells and the second cells. The heat exchanger exchanges heat between the first fluid and the second fluid. The partition walls include a frame portion having silicon carbide as a main component and a filling portion that covers a surface of the frame portion and is formed from a metal that fills a void in the frame portion. The partition walls have a surface roughness Ra of 1.0 ?m or greater.
    Type: Application
    Filed: October 17, 2018
    Publication date: October 8, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshihiro KOGA, Sonosuke ISHIGURO, Toshio MURATA
  • Publication number: 20200315009
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate layers, second conductor layers including second inner, outer and intermediate layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the insulating layers such that each via conductor connects two conductor layers and is integrally formed with one of the conductor layers on side away from the core layer. The first and/or second inner conductor layers has a first conductor layer structure including metal foil and plating film layers, the first and/or second outer conductor layers has the first structure, the first and/or second intermediate conductor layers has a second conductor layer structure including metal foil and plating film layers, and the via conductors include a group integrally formed with the first structure and including constricted via conductors each having a constricted portion.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Takenobu NAKAMURA, Takahiro YAMAZAKI, Takashi YAMAUCHI, Toshihide MAKINO
  • Publication number: 20200315012
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including a metal foil layer and a plating film layer, the first and/or second outer conductor layers has the first laminated structure, the first and/or second intermediate conductor layers has a second laminated structure including a metal foil layer and a plating film layer, and the first and second laminated structures are formed such that a surface of the second laminated structure on a side away from the core layer has unevenness smaller than unevenness of a surface of the first laminated structure on a side away from the core layer.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 1, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Takenobu NAKAMURA, Takahiro YAMAZAKI, Takashi YAMAUCHI, Toshihide MAKINO
  • Publication number: 20200315002
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the core layer such that each via conductor decreases in diameter from one of the inner conductor layers toward the other one of the inner conductor layers and that the other one of the inner conductor layers has thickness greater than thickness of the one of the inner conductor layers. The first and/or second inner conductor layers includes a first laminated structure including metal foil and plating film layers, the first and/or second outer conductor layers includes the first laminated structure, and the first and/or second intermediate conductor layers includes a second laminated structure including metal foil and plating film layers.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Takenobu Nakamura, Takahiro Yamazaki, Takashi Yamauchi, Toshihide Makino
  • Publication number: 20200315013
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate conductor layers, second conductor layers including second inner, outer and intermediate conductor layers, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including metal foil and plating film layers and includes first conductor pattern having a side surface curved toward inner side of the first pattern, the first and/or second outer conductor layers has the first laminated structure and includes the first conductor pattern having the side surface curved toward the inner side of the first pattern, and the first and/or second intermediate conductor layers has a second laminated structure including metal foil and plating film layers and includes second conductor pattern having a side surface curved toward outer side of the second pattern.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Takenobu NAKAMURA, Takahiro YAMAZAKI, Takashi YAMAUCHI, Toshihide MAKINO
  • Publication number: 20200315011
    Abstract: A wiring substrate includes a core layer, first conductor layers including a first inner conductor layer, a first outer conductor layer and a first intermediate conductor layer, second conductor layers including a second inner conductor layer, a second outer conductor layer and a second intermediate conductor layer, and interlayer insulating layers interposed between the first conductor layers and between the second conductor layers. The first and/or second inner conductor layers has a first laminated structure including a metal foil layer and a plating film layer, the first and/or second outer conductor layers has the first laminated structure, and the first and/or second intermediate conductor layers has a second laminated structure including a metal foil layer and a plating film layer and includes a conductor pattern formed such that an upper surface of the conductor pattern has an edge portion forming an inclined portion inclined toward the core layer.
    Type: Application
    Filed: March 24, 2020
    Publication date: October 1, 2020
    Applicant: IBIDEN CO., LTD
    Inventors: Takenobu NAKAMURA, Takahiro YAMAZAKI, Takashi YAMAUCHI, Toshihide MAKINO
  • Patent number: 10784642
    Abstract: A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal body having a columnar shape and fitted in a hole penetrating through the flexible insulating layer and the conductor layer such that the metal body is formed of a welding base material and has an end portion formed to be joined to an electrode of a battery by welding. The welding base material of the metal body of the flexible printed wiring board includes the same material as the electrode of the battery.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: September 22, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Takahisa Hirasawa, Takayuki Furuno
  • Publication number: 20200292252
    Abstract: Disclosed is a heat exchanger that includes a tubular outer wall and partition walls that partition an inner side of the outer wall into heat medium passage cells and gas passage cells extending in an axial direction of the outer wall. The heat exchanger exchanges heat between a liquid heat medium flowing through the heat medium passage cells and a gas flowing through the gas passage cells. The ratio of the number of the heat medium passage cells to the number of the gas passage cells is 1:3 to 1:6.
    Type: Application
    Filed: October 17, 2018
    Publication date: September 17, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshihiro KOGA, Kenta YOSHIDA, Toshio MURATA
  • Publication number: 20200296841
    Abstract: A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of a conductive layer on a non-outermost resin layer.
    Type: Application
    Filed: May 29, 2020
    Publication date: September 17, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Toshihide MAKINO, Hidetoshi NOGUCHI
  • Publication number: 20200286678
    Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200287452
    Abstract: A motor coil substrate includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate such that the coils are extending from a first end toward a second end on the opposite side with respect to the first end. The flexible substrate includes inner peripheral and outer peripheral flexible substrates such that the coils include outer peripheral coils formed on the outer peripheral flexible substrate and inner peripheral coils formed on the inner peripheral flexible substrate, that a number of the outer peripheral coils and a number of the inner peripheral coils are L, that an m-th outer peripheral coil of the outer peripheral coils is positioned on a m-th inner peripheral coil of the inner peripheral coils, and that the m-th outer peripheral coil and the m-th inner peripheral coil are connected to each other in parallel, where L and m are natural numbers.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 10, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10756589
    Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: August 25, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20200266075
    Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Youhong WU, Koji Sato, Yoshihiro Kodera
  • Patent number: 10745819
    Abstract: A printed wiring board includes a core laminate including insulating layers and conductor layers, a first build-up layer formed on first surface of the laminate and including first interlayer resin and conductor layers, and a second build-up layer formed on second surface of the core laminate on the opposite side and including second interlayer resin and conductor layers. The conductor layers in the laminate include first and second conductor layers such that the first conductor layer is embedded in one of the insulating layers forming the first surface of the laminate and has an exposed surface exposed from the insulating layer and that the second conductor layer is formed on one of the insulating layers forming the second surface of the laminate, and the first interlayer resin layer has thickness greater than thickness of the second interlayer resin layer.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: August 18, 2020
    Assignee: IBIDEN CO., LTD.
    Inventors: Toshiki Furutani, Yuki Yoshikawa
  • Publication number: 20200236946
    Abstract: The present invention provides an antiviral substrate that is excellent in antiviral properties, is excellent in transparency or the like, and is capable of maintaining characteristics such as the transparency of a base material and the color of the surface of the base material. The present invention relates to an antiviral substrate in which a cured material of an electromagnetic curable resin containing a copper compound is scattered in the form of islands on a surface of a base material, and at least a part of the copper compound is exposed on a surface of the cured material of the electromagnetic curable resin.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Katsutoshi HORINO, Kozo TAKADA, Kazuhiro ITO, Kohei OTSUKA, Kiyotaka TSUKADA
  • Publication number: 20200232367
    Abstract: The present invention provides a honeycomb structured body containing a ceria-zirconia composite oxide and not easily breakable under stress in an a-axis direction. The honeycomb structured body includes a honeycomb fired body in which multiple through-holes are arranged longitudinally in parallel with one another with a partition wall therebetween, wherein the honeycomb fired body contains ceria-zirconia composite oxide particles and inorganic fibers, and 60 to 80% of inorganic fibers observed in a cross-sectional image of the honeycomb structured body cut in a cross-sectional direction perpendicular to a longitudinal direction have a ratio of the length of a long axis to the length of a short axis (long axis/short axis) of 1.00 to 1.30, the length of the long axis being the length of a long axis of a cross section of an inorganic fiber shown in the cross-sectional image, the length of the short axis being the length of a perpendicular bisector of the long axis.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 23, 2020
    Applicants: IBIDEN CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroya YAMAMOTO, Takeru YOSHIDA, Hiromasa SUZUKI, Masaru KAKINOHANA, Takumi TOJO
  • Publication number: 20200232368
    Abstract: The present invention provides a honeycomb structured body containing a ceria-zirconia composite oxide and being less susceptible to ring-off cracking. The honeycomb structured body of the present invention includes a honeycomb fired body in which multiple through-holes are arranged longitudinally in parallel with one another with a partition wall therebetween, wherein the honeycomb fired body contains ceria-zirconia composite oxide particles and inorganic fibers, and a b-axis thermal expansion coefficient measured in a direction along a b-axis representing a direction perpendicular to a longitudinal direction of the honeycomb structured body is higher than an a-axis thermal expansion coefficient measured in a direction along an a-axis representing the longitudinal direction of the honeycomb structured body.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 23, 2020
    Applicants: IBIDEN CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroya YAMAMOTO, Takeru YOSHIDA, Hiromasa SUZUKI, Masaru KAKINOHANA, Takumi TOJO