Patents Assigned to Ibiden Co., Ltd.
  • Publication number: 20210329783
    Abstract: A printed wiring board includes an insulating substrate having openings, a first conductor layer formed on a first surface of the insulating substrate, a second conductor layer formed on a second surface of the insulating substrate, magnetic material portions formed in the openings of the insulating substrate and having through holes extending from the first surface to second surface of the insulating substrate, and through-hole conductors formed on side walls of the through holes such that the through-hole conductors connect the first conductor layer and second conductor layer. The magnetic material portions include magnetic particles and resin such that the magnetic particles include particles forming the side walls and that gaps are formed between the particles and the resin, and each of the through-hole conductors includes a chemical copper plating film such that the chemical copper plating film is deposited in the gaps formed between the particles and the resin.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 21, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Satoru KAWAI, Yasuki KIMISHIMA
  • Publication number: 20210310972
    Abstract: A particulate-matter detecting sensor including an insulating substrate which has a detecting face, a plurality of detecting conductors formed in the insulating substrate, and a heating section embedded in the insulating substrate. Each of the plurality of detecting conductors includes a detecting electrode part, a terminal part, and a connecting part. An exposed conductor part of the detecting conductor which is exposed to the element surface is constituted of a noble metal conductor mainly formed of at least one noble metal selected from Pt, Au, Pd, Rh and Ir. At least a portion of a non-exposed conductor part of the detecting conductor which is not exposed to the element surface is constituted of a low expansion conductor mainly formed of a low expansion coefficient metal which linear expansion coefficient is lower than that of the noble metal.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 7, 2021
    Applicants: IBIDEN CO., LTD., DENSO CORPORATION
    Inventors: Yasutaka ITO, Tomoyoshi NAKAMURA, Takeshi USHIDA, Takehito KIMATA, Masahiro YAMAMOTO
  • Publication number: 20210298178
    Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening and having a second through hole formed therein, a first through-hole conductor including a metal film formed in the first through hole, and a second through-hole conductor including a metal film formed in the second through hole. The core substrate and the magnetic resin are formed such that a surface in the first through hole has a roughness that is larger than a roughness of a surface in the second through hole.
    Type: Application
    Filed: February 25, 2021
    Publication date: September 23, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Satoru KAWAI, Yasuki KIMISHIMA
  • Patent number: 11122686
    Abstract: A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulting layer on the opposite side, and interlayer connection conductors formed in the through holes through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the though holes include first and second groups of through holes and that the through holes in the second group have inner walls covered with non-conductive resin, and the interlayer conductors includes first interlayer conductors each including a plating film formed in the first group of through holes, and second interlayer conductors each including a plating film formed in the second group of through holes such that minimum distance between the second interlayer conductors is smaller than minimum distance between the first interlayer conductors.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: September 14, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasuki Kimishima, Satoru Kawai
  • Publication number: 20210282266
    Abstract: A wiring substrate includes a core substrate, and a build-up part laminated on the substrate and including resin insulating layers. The insulating layers include a first insulating layer, the build-up part includes a conductor layer on the first insulating layer, a second insulating layer on the first insulating layer and covering the conductor layer, and a recess penetrating through the second insulating layer and exposing portion of the conductor layer such that the conductor layer includes component mounting region that places an electronic component in the recess and a conductor pad forming bottom surface of the recess, the insulating layers include inorganic filler such that all insulating layers or all insulating layers other than the first insulating layer include the inorganic filler and that inorganic filler content rate of the first insulating layer is lower than inorganic filler content rate of the insulating layers other than the first insulating layer.
    Type: Application
    Filed: February 25, 2021
    Publication date: September 9, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Hiroyasu NOTO, Kentaro WADA
  • Patent number: 11116080
    Abstract: A wiring substrate includes a core layer, first conductor layers including first inner, outer and intermediate layers, second conductor layers including second inner, outer and intermediate layers, interlayer insulating layers interposed between the first conductor layers and between the second conductor layers, and via conductors formed in the insulating layers such that each via conductor connects two conductor layers and is integrally formed with one of the conductor layers on side away from the core layer. The first and/or second inner conductor layers has a first conductor layer structure including metal foil and plating film layers, the first and/or second outer conductor layers has the first structure, the first and/or second intermediate conductor layers has a second conductor layer structure including metal foil and plating film layers, and the via conductors include a group integrally formed with the first structure and including constricted via conductors each having a constricted portion.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: September 7, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Takenobu Nakamura, Takahiro Yamazaki, Takashi Yamauchi, Toshihide Makino
  • Patent number: 11109481
    Abstract: A method for manufacturing a printed wiring board includes forming a base insulating layer, forming a conductor layer on the base layer, forming a solder resist layer on the base layer such that the resist layer covers the conductor layer, forming first opening exposing a first pad of the conductor layer, forming second opening exposing a second pad of the conductor layer and having diameter smaller than diameter of the first opening, forming a first bump on the first pad, and forming a second bump on the second pad such that the second bump has diameter smaller than diameter of the first bump. The first bump includes a first base plating layer and a first top plating layer, and the second bump includes a second base plating layer and a second top plating layer having upper surface higher than the uppermost position of upper surface of the first top layer.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: August 31, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Youhong Wu, Koji Sato, Yoshihiro Kodera
  • Publication number: 20210259107
    Abstract: A wiring substrate includes an insulating layer having through holes, a first conductor layer formed on first surface of the insulating layer, a second conductor layer formed on second surface of the insulting layer on the opposite side, and interlayer connection conductors formed in the through holes through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the though holes include first and second groups of through holes and that the through holes in the second group have inner walls covered with non-conductive resin, and the interlayer conductors includes first interlayer conductors each including a plating film formed in the first group of through holes, and second interlayer conductors each including a plating film formed in the second group of through holes such that minimum distance between the second interlayer conductors is smaller than minimum distance between the first interlayer conductors.
    Type: Application
    Filed: December 23, 2020
    Publication date: August 19, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuki KIMISHIMA, Satoru KAWAI
  • Publication number: 20210259106
    Abstract: A printed wiring board includes resin insulating layers including an outermost resin insulating layer, conductor layers laminated on the resin insulating layers, a copper layer formed in the outermost insulating layer, and metal bumps formed on the copper layer such that the bumps have upper surfaces protruding from the outermost insulating layer and that each metal bump includes Ni film, Pd film and Au film. The copper layer is reduced in diameter toward upper surface side such that the copper layer has upper and bottom surfaces and each upper surface has diameter that is smaller than diameter of each bottom surface, the outermost insulating layer has cylindrical sidewalls formed such that at least part of the copper layer is not in contact with the sidewalls, and the bumps are formed such that the Ni film is filling spaces between the copper layer and the sidewalls of the outermost insulating layer.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 19, 2021
    Applicant: IBIDEN CO., LTD.
    Inventor: Shota TACHIBANA
  • Publication number: 20210257224
    Abstract: A manufacturing method of a wiring substrate includes forming an interlayer insulating layer on a substrate, forming a metal film on a surface of the insulating layer such that the metal film covers the surface of the insulating layer, etching a surface of the metal film on the opposite side with respect to the insulating layer such that the surface of the metal film is roughened, forming a dry film on the roughened surface of the metal film such that the dry film has an opening formed in the dry film, forming an electrolytic plating film in the opening using the metal film as a power feeding layer, removing the dry film from the metal film, and removing part of the metal film exposed from the plating film by the dry film removing such that the part of the metal film is removed from the surface of the insulating layer.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuhiko KURANOBU, Tomoya DAIZO
  • Publication number: 20210251087
    Abstract: A printed wiring board includes an insulating substrate, a first conductor layer formed on a first surface of the substrate, a second conductor layer formed on a second surface of the substrate, and through-hole conductors formed through the substrate and connecting the first and second conductor layers. The substrate has openings formed such that each opening extends from the first to second surfaces of the substrate, and magnetic material filling the openings and forming through holes such that each through hole extends from the first to second surfaces of the substrate, the through-hole conductors are formed on sidewalls of the through holes in the magnetic material, and the magnetic material includes resin and particles including magnetic metal such that the particles include a group of particles forming the sidewalls of the through holes and that each particle in the group has a substitution plating film formed on a surface thereof.
    Type: Application
    Filed: January 26, 2021
    Publication date: August 12, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Satoru KAWAI, Yasuki KIMISHIMA
  • Patent number: 11089674
    Abstract: A wiring substrate includes a substrate including conductor layers and core insulating layers, and a laminate including insulating layers and conductor layers such that the conductor layers include first layer including first line pattern. The laminate includes first strip line including the first pattern, a pair of interlayer insulating layers sandwiching the first pattern, and a pair of conductor layers sandwiching the interlayer layers, the conductor layers in the substrate include second layer including second line pattern such that the substrate includes second strip line including the second pattern, a pair of core insulating layers sandwiching the second pattern, and a pair of conductor layers sandwiching the core insulating layers, and the pair of core insulating layers is thicker than the pair of interlayer layers, the second pattern is thicker than the first pattern, and line width of the second pattern is larger than line width of the first pattern.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: August 10, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Tomoyuki Ikeda, Shigemitsu Kunikane
  • Patent number: 11089694
    Abstract: A printed wiring board includes a resin insulating layer, a conductor layer formed on a surface of the resin insulating layer, an outermost insulating layer formed on the resin insulating layer such that the outermost insulating layer is covering the conductor layer and has an opening extending to the conductor layer, and a metal post formed in the opening of the outermost insulating layer such that the metal post is protruding from the outermost insulating layer.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: August 10, 2021
    Assignee: IBIDEN CO., LTD.
    Inventor: Masashi Awazu
  • Patent number: 11083086
    Abstract: A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 ?m or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: August 3, 2021
    Assignee: IBIDEN CO., LTD.
    Inventor: Youhong Wu
  • Publication number: 20210235584
    Abstract: A method for manufacturing a wiring substrate includes forming a plating film on a metal foil laminated on a surface of an insulating layer, forming an etching resist on the plating film such that the etching resist has an opening for forming a conductor pattern, conducting a first etching process such that part of the plating film exposed from the opening of the etching resist is removed and that part of the metal foil is exposed, removing the etching resist from the plating film on the metal foil laminated on the surface of an insulating layer, and conducting a second etching process such that the part of the metal foil exposed by the first etching process is removed and that a conductor layer having the conductor pattern is formed on the surface of the insulating layer.
    Type: Application
    Filed: January 22, 2021
    Publication date: July 29, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Shinichiro ICHIKAWA, Takanori DOI
  • Patent number: 11071945
    Abstract: A filter membrane includes a membrane having through holes that selectively separates specific material in processing medium, the membrane including first, second and third layers such that the first layer has first surface that is supplied with processing medium, the third layer has second surface on the opposite side of the first surface, and the second layer is formed between the first and third layers. The first layer includes first convex and concave portions, the third layer includes second convex and concave portions each having a larger area than each first concave portion, the second convex portions are formed to surround the second concave portions and connected to one another, the second layer has through holes connecting the second concave portions and first set of the first concave portions, and the first concave portions include second set in regions opposing the second convex portions that is connected to each other.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 27, 2021
    Assignee: IBIDEN CO., LTD.
    Inventors: Masatoshi Kunieda, Hirokazu Higashi, Tatsuhiro Kawai
  • Publication number: 20210199611
    Abstract: A particulate-matter detecting sensor including an insulating substrate which has a detecting face, detecting conductors formed in the insulating substrate, and a heating section formed on the insulating substrate. Each detecting conductor includes a detecting electrode part, a terminal part, and a connecting part. A portion of the detecting conductor is constituted of a noble metal conductor mainly formed of at least one noble metal selected from Pt, Au, Pd, Rh and Ir. At least a portion of the connecting part is formed of a low expansion conductor mainly formed of a low expansion coefficient metal having linear expansion coefficient lower than that of the noble metal. Both conductors are joined at an overlapping part at which the noble metal conductor and the low expansion conductor are partly overlapped with each other on an insulating layer forming the insulating substrate in a normal line direction of the insulating layer.
    Type: Application
    Filed: August 9, 2019
    Publication date: July 1, 2021
    Applicants: IBIDEN CO., LTD., DENSO CORPORATION
    Inventors: Yasutaka ITO, Tomoyoshi NAKAMURA, Takeshi USHIDA, Takehito KIMATA, Masahiro YAMAMOTO
  • Publication number: 20210195748
    Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes an electroless plating film and an electrolytic plating film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes an electroless plating film and an electrolytic plating film. The first through-hole conductors and the second through-hole conductors are formed such that a thickness of the electroless plating film in the first through-hole conductors is larger than a thickness of the electroless plating film in the second through-hole conductors.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 24, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Satoru Kawai, Yasuki Kimishima
  • Publication number: 20210183562
    Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes formed therein, a magnetic resin filling the openings and having second through holes formed therein, first through-hole conductors formed in the first through holes of the core substrate and including metal films formed in the first through holes of the core substrate, respectively, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin such that the metal films are filling the second through holes of the magnetic resin, respectively.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 17, 2021
    Applicant: IBIDEN CO., LTD.
    Inventor: Satoru KAWAI
  • Publication number: 20210185818
    Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole formed therein, a magnetic resin filling the opening formed in the core substrate such that the magnetic resin has second through holes formed therein, a first through-hole conductor formed in the first through hole of the core substrate and including a metal film formed in the first through hole of the core substrate, and second through-hole conductors formed in the second through holes of the magnetic resin and including metal films formed in the second through holes of the magnetic resin, respectively.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 17, 2021
    Applicant: IBIDEN CO., LTD.
    Inventor: Satoru KAWAI