Abstract: The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open end at the exhaust gas outlet side and a plugged end at the exhaust gas inlet side, and an outer wall on the periphery thereof. The cross-sectional shape of each exhaust gas introduction cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion. The cross-sectional shape of each exhaust gas emission cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion.

Abstract: The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open end at the exhaust gas outlet side and a plugged end at the exhaust gas inlet side, and an outer wall on the periphery thereof. The cross-sectional shape of each exhaust gas introduction cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion, and the cross-sectional shape of each exhaust gas emission cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion.

Abstract: The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open end at the exhaust gas outlet side and a plugged end at the exhaust gas inlet side, and an outer wall on the periphery thereof. The cross-sectional shape of each exhaust gas introduction cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion. The cross-sectional shape of each exhaust gas emission cell in a plane perpendicular to the longitudinal direction thereof is entirely uniform from the end at the exhaust gas inlet side to the end at the exhaust gas outlet side excluding the plugged portion.

Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.

Abstract: A honeycomb filter includes a silicon carbide honeycomb fired body, an end face, and porous cell walls. The silicon carbide honeycomb fired body includes a plurality of cells through which exhaust gas is to flow and which include exhaust gas introduction cells and exhaust gas emission cells. The silicon carbide honeycomb fired body includes silicon carbide grains having a silicon-containing oxide layer with a thickness of 0.1 to 2 ?m on surfaces of the silicon carbide grains. The end face has an aperture ratio of not less than 20% at the exhaust gas emission side. The porous cell walls define rims of the plurality of cells. The plugged portions of the exhaust gas introduction cells are arranged in vertical and horizontal lines with the porous cell walls residing between the plugged portions in the end face at the exhaust gas emission side.

Abstract: A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings.

Abstract: A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and including a via conductor portion and an embedded conductor layer portion such that the embedded conductor layer portion is embedded in the resin insulating layer on the opposite side of the resin insulating layer with respect to the projecting conductor layer and has an exposed surface exposed from the resin insulating layer and the via conductor portion is formed through the resin insulating layer and is connecting the embedded conductor layer portion and projecting conductor layer. The projecting conductor layer and integral conductor structure are formed such that the projecting conductor layer and integral conductor structure are individual conductor structures.

Abstract: A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer on the second insulating layer, a fourth conductor layer including first circuit, a second via conductor connecting the first circuits in the second and third conductor layers through the second insulating layer, and a first skip via conductor penetrating through the second circuit in the third conductor layer and connecting the second circuit in the second conductor layer and the first circuit in the fourth conductor layer through the second and third insulating layers. The second and third conductor layers are formed such that the second conductor layer has thickness t2 larger than thickness t3 of the third conductor layer.

Abstract: A printed wiring board includes a first substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first substrate and that the second pads are positioned to electrically connect a second substrate to the first substrate, and metal posts formed on the second pads, respectively, such that the metal posts are positioned to mount the second substrate on the first substrate. The first substrate and the metal posts satisfy that a ratio, b/e, is in a range from 0.3 to 1.0, where b represents a length of each of the metal posts and e represents a thickness of the first substrate.

Abstract: A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.

Abstract: A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist.

Abstract: Provided is a honeycomb fired body in which the pressure loss in the initial state where PM has not accumulated is sufficiently low, the strength is sufficiently high, and the heat capacity is not small.

Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.

Abstract: A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on a first surface of the lowermost resin insulating layer, a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface and a lower surface on the opposite side with respect to the upper surface, a semiconductor element embedded in the lowermost resin insulating layer such that the semiconductor element has an electrode facing the first surface and is positioned on a second surface side of the lowermost resin insulating layer, and via conductors formed in the lowermost resin insulating layer and including a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the conductor post and that the second via conductor is connecting the first conductor layer and the electrode.

Abstract: A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate, and a through-hole conductor formed in the hole such that the conductor is connecting the first and second conductive layers. The conductor has a seed layer on inner wall of the hole, a laminated plated layer on the seed layer and a filled plated layer on the laminated layer, the laminated layer is formed such that the laminated layer is closing center portion of the hole and forming recess at end of the hole, the filled layer is formed such that the filled layer is filling the recess, and the laminated layer includes multiple electrolytic plated films laminated along the seed layer and each having thickness which is less at edge than at center.

Abstract: A zeolite has a CHA structure, a SiO2/Al2O3 composition ratio less than about 15, and an average particle size from about 0.1 ?m to about 0.5 ?m.

Abstract: A printed wiring board includes conductive layers, resin insulation layers, a through-hole conductor penetrating through one or more insulation layers and having a first-surface-side and second-surface-side lands, a first-surface-side signal line formed on one of the insulation layers and connecting the first-surface-side land and a conductive layer on the insulation layer, and a second-surface-side signal line formed on one of the insulation layers and connecting the second-surface-side land and a conductive layer on the insulation layer.

Abstract: A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface of the core substrate and including a conductor layer and a resin insulating layer. The core substrate is interposed between the first wiring structure and the second wiring structure such that the resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin in the first and second wiring structures is in the range of from 0.5% to 5.0%.

Abstract: A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. Each of the exhaust gas emission cells is adjacently surrounded fully by the exhaust gas introduction cells across the porous cell walls. The exhaust gas introduction cells include first exhaust gas introduction cells and second exhaust gas introduction cells. Each of the first exhaust gas introduction cells has the cross sectional area equal to or smaller than 0.7 mm2 in the cross section perpendicular to the longitudinal direction of the plurality of cells.

Abstract: A honeycomb filter includes a plurality of cells and porous cell walls. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The porous cell walls each have a porosity of 55% or acre but not more than 70%. The porous cell walls include pores with a pore diameter of 40 ?m or more. The pores have a pore volume occupying 10% or more of a total pore volume of the porous cell walls. The exhaust gas emission cells have an average cross sectional area larger than an average cross sectional area of the exhaust gas introduction cells in the cross section perpendicular to the longitudinal direction of the plurality of cells. A total volume of the exhaust gas introduction cells is larger than a total volume of the exhaust gas emission cells.