Abstract: A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on the first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer and protruding from the second surface of the insulation layer, a via penetrating through the insulation layer and electrically connecting the first and second conductive layers, a solder-resist layer covering the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer, and a metal layer formed on the exposed structure and protruding from the first surface of the insulation layer. The exposed structure of the first conductive layer includes pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface.

Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.

Abstract: A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer.

Abstract: A method for manufacturing a ceramic honeycomb structure includes kneading titania particles, alumina particles and binder ingredient such that raw material paste including the titania particles, alumina particles and binder ingredient is prepared, forming a body made of the paste and having a honeycomb structure such that the body has the honeycomb structure having through-holes extending in the longitudinal direction of the body and partitions formed between the through-holes, sintering the body made of the paste such that a ceramic body having the honeycomb structure is formed, applying sealant to either end of each through-hole of the ceramic body such that each through-hole of the ceramic body is sealed at one end, and heating the sealant sealing one end of each through-hole such that the ceramic body having cured sealant at one end of each through-hole in the honeycomb structure is formed.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first surface exposed on a first surface side of the insulating layer, and a conductor post formed on a second surface of the conductor layer on the opposite side with respect to the first surface such that the conductor post has a side surface covered by the insulating layer. The conductor post has an end surface on the opposite with respect to the conductor layer such that the end surface of the conductor post is exposed on a second surface side of the insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the conductor layer.

Abstract: A wiring substrate includes a core substrate, and a build-up layer including conductor layers and insulating layers alternately laminated on the substrate and via conductors formed in the insulating layers, each insulating layer having a coating layer and a support layer stacked on the coating layer such that the support layer has surface on which a conductor layer is laminated and the coating layer is covering a conductor layer, each via conductor connecting two conductor layers through an insulating layer. The coating layer has a thickness greater than that of the support layer and includes inorganic filler at content rate of 65 to 85% by mass, and the support layer includes inorganic filler at different content rate such that thermal expansion coefficient of the coating layer is smaller than that of the support layer and the coefficients of the coating and support layers have difference of 30 ppm/° C. or less.

Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 ?m or greater and less than 380 ?m, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

Abstract: A method for manufacturing a printed wiring board includes forming a through hole in an insulating substrate such that the through hole penetrates through the substrate and has first tapered hole, second tapered hole and minimum diameter portion connecting the first and second tapered holes at a position displaced toward first or second surface of the substrate from a mid-point of the through hole in thickness direction of the substrate, and applying electrolytic plating to the substrate while flowing an electrolytic plating solution including a deposition inhibitor into the through hole from the first and second tapered holes and increasing an amount of the inhibitor adsorbing to electrolytic metal plating depositing at the minimum diameter portion such that electrolytic metal plating forms a closed portion closing the through hole substantially at the mid-point and fills the first and second tapered holes to form a through-hole conductor in the through hole.

Abstract: A holding seal material made of a laminated mat configured by laminating a plurality of mats containing an inorganic fiber and having a rectangular planar shape so that longitudinal-direction lengths of the respective mats sequentially increase as the mats are laminated, in which the film is attached to a principal surface of the mat configuring the laminated mat and having a longest longitudinal-direction length on an opposite side to a side on which the mat having the longest longitudinal-direction length is in contact with other mats and longitudinal-direction side surfaces of the mat having the longest longitudinal-direction length, and the film is attached to a principal surface of the mat having the longest longitudinal-direction length on the side on which the mat having the longest longitudinal-direction length is in contact with other mats in a state in which a part of the principal surface is exposed.

Abstract: A honeycomb filter includes a ceramic honeycomb substrate, an auxiliary filter layer, an SCR catalyst, and a portion. The ceramic honeycomb substrate has cell walls provided along a longitudinal direction of the ceramic honeycomb substrate to define cells through which fluid is to pass and which have a fluid inlet end and a fluid outlet end opposite to the fluid inlet end along the longitudinal direction. The cells include first cells and second cells. The auxiliary filter layer is provided on first surfaces of first cell walls of the first cells. The SCR catalyst is supported on second surfaces of second cell walls of the second cells. The second surfaces substantially correspond to the first surfaces. The portion satisfies a<b. “a” (?m) represents an average pore diameter of pores of the auxiliary filter layer, and “b” (?m) represents an average particle diameter of particles constituting the SCR catalyst.

Abstract: A semiconductor mounting device including a first substrate having insulation layers, conductor layers formed on the insulation layers, and via conductors connecting the conductor layers, a second substrate having insulation layers and conductor layers formed on the insulation layers of the second substrate, first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer of the first substrate formed on an outermost insulation layer of the first substrate, and second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost conductor layer of the second substrate formed on an outermost insulation layer of the second substrate. The second substrate has a thickness which is greater than a thickness of the first substrate.

Abstract: A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

Abstract: A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface exposed from the insulating layer, and a conductor post formed in the insulating layer and on second surface of the wiring layer on the opposite side with respect to the first surface of the wiring layer such that the conductor post has side surface covered by the insulating layer and end surface exposed from the insulating layer on the opposite side with respect to the wiring layer. The conductor post is formed such that the side surface of the conductor post is a roughened side surface having surface roughness of first roughness R1, the end surface of the conductor post is a roughened end surface having surface roughness of second roughness R2, and the first and second roughnesses R1, R2 satisfy R1>R2.

Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.

Abstract: A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

Abstract: A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 ?m.

Abstract: A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane.

Abstract: A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.

Abstract: A printed wiring board includes a core substrate, and a first build-up wiring layer formed on the core substrate and including a wiring layer such that the wiring layer includes a resin insulating layer and a conductor layer laminated on the resin insulating layer. The first build-up wiring layer is formed on a first surface of the core substrate such that the first build-up wiring layer forms a high-rise region and a low-rise region with respect to a lamination direction, the first build-up wiring layer includes electrodes positioned to connect an electronic component to the first build-up wiring layer, and the first build-up wiring layer is formed such that the low-rise region is extending in two or more directions from the high-rise region to edges of the core substrate.