Patents Assigned to IC Technologies
  • Patent number: 8204721
    Abstract: Predictive Split Lot Emulator, and methods simulating integrated circuit performance variations, before IC fabrication. The emulator receives a split lot parameter, maps the split lot parameter onto an IC element model, and transforms the IC element into a predictive IC element model. The emulator uses the predictive model to determine simulated performance characteristic of the IC element model. Also, a predictive split lot analyzer, a CAD simulation system, and a PDK including the emulator. IC simulating methods include choosing a Split Condition from a Split Table; a Predictive Split Lot Emulator receiving the Condition, determining a Split Parameter Condition Perturbation, mapping the Perturbation into a Model Parameter Perturbation for an IC element, and storing the Model Perturbation for an IC element into a Model Parameter Perturbation Library. The Perturbation Library emulates IC element performance characteristic in a Split Condition.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: June 19, 2012
    Assignee: Sentinel IC Technologies, Inc.
    Inventors: James Victory, Juan D. Cordovez
  • Patent number: 7483295
    Abstract: By subdividing the free layer of a GMR/TMR device into multiple sub-elements that share common top and bottom electrodes, a magnetic detector is produced that is domain stable in the presence of large stray fields, thereby eliminating the need for longitudinal bias magnets. Said detector may be used to measure electric currents without being affected by local temperature fluctuations and/or stray fields.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: January 27, 2009
    Assignee: Mag IC Technologies, Inc.
    Inventors: Yimin Guo, Po-Kang Wang
  • Patent number: 5354358
    Abstract: A process for removing metals from a waste including uranium and a second metal comprising dissolving the uranium and the second metal in a first aqueous solution, removing the dissolved uranium from the first aqueous solution by redissolving in an organic solvent, stripping the uranium from the organic solvent by redissolving in a second aqueous solution, precipitating the uranium from the second aqueous solution, and removing the second metal from the first aqueous solution.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: October 11, 1994
    Assignee: IC Technologies
    Inventors: John Litz, Nicholas J. Lombardo, Robert L. Schwartz