Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

Abstract: Provided is a MEMS device comprising an integrated post and deformable layer. In some embodiments, the transition between the post and deformable layer comprises substantially a single arcuate or convex surface, thereby providing a mechanically robust structure. Some embodiments provide a method for fabricating a MEMS device comprising the use of a self-planarizing sacrificial material, which provides a surface conducive to the formation of a relatively uniform deformable layer thereon.

Abstract: A display having a plurality of reflective display elements. In one embodiment, the display elements comprise at least one electrode having a plurality of active areas. In one embodiment, at least two of the sizes of the active areas are different with respect to each other, e.g., they are non-uniform in size. The interferometric modulators have a plurality of states, wherein selected ones of the interferometric modulators are configured to be actuated depending differing electrostatic forces in the interferometric modulators. The electrostatic forces in the interferometric modulators are different at least in part due to variations in the sizes of the active areas of the electrodes.

Abstract: A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.

Abstract: A multi-state light modulator comprises a first reflector 104. A first electrode 142 is positioned at a distance from the first reflector 104. A second reflector 14 is positioned between the first reflector 104 and the first electrode 142. The second reflector 14 is movable between an undriven position, a first driven position, and a second driven position, each having a corresponding distance from the first reflector 104. In one embodiment, the light modulator has latch electrodes 17 and 143, which hold the light modulator in a driven state. In another embodiment the latch electrodes 17 and 143 are used to alter the actuation and release thresholds of the light modulator.

Abstract: An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process.

Abstract: An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.

Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: An Interferometric Modulator (IMod) is a microelectromechanical device for modulating light using interference. The colors of these devices may be determined in a spatial fashion, and their inherent color shift may be compensated for using several optical compensation mechanisms. Brightness, addressing, and driving of IMods may be accomplished in a variety of ways with appropriate packaging, and peripheral electronics which can be attached and/or fabricated using one of many techniques. The devices may be used in both embedded and directly perceived applications, the latter providing multiple viewing modes as well as a multitude of product concepts ranging in size from microscopic to architectural in scope.

Abstract: Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, including optical modulators such as interferometric optical modulators. The interferometric modulator disclosed herein comprises a movable mirror. Some embodiments of the disclosed movable mirror exhibit a combination of improved properties compared to known mirrors, including reduced moving mass, improved mechanical properties, and reduced etch times.

Abstract: A method is provided for visual inspection of an array of interferometric modulators in various driven states. This method may include driving multiple columns or rows of interferometric modulators via a single test pad or test lead, such as test pad, and then observing the array for discrepancies between the expected optical output and the actual optical output of the array. This method may particularly include, for example, driving a set of non-adjacent rows or columns to a state different from the intervening rows or columns and then observing the optical output of the array.

Abstract: An Interferometric Modulator (IMod) is a microelectromechanical device for modulating light using interference. The colors of these devices may be determined in a spatial fashion, and their inherent color shift may be compensated for using several optical compensation mechanisms. Brightness, addressing, and driving of IMods may be accomplished in a variety of ways with appropriate packaging, and peripheral electronics which can be attached and/or fabricated using one of many techniques. The devices may be used in both embedded and directly perceived applications, the latter providing multiple viewing modes as well as a multitude of product concepts ranging in size from microscopic to architectural in scope.

Abstract: Certain embodiments of the invention provide a light sensor comprising at least one interferometric element that absorbs light in at least one wavelength. The interferometric element comprises a first surface and a second surface substantially parallel to the first surface. The second surface is spaced a gap distance from the first surface in a direction substantially perpendicular to the first surface. The light wavelength absorbed is dependent on the gap distance. The interferometric element further comprises a temperature sensor. The temperature sensor is responsive to changes in temperature of at least a portion of the interferometric element due to absorption of light by the interferometric element.

Abstract: A separable modulator architecture is disclosed. The modulator has a mirror suspended from a flexible layer over a cavity. The flexible layer also forms supports and support posts for the mirror. An alternative separable modulator architecture has a mirror suspended over a cavity. The modulator is supported by supports and support posts. The support posts comprise a flexible layer over support post plugs. A bus structure may be formed upon the flexible layer arranged over the support posts.

Abstract: Various systems and methods of lighting a display are disclosed. In one embodiment, for example, a method includes applying a voltage waveform to the interferometric modulators, applying a voltage pulse to the interferometric modulators, detecting reflectivity of light from the interferometric modulators, and determining one or more quality parameters of the interferometric modulators based on the detecting reflectivity of light, where the applied voltage pulse causes the interferometric modulators to vary between an actuated and a non-actuated state, or an non-actuated state and an actuated state.

Abstract: A MEMS device is electrically actuated with a voltage placed across a first electrode (702) and a moveable material (714). The device may be maintained in an actuated state by latch electrodes (730a, 730b) that are separate from the first electrode.

Abstract: In various embodiments of the invention, a regenerating protective coating is formed on at least one surface of an interior cavity of a MEMS device. Particular embodiments provide a regenerating protective coating on one or more mirror surfaces of an interferometric light modulation device, also known as an iMoD in some embodiments. The protective coating can be regenerated through the addition of heat or energy to the protective coating.

Abstract: A MEMS device such as an interferometric modulator includes an integrated ESD protection element capable of shunting to ground an excess current carried by an electrical conductor in the MEMS device. The protection element may be a diode and may be formed by depositing a plurality of doped semiconductor layers over the substrate on which the MEMS device is formed.

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.