Patents Assigned to In-Chip
  • CHIP PACKAGE AND CHIP PACKAGE ARRAY
    Publication number: 20080073774
    Abstract: A chip package including a multilayer substrate, an adhesive core layer and a chip is provided. The multilayer substrate has a plurality of material layers. The adhesive core layer is disposed on the multilayer substrate. The chip is disposed in the adhesive core layer. The chip has an active surface exposed outside the adhesive core layer. The chip includes a plurality of bonding pads disposed on the active surface and a plurality of metal conductive bodies electrically connected to the bonding pads respectively.
    Type: Application
    Filed: December 4, 2006
    Publication date: March 27, 2008
    Applicant: ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
    Inventors: Wen-Kun Yang, Dyi-Chung Hu, Chih-Ming Chen, Hsien-Wen Hsu
  • Wafer street buffer layer
    Patent number: 7342296
    Abstract: The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer layer is filled with the corresponding recesses to form infillings on adjacent the semiconductor device package. Dicing the wafer into individual package along substantial center of said infillings, the step may avoid the roughness on the edge of each die and also decrease the cost of the separating process.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: March 11, 2008
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Jui-Hsien Chang
  • Chip-size package structure and method of the same
    Patent number: 7339279
    Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: March 4, 2008
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventor: Wen Kun Yang
  • Method for image sensor protection
    Patent number: 7335870
    Abstract: The method of forming image sensor protection comprises attaching a glass on a tape and scribing the glass with lines to define cover zones on the glass, the glass is then break by a rubber puncher followed by forming glue on the edge of the cover zones. The glass is bonded on a wafer with an image sensor to align the cover zones to a micron lens area of the image sensor, and then the tape is removed from the wafer, thereby forming glass with cover zones on the image sensor.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: February 26, 2008
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Jui-Hsien Chang, Hsien-Wen Hsu
  • SYSTEM, APPARATUS AND METHOD FOR PROVIDING DATA SECURITY USING USB DEVICE
    Publication number: 20080046751
    Abstract: Disclosed is a data security system using a USB device for maintaining security for files made while various kinds of application programs are used. The data security system comprises: a local computer having the various kinds of application programs installed therein and performing various works by executing the installed various kinds of application programs; and a USB device connected to the local computer via a USB communicating means, wherein, when the USB device is connected to the local computer, a security program is automatically installed from the USB device into the local computer, and the automatically-installed security program performs a security service for works in the local computer.
    Type: Application
    Filed: September 22, 2006
    Publication date: February 21, 2008
    Applicant: ADVANCED DIGITAL CHIPS INC.
    Inventor: In Chul Choi
  • Substructure For Cultivating Cells And Its Use
    Publication number: 20080032397
    Abstract: A substructure for cultivating cells including well-like culture sites separate from each other. The cultivation substructure is closed from above hermetically with a lid which, together with the substructure, limits an air space being common to the culture sites and having a gas inlet and a gas outlet. Water has been added onto the bottom of the cultivation substructure in the areas outside the culture sites, to maintain humidity in the air space.
    Type: Application
    Filed: July 8, 2005
    Publication date: February 7, 2008
    Applicant: Chip-Man Technologies Oy
    Inventor: Juha Korpinen
  • DEFECTIVE PIXEL CORRECTION DEVICE
    Publication number: 20080030600
    Abstract: First pixel data of a pixel of interest is output from a first shift register, while second and third pixel data of neighboring pixels indicative of the same color are output from second and third shift registers, respectively. Differential data between estimated pixel data calculated from the second and third pixel data and the first pixel data is input to a comparator. A threshold value stored in a register is modulated by the estimated pixel data, and is input to the comparator as modulated threshold data. When the comparator judges that the differential data is greater than the modulated threshold data, a selector outputs the estimated pixel data as corrected pixel data.
    Type: Application
    Filed: June 20, 2007
    Publication date: February 7, 2008
    Applicant: MEGA CHIPS CORPORATION
    Inventor: Gen Sasaki
  • COLOR SIGNAL GENERATING CIRCUIT, METHOD AND COLOR SIGNAL SYNTHESIZING CIRCUIT
    Publication number: 20080030602
    Abstract: OSD data YD includes a color designating signal As and a color changing signal Ex. When a color register number is designated by the color designating signal As, a color storage unit 41 outputs an appropriate color signal. A Y signal is branched from the outputted color signal and subjected to a modulating process by the color changing signal Ex. The Y changing signal obtained by the modulating process is merged with a Cb signal and a Cr signal so as to form new color signal. The OSD data YD with changed color is subjected to a synthesizing process with image data XD according to the predetermined mixture ratio.
    Type: Application
    Filed: October 5, 2007
    Publication date: February 7, 2008
    Applicant: MEGA CHIPS CORPORATION
    Inventor: Gen SASAKI
  • Method For Geno-And Pathotyping Pseudomonas Aeruginosa
    Publication number: 20080026370
    Abstract: The invention relates to a method for genotyping and pathotyping bacteria of the species Pseudomonas aeruginosa by means of hybridization assays on a biochip or microarray. The invention further relates to specific oligonucleotide probes, which can be employed within the scope of the detection method, as well as to biochips having such oligonucleotide probes.
    Type: Application
    Filed: January 26, 2005
    Publication date: January 31, 2008
    Applicant: Clonddag Chip Technology GmbH
    Inventors: Gerd Wagner, Lutz Wiehlmann, Burkhard Tuemmler
  • Antenna for a mobile transmitter and/or receiver device
    Patent number: 7324052
    Abstract: An antenna for a mobile transmitter and/or receiver device suitable for a hand-held transmitter/receiver for a wireless microphone includes a monopole or dipole antenna element for the excitation of a monopole or diopole and an additional antenna element for the excitation of a parallel line mode.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: January 29, 2008
    Assignee: Success Chip Ltd.
    Inventors: Dirk Hamm, Marc Lenkeit
  • Structure of image sensor module and a method for manufacturing of wafer level package
    Publication number: 20080017941
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: July 19, 2006
    Publication date: January 24, 2008
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen Kun Yang, Wen Pin Yang
  • Structure of image sensor module and a method for manufacturing of wafer level package
    Publication number: 20080020511
    Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.
    Type: Application
    Filed: April 27, 2007
    Publication date: January 24, 2008
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Wen Pin Yang
  • Illumination System For A Microscope
    Publication number: 20080013169
    Abstract: An automatic microscope apparatus intended to be used in the phase contrast imaging of living cells. The apparatus includes a sample plate station in which a sample plate containing a sample to be examined can be fitted, as well as a microscope. The microscope includes an optical element, an imager and an illumination arrangement that can be arranged to illuminate the sample. The illumination arrangement includes an LED illuminator to provide illumination.
    Type: Application
    Filed: July 8, 2005
    Publication date: January 17, 2008
    Applicant: Chip-Man Technolgies Oy
    Inventors: Juha Korpinen, Jussi Tarvainen
  • Method and system of trace pull test
    Patent number: 7319043
    Abstract: The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: January 15, 2008
    Assignee: Advanced Chip Engineering Technology Inc.
    Inventors: Wen-Kun Yang, Cheng Chieh Tai
  • 3D electronic packaging structure having a conductive support substrate
    Publication number: 20070296065
    Abstract: The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Applicant: Advanced Chip Engineering Technology Inc.
    Inventors: Ming-Chih Yew, Chang-Ann Yuan, Chan-Yen Chou, Kou-Ning Chiang
  • COMPUTER DISPLAY MONITORING APPARATUS, SYSTEM INCLUDING THE SAME, AND COMPUTER DISPLAY MONITORING METHOD
    Publication number: 20070300288
    Abstract: Disclosed are a computer display monitoring apparatus, a system including the same, and a computer display monitoring method. The computer display monitoring system includes a computer terminal; a monitor; and a display monitoring apparatus provided between the computer terminal and the monitor for capturing a video signal transmitted from the computer terminal to the monitor, the display monitoring apparatus including a first coupler and a second coupler.
    Type: Application
    Filed: September 12, 2006
    Publication date: December 27, 2007
    Applicant: ADVANCED DIGITAL CHIPS INC.
    Inventor: In Chul Choi
  • Apparatus for testing a moving vehicle
    Patent number: 7305870
    Abstract: An apparatus and method is provided for testing at least one performance characteristic of a vehicle.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: December 11, 2007
    Assignee: Chip Ganassi Racing Teams, Inc.
    Inventors: Chip Ganassi, Benjamin Bowlby
  • Image Processing Method and Image Processing Device
    Publication number: 20070280539
    Abstract: The present invention relates to an interpolation method and a filtering method which utilize a correlation between pixel signals, and it is an object of the present invention to provide a sharp and high-quality image even if an error occurs in correlation degree judgment. To accomplish the above-mentioned object, an imaging device 10 is of a single-chip type, and includes a RGB Bayer pattern color filter 11, and an image is processed in a manner to be described below. Pixel signals outputted from the imaging device 10 are inputted through a signal processing part 20 to an image processing part 30. A correlation judgment part 31 judges a correlation between the pixel signals, and an interpolation processing part 32 performs a pixel interpolation process based on a correlation result. Thus, each pixel signal becomes a perfect signal having all R, G and B color components.
    Type: Application
    Filed: October 4, 2005
    Publication date: December 6, 2007
    Applicant: Mega Chips Corporation
    Inventors: Hiromu Hasegawa, Yusuke Nara
  • Integrated optical structures with electrically conductive parts
    Patent number: 7304776
    Abstract: The invention concerns a integrated optical structure comprising a plurality of parts made at least of a dielectric material, stacked according to the levels of integration and defining at least an optical microguide, and further comprising at least an integrated part (15) made of an electrically conductive material, interposed or inserted between at least two of said dielectric parts and having at least one part (11a) externally accessible to said dielectric parts for at least an external electrical connection.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: December 4, 2007
    Assignee: Opsitech-Optical System on a Chip
    Inventor: Norbert Colombet
  • DEFECTIVE PIXEL CORRECTION DEVICE
    Publication number: 20070242144
    Abstract: First pixel data of a pixel of interest is output from a first shift register, while second and third pixel data of neighboring pixels indicative of the same color are output from second and third shift registers, respectively. Differential data between estimated pixel data calculated from the second and third pixel data and the first pixel data is input to a comparator. A threshold value stored in a register is modulated by the estimated pixel data, and is input to the comparator as modulated threshold data. When the comparator judges that the differential data is greater than the modulated threshold data, a selector outputs the estimated pixel data as corrected pixel data.
    Type: Application
    Filed: June 20, 2007
    Publication date: October 18, 2007
    Applicant: MEGA CHIPS CORPORATION
    Inventor: Gen SASAKI