Patents Assigned to Industrial Technology Research Institute
  • Publication number: 20240266985
    Abstract: A power integrated module (PIM) and a motor control system are provided. The PIM is adapted to drive a motor. The PIM includes a first transformation circuit, a second transformation circuit, and a plurality of shunt units. The first transformation circuit includes a plurality of first half-bridge circuits, and a coupling relationship among the first half-bridge circuits is selected, so that the first transformation circuit is operated in a rectifier mode or an inverter mode. The second transformation circuit includes a plurality of second half-bridge circuits coupled to the motor. The shunt units are respectively coupled between the second half-bridge circuits and the motor and configured to sense a current between the second transformation circuit and the motor.
    Type: Application
    Filed: April 26, 2023
    Publication date: August 8, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Shian-Chiau Chiou, Yu-Hua Cheng, Chih-Ming Tzeng
  • Patent number: 12055916
    Abstract: A production line scheduling method, adapted to a plurality of jobs passing a bottleneck station having at least one manufacturing machine, the jobs respectively correspond to a plurality of job conditions, and the method includes: performing a plurality of times of a schedule simulation algorithm on the jobs to sequentially establish a plurality of schedule simulation trees, and obtaining a job schedule and a simulated finishing period of each job based on the schedule simulation trees; and calculating a plurality of expected feeding times of each job at a plurality of stations including the bottleneck station, each schedule simulation tree includes at least one scheduling route, and each scheduling route is generated from one schedule simulation algorithm, the schedule simulation algorithm includes: performing a node expansion step based on at least one node expansion condition and the job conditions to obtain the scheduling route.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 6, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Jung Yeh, Tsan-Cheng Su, Chung-Wei Lin
  • Patent number: 12054612
    Abstract: A bioprintable material is provided. The bioprintable material includes a hydrogel and microfilaments mixed in the hydrogel. The hydrogel includes a first collagen. The microfilament includes a second collagen. The diameter of the microfilament is ranging from 5 microns to 200 microns. The weight ratio of the microfilaments to the first collagen is ranging from 0.01:1 to 10:1.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: August 6, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yun-Chung Teng, Jen-Huang Huang, Ying-Wen Shen, Yu-Bing Liou, Hsin-Yi Hsu, Li-Hsin Lin, Yuchi Wang, Hsin-Hsin Shen
  • Patent number: 12054795
    Abstract: A system and method deliver fluidized powder based on flue gas carrying waste slag and instant cooling steel slag. A first flue gas pipeline receives pressurized CO2-rich flue gas and in fluid communication with a fluidization air pipeline, a pressurization air pipeline and a supplementary air pipeline respectively and through them enters an upper discharge bin; a second flue gas pipeline receives the pressurized CO2-rich flue gas and in fluid communication with a gas-gas mixer, a dense phase discharge guide pipe first end extends into the upper discharge bin and receives high-pressure dense phase gas-powder flow of CO2-rich flue gas, and a dense phase discharge guide pipe second end is connected to the gas-gas mixer; a variable-pitch twin screw sealed conveyor discharge end extends into an upper discharge bin internal space, and is provided with an upwardly inclined gas-blocking segment.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: August 6, 2024
    Assignees: SHANDONG UNIVERSITY, QINGDAO DANENG ENVIRONMENTAL PROTECTION EQUIPMENT CO., LTD., QINGDA LOW CARBON GREEN HYDROGEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (QINGDAO) CO., LTD.
    Inventors: Jingcai Chang, Yong Wang, Chunyuan Ma, Lianhai Zhang, Shusheng Li, Rui Wang, Jinglan Hong, Jiahao Zhang
  • Publication number: 20240260366
    Abstract: An optical module including a red light emitting chip array, a green light emitting chip array, a blue light emitting chip array, and a flat optical element is provided. The red light emitting chip array is configured to emit red lights. The green light emitting chip array is configured to emit green lights. The blue light emitting chip array is configured to emit blue lights. After passing through the flat optical element, the red, green, and blue lights form a plurality of light spots. Each of the light spots includes a red light spot, a green light spot, and a blue light spot which are formed after one of the red lights, one of the green lights, and one of the blue lights pass through the flat optical element. A near-eye display is also provided.
    Type: Application
    Filed: December 21, 2023
    Publication date: August 1, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Ming-Hsien Wu
  • Publication number: 20240258525
    Abstract: A polymer, a composition, a negative electrode and a battery employing the same are provided. The polymer has a repeat unit represented by Formula (I) wherein R1 is hydrogen or acetyl group; and, each R2 is independently hydrogen, —SO3H, or —SO3Li, and at least one of R2 is —SO3Li.
    Type: Application
    Filed: August 30, 2023
    Publication date: August 1, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Guan-Lin LAI, Chi-Yang CHAO, Ting-Ju YEH, Chi-Ju CHENG, Guan-Fu LIU
  • Publication number: 20240258370
    Abstract: A semiconductor component including a semiconductor layer, a barrier layer, a leakage current suppression layer, an ohmic contact layer and an electrode layer is provided. The semiconductor layer has a protrusion and a top surface, adjacent to the protrusion. The protrusion includes a top surface and a side surface. The barrier layer is disposed on the top surface of the protrusion. The leakage current suppression layer is disposed on the top surface of the semiconductor layer. The ohmic contact layer is disposed on the leakage current suppression layer, and contacts the side surface of the protrusion and a side surface of the barrier layer. The ohmic contact layer does not contact the top surface of the semiconductor layer. The electrode layer is disposed on the ohmic contact layer.
    Type: Application
    Filed: December 17, 2023
    Publication date: August 1, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Hsueh-Hsing Liu, Chia-Lung Tsai
  • Publication number: 20240255759
    Abstract: A near-eye display device includes a first light transmission substrate, a plurality of arrays of display units, a second light transmission substrate, and a plurality of arrays of optical elements. The arrays of display units are configured on the first light transmission substrate. An interval between two adjacent display units is a light transmission region. The second light transmission substrate is configured in a different layer from the first light transmission substrate in a stacking direction. The arrays of optical elements are configured on the second light transmission substrate. An interval between two adjacent optical elements is a light transmission region. Each display unit has a one-to-one correspondence with the optical element in the stacking direction.
    Type: Application
    Filed: January 25, 2024
    Publication date: August 1, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chy-Lin Wang, Chia-Hsin Chao, Hsueh-Chih Chang
  • Publication number: 20240258280
    Abstract: An image compensation device including a substrate and island display units is provided. The substrate includes a central area and configuration rings surrounding the central area and spaced apart from the central area at different intervals. The island display units are disposed on the substrate. One of the island display units is disposed at the central area, and the other island display units are respectively disposed at the configuration rings. Each island display unit includes a real display area and a dummy display area located around the real display area, and includes real pixels and dummy pixels. The real pixels are disposed in the real display area. The dummy pixels are disposed in the dummy display area, and a number of the dummy pixels is greater than a number of the real pixels to compensate for a display image spliced by discrete images.
    Type: Application
    Filed: December 27, 2023
    Publication date: August 1, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Ren-Lu Chen, Chy-Lin Wang, Li-Chun Huang, Chia-Hsin Chao, Ming-Hsien Wu
  • Patent number: 12049908
    Abstract: A pressure difference generating apparatus includes a first pipe, a second pipe and a third pipe. The first pipe have a first inlet. The second pipe disposed inside of the first pipe has a conical inlet runner, a conical outlet runner and a neck portion between the conical inlet runner and outlet runner. The third pipe has a third conical outlet portion extending into the conical inlet runner. A first fluid and a second fluid flow into the first pipe and the third pipe separately in different flow rates. A negative pressure generated between the third conical outlet portion and the conical inlet runner allows at least part of the first fluid to flow into the conical inlet runner, then the neck portion, then the conical outlet runner, and finally out of the second pipe with the second fluid.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: July 30, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Kang-Feng Lee
  • Publication number: 20240251536
    Abstract: An electromagnetic wave absorber including a substrate and a plurality of magnetic material bodies is provided. The plurality of magnetic material bodies are disposed on the substrate in an array, so that the electromagnetic wave absorber has a plurality of electromagnetic wave absorption frequencies in addition to an electromagnetic wave characteristic frequency of the plurality of magnetic material bodies. A ratio of one of the plurality of electromagnetic wave absorption frequencies to the electromagnetic wave characteristic frequency is greater than 1 and is less than or equal to 6.
    Type: Application
    Filed: December 22, 2023
    Publication date: July 25, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Pin Wu, Shi-Yuan Tong, Wen-Song Ko, Chun-An Lu
  • Publication number: 20240251076
    Abstract: An electronic device and a method of intra prediction. The method includes: a first reference area adjacent to a first target image block is obtained from a reference image block, and the first reference area includes multiple first reference samples corresponding to a first direction; an intra mode of the first target image block is determined according to the first reference samples; and the intra mode is outputted.
    Type: Application
    Filed: October 29, 2023
    Publication date: July 25, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Sheng-Po Wang, Ching-Chieh Lin, Chun-Lung Lin
  • Publication number: 20240246311
    Abstract: A shaping apparatus for shaping a workpiece includes a controlling module and a pressing module, a moving module, a sensing module and a shaping calculation module that are connected to the controlling module. The pressing module includes two pressing elements respectively applying load to a top/bottom surface of the workpiece. The moving module includes a moving platform moving the workpiece horizontally between a sensing zone and a processing zone. The sensing module performs a capturing process on the workpiece in the sensing zone to obtain a surface information. The shaping calculation module compares the surface information with an ideal shape data to calculate and get a shaping information. The moving platform moves the workpiece to the sensing zone. The sensing module performs a capturing process on the workpiece. The moving platform moves the workpiece to the processing zone. The pressing module performs a shaping treatment on the workpiece.
    Type: Application
    Filed: March 4, 2024
    Publication date: July 25, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Huang SHIEH, Po-Nien TSOU, Hsuan-Yu HUANG, Wei-Chieh CHANG
  • Publication number: 20240251686
    Abstract: Disclosed in embodiments of the present application are a linear resistive element and a preparation method therefor. The linear resistive element includes a substrate unit, a function unit and an electrode unit. The substrate unit includes a substrate layer, which is configured to connect the function unit and the electrode unit. The electrode unit includes a first electrode and a second electrode. The first and second electrodes are deposited on the substrate layer, and the function unit is connected between the first and second electrodes. The function unit includes first dielectric layers and resistive layers. The first dielectric layers and the resistive layers are deposited on the substrate layer in an alternately stacked manner. A number of the resistive layers is at least two, and a conductive filament for conductively connecting the first and second electrodes is formed in each of the resistive layers.
    Type: Application
    Filed: January 30, 2024
    Publication date: July 25, 2024
    Applicant: XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
    Inventors: SZU-CHUN KANG, Tingying SHEN, Lijun SHAN, Taiwei CHIU, Yu LIU, Yajun ZHANG
  • Patent number: 12045031
    Abstract: A thermal compensation system for machine tools includes a thermal compensation-monitoring device and a cloud processing device. The thermal compensation-monitoring device receives a plurality of temperature signals of a workpiece and corresponding processing tolerance data to build or update a thermal compensation database. The cloud processing device provides a thermal compensation model, and applies the model with the characterized temperature signals and the tolerance data to generate a compensation value so as to decide whether or not to modify the model or to run a compensation is necessary.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: July 23, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Chin Chuang, Chin-Ming Chen, Chun-Yu Tsai, Chi-Chen Lin, Chung-Kai Wu
  • Publication number: 20240243271
    Abstract: Doped titanium niobate is provided, which has a chemical structure of Ti(1-x)M1xNb2O(7-z)Sz, wherein M1 is Li, Mg, or a combination thereof; 0?x?0.15; and 0.0025?z?0.075. A battery is provided, which includes a negative electrode; a positive electrode; and an electrolyte disposed between the negative electrode and the positive electrode, wherein the negative electrode includes the doped titanium niobate.
    Type: Application
    Filed: March 28, 2024
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yu KO, Po-Yang HUNG, Chi-Ju CHENG, Shih-Chieh LIAO, Yung-Ting FAN, Jin-Ming CHEN
  • Publication number: 20240239986
    Abstract: A copolyester is formed by copolymerizing a depolymerized polyester and succinic acid. The depolymerized polyester includes depolymerized polyethylene terephthalate (PET), and the depolymerized PET is formed by depolymerizing PET with ethylene glycol. The repeating unit of PET and the succinic acid have a molar ratio of 40:60 to 50:50. The repeating unit of PET and the ethylene glycol have a molar ratio of 100:100 to 100:500. The copolyester has a storage modulus of 1*104 Pa to 1*106 Pa at 80° C. The copolyester can be used in a hot melt adhesive.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Che-Tseng LIN, Meng-Hsin CHEN, Jen-Chun CHIU, Kai-Chuan KUO, Yu-Lin CHU, Po-Hsien HO, Ke-Hsuan LUO, Chih-Hsiang LIN, Hui-Ching HSU
  • Publication number: 20240238911
    Abstract: A conductive composition, conductive layer and electronic device employing the same are provided. The conductive composition includes 3-7 parts by weight of a component (A) and 93-97 parts by weight of a component (B). The component (A) is an epoxy compound, wherein the epoxy compound is a compound having at least one glycidyloxycarbonyl group. The component (B) includes a first metal particle, wherein the first metal particle has a particle size distribution D90 that is less than or equal to 1 ?m. The total weight of the component (A) and component (B) is 100 parts by weight.
    Type: Application
    Filed: November 17, 2023
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Chi YANG, Jyh-Long JENG
  • Publication number: 20240241179
    Abstract: A power supply system, a fuel cell power generation performance detection device and a control method thereof are provided. The fuel cell has a rated output voltage and an internal resistance having a preset resistance value. The detection device includes a test resistor, a first test switch, a current detection unit and a control unit. The control unit controls the first test switch and the current detection unit to send a first control signal to selectively turn on the first test switch. When the first test switch is turned on, the fuel cell, the test resistor, the first test switch and the current detection unit define a test loop. The current detection unit detects a test current passing through the test loop. The control unit obtains a real-time resistance value of the internal resistance based on the test current to evaluate the power generation performance of the fuel cell.
    Type: Application
    Filed: November 1, 2023
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuh-Fwu CHOU, Ching-Jung LIU, Yin-Wen TSAI, Ku-Yen KANG, Chih-Wei HSU
  • Publication number: 20240243097
    Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.
    Type: Application
    Filed: January 18, 2024
    Publication date: July 18, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Ming Peng, I-Hung Chiang, Chun-Kai Liu, Po-Kai Chiu, Hsin-Han Lin, Kuo-Shu Kao