Abstract: A package which comprises an electrically conductive chip carrier, a first chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, a second chip comprising a first connection terminal, a second connection terminal located on the chip carrier and a control terminal, wherein the first chip and the second chip are connected to form a half bridge having inlet terminals and an outlet terminal, and a clip having three connection sections connecting the second connection terminal of the first chip with the first connection terminal of the second chip and with the outlet terminal of the half bridge.

Abstract: Described herein are embodiments that relate to a method for use in data processing. An embodiment includes providing an arithmetic unit configured to perform any one in a set of operations. An embodiment includes providing a control register configured to hold control data. An embodiment includes providing in the set of operations, a control operation to provide process control, the control operation to operate on an operand that is coupled to the control data. A system for use in data processing is also disclosed having process registers and a control register. Further, a non-transitory computer-readable medium storing instruction code thereon for use in data processing is disclosed. When executed, the code causes a control operation forming part of a set of operations to operate on an operand that is coupled to control data held in a control register.

Abstract: The present disclosure teaches a sensor system comprising at least two sensor elements causing increased reliability of individual sensor signals due to increased diagnostic coverage using diverse signal paths, diverse signal representations of sensor signals, merging of individual sensor signals maintaining independence of individual sensor signals comprised in protocol representations thereof.

Abstract: A rectifying device includes a power transistor, a gate control circuit and a capacitor structure arranged on a single semiconductor die. The power transistor includes a source or emitter terminal connected to a first terminal of the rectifying device, a drain or collector terminal connected to a second terminal of the rectifying device, and a gate. The gate control circuit is operable to control a gate voltage at the gate of the power transistor based on at least one parameter relating to at least one of a voltage and a current between the first terminal and the second terminal.

Abstract: In accordance with an embodiment, a circuit includes: a replica input transistor, a first replica cascode transistor, an active current source, and an active cascode biasing circuit. The active current source is configured to set a current flowing through the first replica cascode transistor and the replica input transistor to a predetermined value by adjusting a voltage of a control node of the replica input transistor; and an active cascode biasing circuit including a first output coupled to the control node of the first replica cascode transistor, and the active cascode biasing circuit configured to set a drain voltage of the replica input transistor to a predetermined voltage by adjusting a voltage of the control node of the first replica cascode transistor.

Abstract: An embodiment relates to an angle sensor for detecting a rotational position of a shaft to which a magnetic field arrangement is attached, comprising: a first sensor element, a second sensor element, a support structure, wherein the first sensor element and the second sensor element are mechanically coupled to the support structure, wherein the support structure is arranged to be mechanically connected to a hull, wherein the hull at least partially encloses the shaft.

Abstract: A radio frequency (RF) device includes a plurality of mixers, each of the plurality of mixers having a first input terminal, a second input terminal, and an output terminal; and a self-test circuit.

Abstract: A semiconductor chip includes a substrate, an integrated circuit, an indentation of the substrate, a conductor track, and also a crossover between the indentation and the conductor track. Detection of a test signal fed into the conductor track is made possible in this way. In various examples, a fracture of the substrate in the region of the indentation can be detected.

Abstract: An RF front-end circuit of an RF transceiver is described herein. In accordance with one exemplary embodiment, the fronted circuit includes a local oscillator (LO) configured to generate an RF transmit signal, an RF output port coupled to the local oscillator, wherein the RF transmit signal is output at the RF output port, and a monitoring circuit receiving an input signal and configured to determine the phase of the input signal or the power of the input signal or both. A directional coupler is coupled to the RF output port and configured to direct a reflected signal incoming at the RF output port as input signal to the monitoring circuit, and a controller is configured to detect, based on the determined phase or power or both, a defect in a signal path operably connected to the RF output port.

Abstract: Devices and methods are provided relating to supplying a load having an inrush-current behavior, e.g. charging of a capacitance e.g. at power up of a circuit. A first load path and a second load path are provided which are used in an alternating manner.

Abstract: A method of manufacturing a package, wherein the method comprises a forming a chip carrier by covering a thermally conductive and electrically insulating core on both opposing main surfaces thereof at least partially by a respective electrically conductive layer by brazing the respective electrically conductive layer on a respective one of the main surfaces; a mounting at least one electronic chip on the chip carrier; an electrically coupling an electrically conductive contact structure with the at least one electronic chip; and an encapsulating part of the electrically conductive contact structure, and at least part of the chip carrier and of the at least one electronic chip by a mold-type encapsulant.

Abstract: Systems, devices, methods, and techniques are disclosed for performing calibrated measurements of current through switches in an electronic control unit. In one example, a device includes a current sensor system; a controller, operably connected to the current sensor system; and one or more switches, operably connected to the controller. The current sensor system is configured to receive a measurement of current conducted through at least one switch of the one or more switches. The current sensor system is further configured to perform a measurement of calibrated total current for the one or more switches. The current sensor system is further configured to determine a calibrated value of current for the at least one switch, based at least in part on a comparison of the measurement of current conducted through the at least one switch and the measurement of calibrated total current for the one or more switches.

Abstract: A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the substrate, which together with the substrate encloses the one or more power semiconductor dies, a plurality of power terminals attached to the first main face of the substrate at a first end, and extending through the plastic housing at a second end to provide a point of external electrical connection for the one or more power semiconductor dies, a potting compound embedding the one or more power semiconductor dies, the first main face of the substrate and at least part of the first end of the plurality of power terminals, and an insulative coating applied only to parts of the plurality of power terminals disposed inside the plastic housing and in contact with just air. A corresponding method of manufacture also is provided.

Abstract: A clock generator and a method to control an associated system are described. The clock generator (e.g., a PLL) can include a charge pump that can generate a current, and a controller coupled to the charge pump. The controller can determine a characteristic impacting operation of the clock generator and control the charge pump to adjust the current based on the determined characteristic to adjust a bandwidth of the clock generator. The clock generator and method can include adjusting the bandwidth to compensate for variations (e.g. PVT variations) that impact the operation of the clock generator to maintain constant or substantially constant bandwidth independent of such variations.

Abstract: Embodiments may provide a system, a wheel localizer, a wheel localization device, or methods for locating a position of at least one wheel out of a plurality of wheels of a vehicle. In one embodiment, a system comprises a detector that obtains information related to a reference magnetic field in which the at least one wheel rotates, an antilock braking system (ABS) unit that obtains information related to angular rotations of the plurality of wheels, and a locator that determines the position of the at least one wheel based, at least in part, on the information related to the reference magnetic field and the information related to the angular rotations of plurality of wheels, where the position comprises a wheel location from among the plurality of wheels. The reference magnetic field may be the earth's magnetic field.

Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.

Abstract: A radar device includes a radar reception circuit configured to provide an analog radar signal by means of a radio frequency (RF) radar signal received by an antenna being downconverted into a baseband frequency. The radar reception circuit further includes an analog-to-digital converter, to which the analog radar signal is fed and which is configured to digitize said analog radar signal and to provide it as a digital radar signal, and also a digital multiplier configured to multiply the digital radar signal by a digital window signal, as a result of which a windowed radar signal is provided. A window generator is configured to calculate the digital window signal by evaluating one or more polynomials. The radar device further includes a processor configured to further process a plurality of signal blocks of the windowed radar signal, signal block by signal block.

Abstract: Magnetic field sensors and sensing methods are provided. A magnetic sensor includes at least one magnetic field sensor element configured to generate an analog input sensor signal in response to a magnetic field, an inverting amplifier configured to generate an analog output sensor signal having a gained value with respect to the analog input sensor signal, a programmable current divider disposed in a negative feedback path of the inverting amplifier such that the gained value is dependent on an effective feedback resistor value of the programmable current divider, and a digital controller configured to receive at least one measurement parameter, generate a codeword based on the at least one measurement parameter, and transmit the codeword to the programmable current divider for compensating the gained value. The effective feedback resistor value is adjusted based on the codeword received by the programmable current divider.

Abstract: A mirror device includes a frame, a mirror body arranged in the frame and rotatable around a rotation, support beams connected between the mirror body and the frame and a leaf spring providing torsional stiffness with respect to a rotation of the mirror body around the rotational axis. The leaf spring has a maximum thickness that is smaller than a minimum width thereof, where the leaf spring has openings that reduce the thickness thereof or the penetrate the leaf spring in the thickness direction.

Abstract: A gated diode in a press-fit housing includes a base configured to be press-fit into an opening of a diode carrier plate and including a pedestal portion with a first flat surface, and a head wire including a head portion with a second flat surface and a wire portion. The base and the head wire form parts of the press-fit housing. The gated diode in the press-fit housing further includes a semiconductor die, a first solder layer engaging and electrically connecting the semiconductor die with the first flat surface of the base, and a second solder layer engaging and electrically connecting the semiconductor die with the second flat surface of the head wire.