Abstract: A photodetector with an integrated reflective grating structure includes a substrate, an active layer disposed on the substrate, and a grating structure disposed between the substrate and the active layer. A first doped region is formed on the substrate at a location near the grating structure. A second doped region is formed on a surface of the active layer away from the grating structure. The doping type of the second doped region is different from that of the first doped region.

Abstract: A wavelength selection method for a tunable laser includes: obtaining a target wavelength; and calculating target resistance values of two thermistors, respectively, corresponding to the target wavelength. Each of the two thermistors is used to monitor the temperature of a corresponding one of two wavelength selection components. Each of the target resistance values is calculated according to a relationship between a wavelength drift and a resistance change of the corresponding thermistor and according to an initial wavelength and an initial resistance value of the corresponding thermistor corresponding to the initial wavelength. The method further includes: heating the two wavelength selection components to control their temperatures until real-time resistance values of the two thermistors reach the target resistance values, respectively; and stabilizing the real-time resistance values at the target resistance values and outputting a laser beam having the target wavelength.

Abstract: An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board which partially overlap each other face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.

Abstract: A hybrid integrated optoelectronic chip including an optoelectronic chip and a silicon photonic chip, a material of the optoelectronic chip being different from a material of the silicon photonic chip. The optoelectronic chip includes at least one first waveguide. The silicon photonic chip includes at least one second waveguide and an installation recess. The optoelectronic chip is installed in the installation recess, and the first waveguide is optically connected to the second waveguide.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.

Abstract: An optical interface assembly, comprising a lens, an optical receptacle, a stub disposed in the optical receptacle. The lens includes a convex surface farther away from the stub and a flat surface near the stub, the flat surface and a cross section of the lens being disposed at an inclined angle from each other. A first end surface of the stub facing the lens is disposed at an inclined angle relative to an axis of the stub. When a light beam is coupled into the stub by the lens, a portion of a return light reflected from the first end surface of the stub is reflected to an outside of the lens.

Abstract: A receiver optical assembly includes: an optical platform, a receiver optical port and a wavelength division multiplexer being arranged along an optical path on the optical platform; a circuit board, a photodetector array being disposed on the circuit board; a mounting block, a focusing lens and an optical path shifter being disposed on t the mounting block, the mounting block being fixed on the circuit board, and the optical path shifter being placed above the photodetector array. Incident light containing a multi-channel optical signal enters through the receiver optical port, and the wavelength division multiplexer divides the incident light into a plurality of single-channel optical signal beams. The single-channel optical signal beams are coupled to photodetectors on the photodetector array after passing through the focusing lens and the optical path shifter on the mounting block.

Abstract: Provided are a silicon-based tunable filter, laser and an optical module. The tunable laser comprises a semiconductor optical amplifier and a silicon photonic integrated chip, wherein a first coupler, a phase regulator and a tunable filter are provided on the silicon photonic integrated chip; the tunable filter comprises a flat-top band-pass filter structure, a Mach-Zehnder interferometry (MZI) structure and a micro ring resonation (MRR) structure, which are cascaded; gain light emitted by the semiconductor optical amplifier is coupled to the silicon photonic integrated chip by means of the first coupler, and a narrowband filtered optical signal is output by means of the tunable filter; and the phase of the gain light is regulated by means of the phase regulator so as to output single-peak narrowband laser light with a tunable target wavelength.

Abstract: An optical assembly includes a base plate, a light transmitting component arranged on the base plate, a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component, a supporting member, and an auxiliary member. The supporting member includes a bottom surface that bonds to the base plate and a side surface that connects to the auxiliary member. The auxiliary member includes a side surface on which the lens component is disposed and a bonding surface that bonds to the side surface of the supporting member. The lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component. A bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than the top surface of the base plate.

Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, an optoelectronic chip disposed in the housing and electrically connected to the circuit board module, a position limiting card disposed behind the fiber optic receptacle module, and a plurality of through holes arranged at the optical interface. The plurality of fiber optic receptacles are installed at the optical interface and fit through the plurality of through holes, and the position limiting card is fixed to the housing and locks the fiber optic receptacle module tightly against the optical interface.

Abstract: An electro-optic modulator includes a base plate, an optical waveguide, at least one set of modulation electrodes, and an electromagnetic shielding structure. The electromagnetic shielding structure includes a top shielding member covering the set of modulation electrodes from above, and a side shielding member disposed on two sides of the set of modulation electrodes. At least a portion of the side shielding member extends into the base plate to isolate the set of modulation electrodes.

Abstract: An optical module includes a substrate, an optical device, and a plurality of light transmitting elements and a plurality of light receiving elements disposed between the optical device and the substrate. The optical device includes a device body, and an optical transceiver interface and a lens array that are disposed on the device body. The lens array is configured to optically couple the plurality of light transmitting elements with the optical transceiver interface, and optically couples the optical transceiver interface with the plurality of light receiving elements. An auxiliary lens is disposed on an optical coupling path between the plurality of light transmitting elements and the optical transceiver interface or between the optical transceiver interface and the plurality of light receiving elements.

Abstract: An optical interface assembly, comprising a lens barrel, a lens disposed in the lens barrel, an optical receptacle, a stub disposed in the optical receptacle, and a diaphragm disposed between the lens and the stub. A diameter of a light passing hole of the diaphragm is smaller than a diameter of a light passing surface of the lens. A first end surface of the stub facing the lens is disposed at an inclined angle relative to an axis of the stub. When a light beam is coupled into the stub by the lens, a portion of a return light reflected from the first end surface is reflected to an outside of the light passing hole of the diaphragm.

Abstract: A silicon-based electro-optic modulator includes a substrate layer, an insulation layer, and an optical waveguide layer stacked sequentially, traveling wave electrodes disposed above the optical waveguide layer, and a metal grating structure periodically configured along the direction in which an electrical signal propagates in the traveling wave electrodes. The metal grating structure is disposed above the optical waveguide layer.

Abstract: A wavelength selection method for a tunable laser includes: obtaining a target wavelength; and calculating target resistance values of two thermistors, respectively, corresponding to the target wavelength. Each of the two thermistors is used to monitor the temperature of a corresponding one of two wavelength selection components. Each of the target resistance values is calculated according to a relationship between a wavelength drift and a resistance change of the corresponding thermistor and according to an initial wavelength and an initial resistance value of the corresponding thermistor corresponding to the initial wavelength. The method further includes: heating the two wavelength selection components to control their temperatures until real-time resistance values of the two thermistors reach the target resistance values, respectively; and stabilizing the real-time resistance values at the target resistance values and outputting a laser beam having the target wavelength.

Abstract: An optical module includes a housing including an optical interface, a circuit board module disposed in the housing, a fiber optic receptacle module disposed in the housing and including a plurality of fiber optic receptacles, and an optoelectronic chip disposed in the housing and electrically connected to the circuit board module. The plurality of fiber optic receptacles are connected together and are installed at the optical interface.

Abstract: An optical module includes a housing extending in a lengthwise direction, as well as a main circuit board and an optical receiver assembly disposed in the housing. A plane on which the main circuit board is located is parallel to the lengthwise direction of the housing. The optical receiver assembly includes a receiver-end fiber optic port, at least two sets of receiver-end photoelectronic chips arranged side by side along the lengthwise direction, and a receiver-end optical component set including an optical demultiplexer and at least two coupling components located at an exit end of the optical demultiplexer. The at least two coupling components are arranged side by side along the lengthwise direction, and have different distances, respectively, to the plane on which the main circuit board is located along a first direction perpendicular to the plane on which the main circuit board is located.

Abstract: A waveguide photoelectric detector, comprising: a substrate comprising a silicon layer, the silicon layer having a silicon waveguide formed thereon; an active layer dispose on the silicon waveguide, the active layer having a first doped region formed thereon; a horizontal PIN junction formed at an area of the silicon layer below the active layer, the horizontal PIN junction comprising a second doped region, an intrinsic region, and a third doped region. A doping type of the second doped region is the same as that of the first doped region. One end of the second doped region near the intrinsic region is connected to the first doped region. The third doped region and the first doped region form a vertical PIN junction.

Abstract: An optical assembly includes a carrier plate, a light emitting element and a lens component disposed on the carrier plate, and a securing block. The securing block has a first surface and a light-passing portion that are located on an optical path of an output light from the light emitting element. The lens component includes a lens portion and a connecting portion. The lens portion is located on the optical path. The connecting portion has a second surface facing the first surface of the securing block. A bottom surface of the securing block is bonded to the carrier plate. The lens component is secured onto the carrier plate by means of bonding between the second surface and the first surface of the securing block. A clearance space is present between the lens portion and the light-passing portion so that the lens portion does not contact the securing block.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. The optical transmitting assembly includes at least two sets of lasers, a transmitting-end optical assembly, and a transmitting-end optical fiber receptacle. The optical receiving assembly includes at least two sets of photoelectric detectors, a receiving-end optical assembly, and a receiving-end optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and the optical receiving assembly to the main circuit board.