Abstract: A narrow-linewidth tunable external cavity laser includes, sequentially arranged along an optical path, a laser gain chip, a collimating lens, a bandpass filter, a tunable filter, and an output cavity surface. The laser gain chip includes a first end surface and a second end surface positioned along the optical path. The first end surface is further away from the collimating lens and is coated with a highly reflective film to form an external cavity with the output cavity surface.

Abstract: An optical assembly includes a base plate, a light transmitting component arranged on the base plate, a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component, a supporting member, and an auxiliary member. The supporting member includes a bottom surface that bonds to the base plate and a side surface that connects to the auxiliary member. The auxiliary member includes a side surface on which the lens component is disposed and a bonding surface that bonds to the side surface of the supporting member. The lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component. A bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than the top surface of the base plate.

Abstract: A receiver optical assembly includes: an optical platform, a receiver optical port and a wavelength division multiplexer being arranged along an optical path on the optical platform; a circuit board, a photodetector array being disposed on the circuit board; a mounting block, a focusing lens and an optical path shifter being disposed on t the mounting block, the mounting block being fixed on the circuit board, and the optical path shifter being placed above the photodetector array. Incident light containing a multi-channel optical signal enters through the receiver optical port, and the wavelength division multiplexer divides the incident light into a plurality of single-channel optical signal beams. The single-channel optical signal beams are coupled to photodetectors on the photodetector array after passing through the focusing lens and the optical path shifter on the mounting block.

Abstract: An electro-optic modulator includes a doped structure disposed on a top silicon layer of a substrate. The doped structure includes an optical waveguide, and a first P-type doped region and a first N-type doped region disposed respectively on two sides of the optical waveguide. The first P-type doped region is connected to the optical waveguide by means of a plurality of P-type doped link arms, and the first N-type doped region is connected to the optical waveguide by means of a plurality of N-type doped link arms. End portions of the plurality of P-type doped link arms and end portions of the plurality of N-type doped link arms are alternately arranged along a direction of light propagation to form PN junction depletion layers. The PN junction depletion layers are periodically arranged along the direction of light propagation to form the optical waveguide.

Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

Abstract: An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes a first optoelectronic chip and a second optoelectronic chip that are both arranged on the heat sink apparatus. The first optoelectronic chip and second optoelectronic chip are both electrically connected to the printed circuit board. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The second optoelectronic chip is arranged at the opening. The second optoelectronic chip is arranged separately from the first optoelectronic chip.

Abstract: An optical modulator includes: a bottom substrate layer, having a first surface; a traveling-wave electrode, being disposed on the first surface of the bottom substrate layer and including a plurality of ground electrodes and a plurality of signal electrodes between the ground electrode; an optical waveguide disposed inside the bottom substrate layer; and a shield layer, including a substrate and a metal layer, the substrate covering at least a portion of the traveling-wave electrode and the metal layer being disposed on the surface of the substrate facing away from the traveling-wave electrode. Each of the ground electrodes is electrically connected to the metal layer to provide electromagnetic shielding for the signal electrodes between the ground electrodes.

Abstract: An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

Abstract: A flexible circuit board, and an optical transceiver assembly and an optical module that have such flexible circuit board. The flexible circuit board includes a substrate body, a transmission metal layer formed on at least one surface of the substrate body, a strengthening layer formed on the transmission metal layer, and a surface metal layer formed on a portion of an outer surface of the strengthening layer. The surface metal layer constitutes a securing portion for securing and connecting to an external element. A portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion. The surface metal layer is electrically connected to the transmission metal layer.

Abstract: A flexible circuit board, and an optical transceiver assembly and an optical module that have such flexible circuit board. The flexible circuit board includes a substrate body, a transmission metal layer formed on at least one surface of the substrate body, a strengthening layer formed on the transmission metal layer, and a surface metal layer formed on a portion of an outer surface of the strengthening layer. The surface metal layer constitutes a securing portion for securing and connecting to an external element. A portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion. The surface metal layer is electrically connected to the transmission metal layer.

Abstract: A substrate packaging structure includes: a first substrate and a second substrate that are electrically connected; a plurality of conductive blocks arranged on each one of the first substrate and the second substrate, and electrically connected to each other; first and second conductive areas respectively formed on upper and side surfaces of the first substrate; a first reference conductive area formed below the upper surface of the first substrate and electrically connected to the first and second conductive areas; third and fourth conductive areas respectively formed on upper and side surfaces of the second substrate; and a second reference conductive area formed below the upper surface of the second substrate and electrically connected to the third and fourth conductive areas. The first conductive area on the first substrate is electrically connected to the third conductive area on the second substrate.

Abstract: An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

Abstract: An optical module includes a housing, a PCB base board, an optical assembly, and a heat generating device. The PCB base board, the optical assembly, and the heat generating device are arranged in the housing. The heat generating device is thermally connected to the housing. A plurality of ribs are arranged outside the housing. Air flow channels are formed between the plurality of ribs and extend along a longitudinal direction of the optical module. Each one of the ribs has a first end portion, a second end portion, and a middle portion that connects the first end portion and the second end portion. A radial width of at least one of the ribs gradually increases from the first end portion of the at least one of the ribs toward the middle portion of the at least one of the ribs.

Abstract: An optical communication module includes: a casing with an optical signal port and an electrical signal port arranged respectively on two ends of the casing; a circuit board assembly and an optical component assembly arranged inside the casing, the circuit board assembly including a circuit board and a control unit arranged on the circuit board; a fiber-optic communication cable connected to the optical signal port; and a status indicator unit arranged on the fiber-optic communication cable.

Abstract: An optical module includes a housing, a printed circuit board, an optical assembly, an optical interface joined with the optical assembly, the printed circuit board, the optical assembly, and the optical interface being disposed in the housing, an adapter to be mated with an external optical connector and disposed on an end of the housing, and first and second connecting part disposed on the adapter and the housing, respectively. The adapter and the housing are secured together through the first and second connecting parts. The optical interface and the adapter are configured to correspond to each other.

Abstract: An avalanche photodiode (APD) bias control method may include acquiring a photocurrent intensity voltage and generating a control signal by superposing the acquired photocurrent intensity voltage and a bias setting signal, wherein the control signal controls a voltage drop between an adjustable power supply output voltage and a voltage of the APD. The APB bias control method may further include adjusting the adjustable power supply output voltage and the bias setting signal simultaneously so that the voltage drop is within a target voltage drop range and the APD bias voltage approaches a bias voltage that corresponds to an APD optical input power. An avalanche photodiode (APD) bias controller and an avalanche photodiode (APD) photoelectric receiver are also provided.

Abstract: An optical assembly is provided. The optical assembly includes a light transmitting terminal, a light receiving terminal, an optical component located between the light transmitting terminal and the light receiving terminal, a collimating unit located between the optical component and the light transmitting terminal, and a focusing unit located between the optical component and the light receiving terminal. The collimating unit includes a first lens located between the optical component and the light transmitting terminal, and a field lens located between the first lens and the optical component and configured to absorb an alignment error between the light transmitting terminal and the first lens. The focusing unit includes a second lens located between the optical component and the light receiving terminal.

Abstract: An optical path control system is provided. The optical path control system includes a converging lens used to converge a plurality of light beams passing through the converging lens, and an optical path assembly used to control propagation directions of the plurality of light beams passing through the optical path assembly. When the plurality of light beams pass through the optical path assembly and the converging lens sequentially, the optical path assembly converges the plurality of light beams, and the converging lens converges each of the plurality of light beam into a point of light.

Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.

Abstract: An optical module includes: an optical assembly, including a light receiving assembly and/or a light transmitting assembly; a printed circuit board, on which the optical assembly is mounted; an adapter, used for docking with external connectors, wherein the adapter is configured to fit the optical assembly and to be fixed to the printed circuit board, and the adapter includes a metal part and a plastic part; and a conductive shell, used for accommodating the printed circuit board, the optical assembly, and the adapter, the conductive shell being electrically connected to the metal part of the adapter.