Abstract: The invention relates to a display device including a substrate, a plurality of pixels, a first insulating layer, a first conductive layer and a second conductive layer. The plurality of pixels are disposed on the substrate and comprise an active layer. The first insulating layer is disposed on the substrate and comprises a plurality of first recesses. The first conductive layer is disposed on the first insulating layer. The second conductive layer is electrically connected to the first conductive layer through one of the plurality of first recess. The active layer is disposed on the first insulating layer.

Abstract: An electronic device is provided. The electronic device includes a circuit structure layer, a package structure, and an electronic element. The package structure is disposed on the circuit structure layer. The electronic element is embedded in the package structure. A thickness of the package structure is greater than or equal to 1.5 times a thickness of the electronic element.

Abstract: An electronic device including a substrate and a plurality of sub-pixels is disclosed. The plurality of sub-pixels are disposed on the substrate and arranged along a first direction and a second direction, and the first direction is different from the second direction. One of the plurality of sub-pixels has a first width in the first direction and a second width in the second direction, and a ratio of the first width to the second width is greater than 0.66 and less than 1.5.

Abstract: An electronic device has a peripheral region and includes a substrate, a first metal layer, and a protrusion structure. The first metal layer is disposed on the substrate and comprises a first portion and a second portion. The protrusion structure is disposed on the substrate and in the peripheral region. The first portion is not overlapped with the protrusion structure, the second portion is overlapped with the protrusion structure, and an end of the second portion is located in the protrusion structure and higher than the first portion in a normal direction of the substrate.

Abstract: Disclosed is an electronic device including a substrate, a radio frequency (RF) modulation element, a control circuit and a radio frequency (RF) choke. The RF modulation element, the control circuit and the RF choke are disposed on the substrate. The RF choke is electrically coupled between the RF modulation element and the control circuit. The orthographic projections of the RF modulation element, the control circuits and the RF choke on the substrate do not overlap each other.

Abstract: A display system includes a display, a plurality of first sensor devices, and a system chip. The first sensor devices are configured to provide a plurality of detection signals. The system chip is electrically connected to the display and the first sensor devices. The system chip includes an image processor circuit, a central processor circuit, and a timing controller circuit. The image processor circuit is electrically connected to the first sensor devices. The image processor circuit is configured to analyze the detection signals. The central processor circuit is electrically connected to the image processor circuit. The central processor circuit is configured to generate an integrated command according to the analyzed plurality of detection signals. The timing controller circuit is electrically connected to the central processor circuit. The timing controller circuit is configured to drive the display to display an image according to the integrated command.

Abstract: An electronic device includes a substrate, a first insulating layer, a second insulating layer, a first conductive part, and a second conductive part. The substrate includes a peripheral area. The first insulating layer is disposed above the substrate and overlapped with the peripheral area. The second insulating layer is disposed between the first insulating layer and the substrate. The first conductive part is disposed above the first insulating layer and overlapped with the peripheral area. The second conductive part is disposed between the first insulating layer and the second insulating layer and overlapped with the peripheral area. The first conductive part is electrically connected to the second conductive part via a first conductive structure penetrating the first insulating layer.

Abstract: The disclosure relates to an electronic device, including a flexible substrate, a driving structure layer, a display structure layer and a touch layer. The flexible substrate includes an area and a main area adjacent to the area. The driving structure layer is disposed on the flexible substrate. The driving structure layer includes an insulating structure, and the insulating structure includes a plurality of recesses. The display structure layer is disposed on the driving structure layer. The touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the area of the flexible substrate. At least a part of the plurality of recesses is disposed on the area of the flexible substrate.

Abstract: An electronic device including two panels and a light controller is provided. The panels are arranged along a first direction and respectively have a display surface. The light controller is disposed on a side of one of the panels, and the light controller includes a plurality of patterns respectively extending along a second direction. The second direction is different from the first direction, and the first direction and the second direction are perpendicular to a normal direction of the display surface of the one of the two panels.

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Abstract: A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, forming an opening in the transparent region after forming the electric circuit layer, wherein the opening penetrates through a portion of the electric circuit layer, and forming a filling layer on the flexible substrate after forming the opening, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.

Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, a third substrate disposed between the first substrate and the second substrate, an optical media layer disposed between the first substrate and the third substrate, and a first glue disposed between the second substrate and the third substrate. In a cross-sectional view of the electronic device, a sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion, and another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion opposite to the recessed portion.

Abstract: A viewing angle control element and a display module are provided. The viewing angle control element includes a first substrate, a plurality of first spacer units, a plurality of second spacer units, and a second substrate. The plurality of first spacer units are disposed on the first substrate. The plurality of second spacer units are respectively disposed on the plurality of first spacer units. The second substrate is disposed on the plurality of second spacer units. A reflectivity of the plurality of first spacer units is greater than a reflectivity of the plurality of second spacer units.

Abstract: A semiconductor structure including a first epitaxial region, a second epitaxial region, a gate structure, a source region, a source electrode and a drain electrode. The second epitaxial region is disposed on the first epitaxial region. The gate structure is disposed on the second epitaxial region. The source region is disposed on the second epitaxial region and adjacent to the gate structure. The source electrode is disposed on the source region and is electrically connected to the source region. The drain electrode is disposed on the first epitaxial region and is electrically connected to the first epitaxial region. The first epitaxial region includes an impurity region on a side away from the second epitaxial region, and a concentration of impurities included in the impurity region increases with approaching the second epitaxial region.

Abstract: An electronic device of an embodiment of the disclosure includes a first substrate, a second substrate, and a driving layer. The first substrate and the second substrate are disposed opposite to each other, and the driving layer is disposed between the first substrate and the second substrate. The driving layer includes a scan line and a data line. The scan line is disposed on the first substrate and includes a first scan line segment. The first scan line segment has an opening and includes a first branch and a second branch. The first branch and the second branch are located on two opposite sides of the opening and are electrically connected in parallel with each other. The data line is disposed on the first substrate and intersects with the scan line. The electronic device of the embodiment of the disclosure may exhibit ideal display effect.

Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.

Abstract: An electronic device includes a substrate, a circuit layer, a first light emitting unit, a second light emitting unit, and a light conversion layer. The circuit layer is disposed on the substrate. The first and second light emitting units are disposed on the circuit layer and are respectively electrically connected to the circuit layer. The light conversion layer is disposed on the first and second light emitting units and includes a first light conversion unit overlapping the first light emitting unit and a second light conversion unit overlapping the second light emitting unit. The first and second light conversion units correspond to a first color. In a top view, an area of the first light emitting unit is smaller than an area of the second light emitting unit, and an area of the first light conversion unit is the same as an area of the second light conversion unit.

Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

Abstract: An electronic device includes an electronic unit and a circuit structure. The circuit structure is electrically connected to the electronic unit and includes a first circuit structure, a second circuit structure, a bonding pad, and an adjustment layer. The first circuit structure includes at least one first circuit layer and at least one first insulation layer. The second circuit structure is disposed between the electronic unit and the first circuit structure, and includes at least one second circuit layer and at least one second insulation layer. The bonding pad and the adjustment layer are disposed between the second circuit structure and the first circuit structure. A coefficient of thermal expansion of the adjustment layer is smaller than that of at least one of the at least one first insulation layer of the first circuit structure and the at least one second insulation layer of the second circuit structure.

Abstract: An electronic device includes: a non-collimated backlight module; a transparent backlight module disposed on the non-collimated backlight module, wherein the transparent backlight module includes a direct-lit backlight module or an edge-lit backlight module; and a display cell disposed on the transparent backlight module; wherein when in a narrow mode, the non-collimated backlight module is in an off-state, and the transparent backlight module is in an on-state, wherein when in a wide mode, the non-collimated backlight module is in an on-state.