Abstract: An electronic device includes a light emitting device, and the light emitting device emits a light towards a light-emitting direction. The light emitting device includes a substrate, a first light emitting component and a second light emitting component. The first light emitting component is disposed on the substrate, and the first light emitting component includes a first light emitting unit and a first light controlling unit, wherein the first light controlling unit is disposed on the first light emitting unit in the light-emitting direction, and the first light emitting component provides a first light with a first light type. The second light emitting component is disposed on the substrate, and the second light emitting component includes a second light emitting unit, wherein the second light emitting component provides a second light with a second light type, and the first light type is different from the second light type.

Abstract: A method for manufacturing an electronic device is disclosed. The electronic device has a first region and a transparent region. The method includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, forming an opening in the transparent region after forming the electric circuit layer, wherein the opening penetrates through a portion of the electric circuit layer, and forming a filling layer on the flexible substrate after forming the opening, wherein at least a part of the filling layer is formed in the opening to enhance a transmittance of the transparent region.

Abstract: A fastening device including a back plate, a rear cover and an elastic piece is provided. The rear cover is arranged on the back plate and has a protruding portion. The elastic piece is arranged between the back plate and the rear cover. The elastic piece has a first opening, and the protruding portion passes through the first opening, and the first opening is a tooth-shaped structure.

Abstract: An electronic device includes a first curved module and a second curved module. The first curved module includes a first electronic element and a first curved unit. The second curved module is spliced to one side of the first curved module and includes a second electronic element and a second curved unit. The first curved unit and the second curved unit include curved surfaces.

Abstract: An electronic device including a cover and a stretchable sensing unit is provided by the present disclosure. The cover has a curved surface, the curved surface has a first region with a first Gaussian curvature, and the first Gaussian curvature is not equal to zero. The stretchable sensing unit is attached to the cover, wherein the stretchable sensing unit includes a stretchable substrate and a first sensing element disposed on the stretchable substrate. The first sensing element is disposed between the first region of the curved surface and the stretchable substrate.

Abstract: An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; attaching an adhesive member onto the first substrate; and performing a curve attaching step, so that the first substrate and the second substrate are attached to each other through the adhesive member to form a curved composite component, wherein the curve attaching step is performed at a temperature of 20 degrees Celsius to 160 degrees Celsius.

Abstract: An electronic device including an active region and a peripheral region, and includes a substrate including a first edge and a second edge; a first electrode layer disposed on the substrate; a first conductive glue disposed on the substrate and in the peripheral region; a second conductive glue disposed on the substrate and in the peripheral region; an insulating glue overlapped with the first conductive glue and the second conductive glue; and a first metal element fixed on the first electrode layer through the first conductive glue and the insulating glue; wherein in a top view, the insulating glue is disposed in the peripheral region and extends along an extension direction parallel to the first edge, and along the extension direction, a first distance between the first conductive glue and the second edge is greater than a second distance between the second conductive glue and the second edge.

Abstract: An electronic device includes a substrate, a data line, an insulating layer, a metal layer and a transparent conductive layer. The data line is disposed on the substrate. The insulating layer is disposed on the data line. The metal layer is disposed on the insulating layer. The transparent conductive layer is disposed on the metal layer and electrically connected to the metal layer.

Abstract: An electronic device includes: a back plate; an optical film disposed on the back plate; and a support module disposed between the back plate and the optical film, wherein the support module comprises a base and a support unit between the base and the optical film, the base comprises a curved surface away from the back plate, the support unit is connected to an upper surface of the base, and the upper surface comprises the curved surface; wherein a hollow space is enclosed by the base.

Abstract: An electronic device including a light emitting unit and a voltage comparator is provided. The voltage comparator is coupled to the light emitting unit and configured to receive a first voltage and a second voltage. When the first voltage is greater than the second voltage, the voltage comparator outputs a comparison signal having a first voltage level to turn on the light emitting unit. When the first voltage is less than the second voltage, the voltage comparator outputs a comparison signal having a second voltage level to turn off the light emitting unit.

Abstract: The present disclosure provides an electronic device including a substrate, a first pad, an insulating layer, a second pad, a conductive element and a chip. The first pad is disposed on the substrate. The insulating layer is disposed on the first pad and has a plurality of first openings. The second pad is electrically connected to the first pad through the first openings. The conductive particle is disposed on the second pad. The chip is electrically connected to the second pad through the conductive element. In a top view of the electronic device, the first openings are arranged along a long edge of the first pad, and an outline of at least one first opening has a curved shape.

Abstract: The electronic device of the present disclosure includes a redistribution structure, chip units, and a protective layer. The redistribution structure includes alignment marks. The chip units are electrically connected to the redistribution structure, and include a first chip unit and a second chip unit. The protective layer surrounds the first chip unit and the second chip unit. The chip units and the alignment marks are arranged along a direction. The first chip unit is disposed between the first alignment mark and the third alignment mark, and the second chip unit is disposed between the second alignment mark and the fourth alignment mark. The second alignment mark and the third alignment mark are disposed between the first chip unit and the second chip unit. The number of the alignment marks is greater than the number of the chip units.

Abstract: A vehicle optical system in a vehicle is provided. The vehicle optical system is configured to emit an image to a windshield of a vehicle. The vehicle optical system includes a processor, a display device, and a sensor. The display device electrically connects to the processor. The display device includes a display panel and a plurality of light emitting units. The light emitting units are configured to emit a first light to the display panel. The display panel is configured to output a second light having the image. The sensor electrically connects to the processor, and detects an intensity of ambient light. The processor is configured to modulate the display device to adjust the second light based on the intensity of the ambient light.

Abstract: An electronic device includes a substrate, a metal composite structure, a first insulating layer, and a second insulating layer. The metal composite structure is disposed on the substrate and includes a first metal layer. The first metal layer has a first opening. The first insulating layer is disposed on the metal composite structure and has a second opening. The second insulating layer is disposed on the first insulating layer and has a third opening. In a cross section of the electronic device, the first opening has a first distance, the second opening has a second distance, and the third opening has a third distance. The second distance is greater than the third distance, and the third distance is greater than the first distance.

Abstract: An electronic device has a first region, a second region and a third region arranged in sequence along a direction. The electronic device includes a panel and an optical film. The optical film is disposed corresponding to the panel. The optical film includes a first blocking wall, a second blocking wall and a third blocking wall respectively corresponding to the first region, the second region and the third region, and the first blocking wall, the second blocking wall and the third blocking wall are configured to vary gradually in structures.

Abstract: An electronic device includes a substrate, a metal layer, a first dielectric layer, a first conductive circuit, and a driving chip. The metal layer is provided on the substrate and has a first opening. The first dielectric layer is provided on the metal layer. The first conductive circuit is provided on the first dielectric layer. The driving chip is provided on the first dielectric layer and electrically connected to the first conductive circuit. The first opening is adjacent to the driving chip. The first conductive circuit overlaps the first opening. The electronic device of the disclosure may reduce the risk of a short circuit between the conductive circuit and the metal layer below when performing patching, function analysis, or failure analysis.

Abstract: An electronic device emitting an output light includes an optical layer. The electronic device emits the output light under an operation of a highest brightness. The output light has an output spectrum, an intensity integral of the output spectrum from 380 nm to 489 nm is defined as a first intensity integral, and an intensity integral of the output spectrum from 490 nm to 780 nm is defined as a second intensity integral. A ratio of the first intensity integral over the second intensity integral is defined as a first ratio, and the first ratio is greater than 0% and less than or equal to 7.5%.

Abstract: The present disclosure provides an electronic device including a first substrate, a second substrate, a first demultiplexer unit, an integrated circuit chip, a sensor unit and a second demultiplexer unit. The second substrate is overlapped with the first substrate. The first demultiplexer unit is disposed on the first substrate. The integrated circuit chip is disposed on the first substrate and electrically connected to the first demultiplexer unit. The sensor unit is disposed on the second substrate. The second demultiplexer unit is disposed on the second substrate and electrically connected to the sensor unit.

Abstract: An electronic device is provided. The electronic device includes an electronic component and a sensing circuit. The sensing circuit is electrically connected to the electronic component through a sensing node. The sensing circuit comprises a first capacitor, a first transistor, a second transistor, a third transistor and a fourth transistor. The second transistor is electrically connected between the first capacitor and a control terminal of the first transistor. The third transistor is electrically connected to the first transistor. The fourth transistor is electrically connected to the first transistor. The first capacitor is electrically connected between the sensing node and the control terminal of the first transistor.

Abstract: An electronic device includes: a substrate, a signal line, a detection line and a detection unit. The substrate has a peripheral area and a substrate edge. The signal line is disposed on the substrate, and the signal line is located in the peripheral area. The detection line is disposed on the substrate, and is adjacent to the signal line. The detection unit is electrically connected to the detection line. Wherein, the detection line is disposed between the signal line and the substrate edge, and the detection line and the signal line are electrically insulated.