Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a circuit substrate, a plurality of electronic components, a plurality of carriers, and a bonding layer. The circuit substrate includes a circuit layer. The plurality of electronic components are disposed on the circuit substrate. The circuit layer is electrically connected to at least one of the plurality of electronic components. The plurality of carriers are disposed on the circuit substrate. The bonding layer bonds the plurality of carriers to the circuit substrate. At least one gap is between the plurality of carriers. A width of the gap is Wg. An average width of the plurality of carriers is Wa. A width of the circuit substrate is Wc. The electronic device satisfies: Wa*2*10?4<Wg<(Wc?Wa*2).

Abstract: A modulating device is provided. The modulating device includes multiple modulating elements, multiple pixel circuits, and a compensation circuit. The pixel circuits are electrically connected to the modulating elements correspondingly. The compensation circuit includes a driving unit, a voltage source, and a current source. The driving unit provides a driving signal to the pixel circuits. The voltage source is electrically connected to the driving unit. The voltage source provides a constant voltage to the pixel circuits. The current source is electrically connected to the driving unit. The current source provides a constant current to the pixel circuits.

Abstract: Disclosed is a display device including a substrate, a first light-emitting element, a first pixel circuit, a second light-emitting element, a second pixel circuit, and a first scan line. The substrate includes a functional display region and a first display region adjacent to the functional display region in a first direction. The first light-emitting element is disposed on the functional display region. The first pixel circuit is disposed on the first display region and is electrically connected to the first light-emitting element. The second light-emitting element is disposed on the first display region. The second pixel circuit is disposed on the first display region and is electrically connected to the second light-emitting element. The first scan line is electrically connected to the first pixel circuit and the second pixel circuit and extends in a second direction perpendicular to the first direction. An electronic device is also disclosed.

Abstract: Disclosed is a bio sensing device including a medium layer, a light emitting element and an optical sensor. The light emitting element is configured to emit a light toward a user's skin layer, in which the light passes through the medium layer and has a maximum intensity in a first wavelength. The optical sensor is configured to receive a reflected part of the light from the user's skin layer, in which the reflected part of the light passes through the medium layer, and the medium layer has a first transmittance greater than 60% with respect to the first wavelength.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.

Abstract: A sensing device including a substrate, a circuit layer, and a plurality of sensing units is provided. The circuit layer is disposed on the substrate and includes a plurality of driving circuits. The plurality of sensing units are disposed on the circuit layer, and each of the sensing units includes a supporting part and a sensing part. The supporting part is electrically connected to one of the plurality of driving circuits. The sensing part is electrically connected to the supporting part, and the sensing part is separated from a first cavity by the supporting part and the circuit layer. In a normal direction of the substrate, at least a portion of the supporting part is disposed between the circuit layer and the sensing part.

Abstract: An electronic device including an electronic unit and a redistribution layer is disclosed. The electronic unit has connection pads. The redistribution layer is electrically connected to the electronic unit and includes a first insulating layer, a first metal layer and a second insulating layer. The first insulating layer is disposed on the electronic unit and has first openings disposed corresponding to the connection pads. The first metal layer is disposed on the first insulating layer and electrically connected to the electronic unit through the connection pads. The second insulating layer is disposed on the first metal layer. The first insulating layer includes first filler particles, and the second insulating layer includes second filler particles. The first filler particles have a first maximum particle size, the second filler particles have a second maximum particle size, and the second maximum particle size is greater than the first maximum particle size.

Abstract: A modulation device including a plurality of electronic elements, at least one first signal line and a first driving circuit is provided. The at least one first signal line is respectively electrically connected to at least one of the electronic elements. The first driving circuit is electrically connected to the at least one first signal line. The first driving circuit provides a first signal to at least one of the at least one first signal line. The first signal includes a first pulse. The first pulse includes a first section and a second section closely adjacent to the first section.

Abstract: A foldable display device is provided by the present disclosure. The foldable display device includes a foldable display panel and a foldable cover. The foldable cover is adhered to the foldable display panel. The foldable cover includes an inner substrate, an outer substrate and a first adhesive. The first adhesive is disposed between the inner substrate and the outer substrate. A thickness of the first adhesive is ranged from 1 micrometer to 40 micrometers, and a ratio of the sum of the thickness of the first adhesive and a thickness of the inner substrate to a thickness of the foldable cover is greater than or equal to 0.5 and less than 1. In addition, the foldable display device further includes a second adhesive disposed between the foldable display panel and the foldable cover.

Abstract: An electronic device is provided. The electronic device includes a first substrate having a peripheral area, a first inorganic layer disposed on the first substrate, an insulating layer disposed on the first inorganic layer and formed a recess, and a second inorganic layer disposed on the insulating layer and formed in the recess. The recess is disposed in the peripheral area. A thickness of the second inorganic layer is less than a thickness of the insulating layer.

Abstract: An electronic device is provided. The electronic device includes a backboard, a circuit board disposed on the backboard, a light source disposed on the circuit board, a housing disposed on the backboard, and a panel disposed on the housing. The panel contacts the housing, and the light source and the circuit board are disposed between the panel and the backboard.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: An electronic device which is capable of being bent in a first direction and includes a plurality of light-emitting units and a plurality of conductive patterns overlapping with at least a portion of the plurality of light-emitting units and extending in a second direction. The first direction and the second direction have an angle ? of not greater than 30 degrees.

Abstract: A display device configured to be disposed in a vehicle includes a light emitting unit and a light controlling means. The light controlling means is disposed on a route that a light emitted from the light emitting unit moves, and the light is controlled to move at a first angle in a horizontal direction and at a second angle in a vertical direction through the light controlling means. The horizontal direction is defined as a direction parallel to a floor of the vehicle and the vertical direction is defined as a direction perpendicular to the floor of the vehicle. The first angle is greater than the second angle.

Abstract: A display device including a first sub-pixel and a second sub-pixel is provided. The first sub-pixel includes a first light emitting unit and a first wavelength conversion layer disposed thereon. The first sub-pixel provides a first light emitted from the first light emitting unit and converted by the first wavelength conversion layer. The first light includes a first main-peak and a first sub-peak. The second sub-pixel includes a second light emitting unit and a second wavelength conversion layer disposed thereon. The second sub-pixel provides a second light emitted from the second light emitting unit and converted by the second wavelength conversion layer. The second light includes a second main-peak and a second sub-peak. A first wavelength difference between the first main-peak and the second main-peak is less than 20 nm, and the first wavelength difference is less than a second wavelength difference between the first sub-peak and the second sub-peak.

Abstract: An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.