Patents Assigned to Integral Technologies, Inc.
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Publication number: 20190140285Abstract: This invention is a method for making a bipolar plate by selecting at least one resin from the group consisting of acrylonitrile butadiene styrene (ABS), polyphenylsulfone, a polymer resistant to sulfuric acid, and combinations of any thereof. The method may include adding conductive fibers in an amount of from about 20% to about 50% by volume, to the bipolar plate.Type: ApplicationFiled: December 30, 2018Publication date: May 9, 2019Applicant: Integral Technologies Inc.Inventors: Slobodan Pavlovic, Mohamad Zeidan
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Patent number: 9545017Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.Type: GrantFiled: February 18, 2014Date of Patent: January 10, 2017Assignees: Ormet Circuits, Inc., Integral Technology, Inc.Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
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Publication number: 20140322532Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2). A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3). The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2). The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.Type: ApplicationFiled: July 9, 2014Publication date: October 30, 2014Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Thomas AISENBREY
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Publication number: 20140284076Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.Type: ApplicationFiled: June 6, 2014Publication date: September 25, 2014Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: THOMAS AISENBREY
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Publication number: 20140272417Abstract: A method to form moldable capsules of a conductively doped resin-based material are created. A resin-based material is extruded/pultruded onto a bundle of conductive material. The resin-based material and the bundle are sectioned into moldable capsules.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Mo Zeidan
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Publication number: 20140272117Abstract: Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: ApplicationFiled: June 2, 2014Publication date: September 18, 2014Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: THOMAS AISENBREY
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Publication number: 20140246800Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: ApplicationFiled: May 15, 2014Publication date: September 4, 2014Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: THOMAS AISENBREY
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Publication number: 20140231126Abstract: Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.Type: ApplicationFiled: February 18, 2014Publication date: August 21, 2014Applicants: INTEGRAL TECHNOLOGY, INC., ORMET CIRCUITS, INC.Inventors: Christopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
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Publication number: 20140079950Abstract: A moldable capsule includes a conductive element core and a resin-based material radially surrounding the conductive element core. The base resin host may include a single resin-based polymer material. The capsule may have a length of approximately 2-14 millimeters.Type: ApplicationFiled: March 15, 2013Publication date: March 20, 2014Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Publication number: 20130317155Abstract: One or more embodiments contained herein disclose an adhesive for printed circuit board (PCB) applications. The improved adhesive may comprise a benzoxazine resin and a polyester plasticizer.Type: ApplicationFiled: May 21, 2013Publication date: November 28, 2013Applicant: Integral Technology, Inc.Inventors: Christopher A. Hunrath, Khang Tran
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Publication number: 20130130089Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.Type: ApplicationFiled: January 16, 2013Publication date: May 23, 2013Applicant: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Patent number: 8377585Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.Type: GrantFiled: April 13, 2010Date of Patent: February 19, 2013Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Publication number: 20130031774Abstract: Electric motor components are formed of a conductive loaded resin-based, material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: ApplicationFiled: August 10, 2012Publication date: February 7, 2013Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Thomas Aisenbrey
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Publication number: 20120321836Abstract: A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.Type: ApplicationFiled: August 10, 2012Publication date: December 20, 2012Applicant: INTEGRAL TECHNOLOGIES, INC.Inventor: Thomas Aisenbrey
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Patent number: 8268222Abstract: Electric motor components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: GrantFiled: May 12, 2005Date of Patent: September 18, 2012Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Publication number: 20120227258Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.Type: ApplicationFiled: May 22, 2012Publication date: September 13, 2012Applicant: INTEGRAL TECHNOLOGY, INC.Inventor: Christopher A. Hunrath
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Patent number: 8188373Abstract: One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.Type: GrantFiled: December 5, 2008Date of Patent: May 29, 2012Assignee: Integral Technology, Inc.Inventor: Christopher A. Hunrath
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Patent number: 7872405Abstract: Spark plug devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: GrantFiled: April 28, 2007Date of Patent: January 18, 2011Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Patent number: 7829006Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.Type: GrantFiled: June 2, 2005Date of Patent: November 9, 2010Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey
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Patent number: 7829807Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.Type: GrantFiled: September 29, 2006Date of Patent: November 9, 2010Assignee: Integral Technologies, Inc.Inventor: Thomas Aisenbrey