Abstract: A low cost moldable transformer or trans-inductor core, referred to in this description as a transductor. Elements of the transductor core are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductor fibers, micron conductor powders, or in combination thereof homogenized within a base resin host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination thereof to the weight of the base resin host can be between about 0.20 and 0.40. The micron conductive fibers or powders, can be of stainless steel, nickel, copper, silver, carbon, graphite, plated particles, plated fibers, or the like. Transductors can be formed using methods such as injection molding, over-molding, thermo-set, protrusion, extrusion, compression, or the like, in combination with a large number of production or wire wrapping techniques to achieve desired electrical characteristics.

Abstract: A flat panel antenna, monopole or dipole, formed from a conductive loaded resin-based material containing micron conductive powders or micron conductive fibers to provide conductivity. The monopole antenna has an antenna element having an outer periphery with a length equal to an integral multiple of a quarter wavelength of the desired center frequency of the antenna. A bobbin, also formed of the conductive loaded resin-based material, and is attached to the antenna element by connection elements. A coil of conductive wire, having two ends connected to a coaxial cable, is wound around the bobbin. The coaxial cable can deliver power to a radiating antenna or extract power from a receiving antenna. The dipole antenna has first and second antenna elements both formed of conductive loaded resin-based material. The peripheries of the first and second antenna elements have lengths equal to an integral multiple of a quarter wavelength of a first and second frequency.

Abstract: A multi-segmented planar antenna with a built in ground plane and method of forming the antenna are described. The antenna elements are formed on a layer of first dielectric having conducting material on both the first and second sides of the layer of first dielectric, such as a printed circuit board. Antenna elements are formed on both sides of the layer of first dielectric using selective etching of the conducting material. Two antenna elements are generally rectangular separated by a narrow gap and electrically connected by two shorting strips across the gap. Two antenna elements are long and narrow wherein the length of each is an integral multiple of a quarter wavelength of the operating frequencies of the antenna A layer of second dielectric is placed between the layer of first dielectric having the antenna elements and a ground plane. The antenna can be fully encapsulated in a plastic encapsulation material.

Abstract: Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.

Abstract: Electromagnetic absorbing devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Electronic probe devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Moldable capsules of a conductive loaded resin-based material are created. The moldable capsules comprise a conductive element core radially surrounded by a resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive element core comprises between about 20% and about 50% of the total weight of the moldable capsule in one embodiment, between about 20% and about 40% in another embodiment, between about 25% and about 35% in another embodiment, and about 30% in another embodiment. The micron conductive powders are formed from non-metals, that may also be metallic plated, or from metals, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.

Abstract: Electrical connector housings are formed of a conductive loaded resin-based material which provides superior protection from EMI and RFI by absorbing such interfering signals. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination thereof, in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 40% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Devices are formed of a conductive loaded resin-based material with a plated metal layer overlying. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Inductor-capacitor (LC) oscillator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Low cost antennas formed of conductive loaded resin-based materials. The conductive loaded resin-based materials are resins filled with conductive materials to provide a material which is a conductor rather than an insulator or body. The conductive materials comprise a resin-based structural material loaded with micron conductive powders or micron conductive fibers to provide a composite which is a conductor rather than an insulator. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The antennas can be formed using methods such as injection molding, overmolding, or extrusion.

Abstract: Capacitors are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Chip carrier with integrated functions such as antennas, EMI shields, and heat sinks are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Conveyors, chutes, skids, guides, and ways for the transporting of material are formed of a conductive loaded resin-based material such that fragments of these structures can be detected by a metal detector. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders.

Abstract: Key actuators and other switching devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Inductor-capacitor (LC) RF resonator circuits are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Inductors and inductive devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract: Heating devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.